Patent application number | Description | Published |
20100011233 | ADAPTIVE POWER CONTROL - A method for controlling the power used by a computer including the steps of measuring the operating characteristics of a central processor of the computer, determining when the operating characteristics of the central processor are significantly different than required by the operations being conducted, and changing the operating characteristics of the central processor to a level commensurate with the operations being conducted. | 01-14-2010 |
20100231279 | Phase Shift Generating Circuit - A phase shift generation circuit has an edge detector, which receives an input pulse signal and outputs a first and a second edge signal denoting the time of occurrence of the first and second edges of the input pulse signal. The circuit also has a divide by N circuit, which receives a first clock signal and a group of signals representing a number N, and outputs a second clock signal, said a second clock signal having a frequency equal to the frequency of said first clock signal divided by the number N. The circuit further comprises a pulse counter, which receives the first edge signal and the second clock signal, and outputs a group of signals representing the number of the second clock pulses between occurrences of the first edge signal. The circuit has a first recycling timer, which receives the number of second clock pulses, the first edge signal and the first clock signal, and outputs a group of pulses approximating a uniformly spaced group across the time duration of the period of the input pulse. The group is spaced by the number of second clock pulses. The circuit also has a second recycling timer, which receives the number of second clock pulses, the second edge signal and the first clock signal, and outputs a group of pulses approximating a uniformly spaced group across the time duration of the period of the input pulse. The group is spaced by the number of second clock pulses. The circuit also comprises at least one flip flop with set and reset inputs. The set input receives a pulse from the second recycling timer, while the reset input receives a corresponding pulse from the first recycling timer. The flip flop generates a phase shifted output pulse. | 09-16-2010 |
20110107131 | SAVING POWER WHEN IN OR TRANSITIONING TO A STATIC MODE OF A PROCESSOR - A method for reducing power utilized by a processor including the steps of determining that a processor is transitioning from a computing mode to a mode is which system clock to the processor is disabled, and reducing core voltage to the processor to a value sufficient to maintain state during the mode in which system clock is disabled. | 05-05-2011 |
20110219245 | ADAPTIVE POWER CONTROL - A method and system of adaptive power control. Characteristics of a specific integrated circuit are used to adaptively control power of the integrated circuit. | 09-08-2011 |
20130132749 | ADAPTIVE POWER CONTROL - A method for controlling the power used by a computer including the steps of measuring the operating characteristics of a central processor of the computer, determining when the operating characteristics of the central processor are significantly different than required by the operations being conducted, and changing the operating characteristics of the central processor to a level commensurate with the operations being conducted. | 05-23-2013 |
20140035646 | Phase Shift Generating Circuit - A phase shift generation circuit has an edge detector for generating first and second edge signals indicating first and second edges of an input pulse signal. The circuit comprises a divide by N circuit that divides the frequency of a first clock signal by N. The circuit comprises a pulse counter, which receives the first edge signal and the second clock signal, and outputs a group of signals representing the number of the second clock pulses between occurrences of the first edge signal. The circuit has a first recycling timer that outputs a group of pulses as a uniformly spaced group across the period of the input pulse. The circuit also has a second recycling timer that outputs a group of pulses as a uniformly spaced group across the period of the input pulse. The first and second recycling timers are used to generate a phase shifted output pulse. | 02-06-2014 |
Patent application number | Description | Published |
20120071246 | SYSTEMS AND METHODS FOR SIMULATING A PARTICULAR USER IN AN INTERACTIVE COMPUTER SYSTEM - Systems and methods for simulating a user's behavior in an interactive computer system are provided. For example, a computer program product includes a simulator configured to simulate a user interacting with a computer program. The simulator includes a learning mode of operation and a simulation mode of operation. During the learning mode, for example, the simulator is configured to monitor the user's interaction with the computer program for one or more events and analyze one or more current circumstances during the occurrence of the one or more events, and further, to record at least one user input in response to the occurrence of at least one event, store the at least one user inputs in at least one data field, and associate the at least one data field with the at least one events and the at least one current circumstances. | 03-22-2012 |
20130005415 | SYSTEMS AND METHODS FOR SIMULATING A PARTICULAR USER IN AN INTERACTIVE COMPUTER SYSTEM - An interactive computer system and method for simulating a user's avatar behavior is provided. In an embodiment, a computer program product includes a simulator configured to simulate a user interactive with a computer program. The simulator includes a learning mode of operation and a simulation mode of operation. During the learning mode, the simulator monitors the user's interaction with the computer program for one or more events, and analyzes one or more current circumstances during the occurrence of one or more events. The simulator records one or more user inputs in response to the occurrence of the one or more events, stores the one or more user inputs in one or more data fields, and associates the one or more data fields with the one or more events and the one or more current circumstances. | 01-03-2013 |
20140200059 | SYSTEMS AND METHODS FOR SIMULATING A PARTICULAR USER IN AN INTERACTIVE COMPUTER SYSTEM - Systems and methods for simulating a user's behavior in an interactive computer system are provided. For example, a computer program product includes a simulator configured to simulate a user interacting with a computer program. The simulator includes a learning mode of operation and a simulation mode of operation. During the learning mode, for example, the simulator is configured to monitor the user's interaction with the computer program for one or more events and analyze one or more current circumstances during the occurrence of the one or more events, and further, to record at least one user input in response to the occurrence of at least one event, store the at least one user inputs in at least one data field, and associate the at least one data field with the at least one events and the at least one current circumstances. | 07-17-2014 |
20150057086 | SYSTEMS AND METHODS FOR SIMULATING A PARTICULAR USER IN AN INTERACTIVE COMPUTER SYSTEM - The field of the invention relates to interactive computer systems and more particularly to systems and methods for simulating a particular user's behavior in an interactive computer system. In one embodiment, a computer program product includes a simulator configured to simulate a user interacting with a computer program. The simulator includes a learning mode of operation and a simulation mode of operation. During the learning mode, the simulator is configured to monitor the user's interaction with the computer program for one or more events and analyze one or more current circumstances during the occurrence of the one or more events. The simulator is further configured to record one or more user inputs in response to the occurrence of the one or more events, store the one or more user inputs in one or more data fields, and associate the one or more data fields with the one or more events and the one or more current circumstances. During the simulation mode of operation, the simulator is configured to monitor the computer program for the one or more particular events, retrieve the one or more data fields associated with the one or more particular events, analyze one or more current circumstances upon the occurrence of the one or more particular events, and invoke one or more simulated inputs based on the value of the one or more data fields in response to the occurrence of the one or more events and the one or more current circumstances. | 02-26-2015 |
Patent application number | Description | Published |
20100195261 | CAPACITORS USING PREFORMED DIELECTRIC - Devices for storing energy at a high density are described. The devices include an electrode preformed to present a high exposed area onto which a dielectric is formed. The dielectric material has a high dielectric constant (high relative permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density. | 08-05-2010 |
20100195263 | CAPACITORS USING CARBON-BASED EXTENSIONS - Devices for storing energy at a high density are described. The devices include carbon-containing extensions which increase the surface area between a dielectric material and one or both of the electrodes. The dielectric material may have a high dielectric constant (high permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density. | 08-05-2010 |
20100226066 | CAPACITORS USING PREFORMED DIELECTRIC - Devices for storing energy at a high density are described. The devices include a solid dielectric that is preformed to present a high exposed area onto which an electrode is formed. The dielectric material has a high dielectric constant (high relative permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density. | 09-09-2010 |
20130170097 | YTTRIA-STABILIZED ZIRCONIA BASED CAPACITOR - Devices and methods for storing energy at a high density are described. In some embodiments, the devices include a first electrode and a second electrode containing a transition metal oxide. A solid electrolyte having yttria-stabilized zirconia (YSZ) is located between the first and second electrode. The thickness of the electrolyte located between the two electrodes is less than one micrometer. | 07-04-2013 |
20150044415 | Articles of Cellulose and Methods of Forming Same - The present invention follows from a number of recent discoveries relating to cellulose fibrils and crystals. Unique properties of these compositions provide for novel structural materials that exhibit extremely high strength per unit of mass. Structures and articles first taught herein may be formed by computer numerically controlled processing, extruding, molding, shearing, weaving, and various additive manufacturing techniques, as well as by other more traditional procedures. These structures and articles may be used as a skin or core in composite constructions. These structures and articles can be used as free standing shells or panels. They may be made into intricate forms, particularly in three spatial dimensions with sonic elements in tension and some elements in compression to realize high performance functionalities. Cellulose matter is a dominate part of these compositions, making the articles fully biodegradable. One can make entirely renewable and nontoxic products depending on the presence of necessary additives. | 02-12-2015 |
Patent application number | Description | Published |
20130070371 | SILVER ALLOY ELECTRICAL LAPPING GUIDES (ELGs) FOR FABRICATION OF DISK DRIVE SLIDERS WITH MAGNETORESISTIVE SENSORS - An electrical lapping guide (ELG) for the fabrication of an air-bearing slider used in a magnetic recording disk drive is formed of a different material than the magnetoresistive (MR) read head or sensor so as to have both a high electrical resistivity and a substantially higher etch rate. When the ELG and MR sensor are etched simultaneously to form their respective back edges, the ELG will have a sharp well-defined non-tapered wall at the back edge. The ELG has a film thickness close to but generally thinner than that of the MR sensor, and a sheet resistance to generally match the resistance measurement capability of the lapping tool. The preferred material for the ELG is an alloy comprising silver (Ag) and one or more of Sn, Ge and zinc Zn. | 03-21-2013 |
20130236639 | METHOD FOR MAKING A CURRENT-PERPENDICULAR-TO-THE-PLANE (CPP) MAGNETORESISTIVE SENSOR CONTAINING A FERROMAGNETIC ALLOY REQUIRING POST-DEPOSITION ANNEALING - A method for making a current-perpendicular-to the-plane giant magnetoresistance (CPP-GMR) sensor with a Heusler alloy pinned layer on the sensor's Mn-containing antiferromagnetic pinning layer uses two annealing steps. A layer of a crystalline non-Heusler alloy ferromagnetic material, like Co or CoFe, is deposited on the antiferromagnetic pinning layer and a layer of an amorphous X-containing ferromagnetic alloy, like a CoFeBTa layer, is deposited on the Co or CoFe crystalline layer. After a first in-situ annealing of the amorphous X-containing ferromagnetic alloy, the Heusler alloy pinned layer is deposited on the amorphous X-containing ferromagnetic layer and a second high-temperature annealing step is performed to improve the microstructure of the Heusler alloy pinned layer. | 09-12-2013 |
20150098153 | GIANT MAGNETO RESISTIVE SENSOR AND METHOD FOR MAKING SAME - A disk drive includes a disk including a magnetizable layer of material, and a transducer. The transducer has a read element that includes a first shield layer, a pinned layer, a metallic spacer, an AP (anti-parallel) free layer, and a second shield layer. The pinned layer has a surface area which is greater than the area of the AP free layer. The read element also includes an anti-ferromagnetic layer for substantially fixing the magnetic orientation of a plurality of domains in the pinned layer. The ferromagnetic layer is adjacent the pinned layer. The pinned layer, and the anti-ferromagnetic layer both have surface areas which are greater than the area associated with the AP free layer. The anti-ferromagnetic layer, in one embodiment, has a pinning strength in the range of 0.5 erg/cm | 04-09-2015 |
20150116867 | CURRENT-PERPENDICULAR-TO-THE-PLANE (CPP) MAGNETORESISTIVE (MR) SENSOR HAVING AN ANTIPARALLEL FREE (APF) STRUCTURE WITH IMPROVED MAGNETIC STABILITY - A current-perpendicular-to-the-plane magnetoresistive sensor has an antiparallel free (APF) structure and soft side shields wherein the upper free layer (FL2) of the APF structure is magnetically coupled antiparallel to the top shield and a top shield seed layer via a nonmagnetic antiparallel coupling (APC) layer. In one embodiment the antiparallel coupling is through an antiferromagnetic-coupling (AFC) layer that provides a dominant antiferromagnetic indirect exchange coupling of FL2 to the top shield. In another embodiment the antiparallel coupling is by an APC layer that decouples FL2 and the top shield and causes the edge-induced magnetostatic coupling between FL2 and the seed layer to dominate. The degree of coupling is controlled by the composition and thickness of the nonmagnetic APC layer between FL2 and the seed layer, and by the thickness of the seed layer. | 04-30-2015 |
Patent application number | Description | Published |
20110084368 | OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 04-14-2011 |
20120137514 | METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 06-07-2012 |
20120146178 | OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 06-14-2012 |
Patent application number | Description | Published |
20130021219 | RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS - Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement. | 01-24-2013 |
20130323408 | SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR INTEGRATED CIRCUIT MODULES - Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules. | 12-05-2013 |
20130323409 | SYSTEMS AND METHODS FOR CONTROLLING ELECTROMAGNETIC INTERFERENCE FOR INTEGRATED CIRCUIT MODULES - Systems and methods disclose reduction of conductive paint overspray while maintaining paint thickness uniformity over the perimeter of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern reduces paint waste and achieves edge uniformity. The reduction in paint overspray reduces paint waste, which in turn, reduces production costs. With the reduced amount of paint needed for coating a panel, the cost per unit can be significantly reduced. | 12-05-2013 |
20130324069 | VIA DENSITY AND PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data. | 12-05-2013 |
20130335288 | SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER - Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s). | 12-19-2013 |
20140002188 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS | 01-02-2014 |
20140016277 | RACETRACK DESIGN IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area. | 01-16-2014 |
20140070022 | SYSTEMS, DEVICES AND METHODS RELATED TO SPRAY-PAINTING FLUID PATH FOR MANUFACTURE OF RADIO-FREQUENCY MODULES - During fabrication of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to reduce the likelihood of accumulation of metal particles along various paths. A closed recirculation system can be provided to yield such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the spray apparatus can be implemented so as to have reduced dimensions, and include a mechanism for switching between a spray mode and a recirculate mode. Such a spray apparatus can reduce the amount of paint being utilized, and also reduce accumulation of metal particles in the spray apparatus. | 03-13-2014 |
20140072705 | SYSTEMS, DEVICES AND METHODS RELATED TO PAINT RECIRCULATION DURING MANUFACTURE OF RADIO-FREQUENCY MODULES - In applications such as manufacture of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to maintain an acceptable level of suspension of paint particles in solution. A closed recirculation system can be configured to provide such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the recirculator can include a compact peristaltic pump that allows use of shorter fluid paths in the closed recirculation system, as well as a desired level of agitation to quickly achieve the acceptable level of suspension and maintain the suspension for an extended period of time. | 03-13-2014 |
20140083459 | SYSTEMS AND METHODS RELATED TO CLEANING DURING MANUFACTURE OF RADIO-FREQUENCY MODULES - Disclosed are systems and methods related to cleaning during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel. At one or more stages, it can be desirable to perform cleaning operations for such panels. In some embodiments, a cleaning system can include a first belt transport apparatus configured to support a first surface of the panel and move the panel during a cleaning process. The cleaning system can further include a second belt transport apparatus configured to engage a second surface of the panel to keep the panel on the first belt transport apparatus during the cleaning process. At least the second belt transport apparatus can include a mesh, with the mesh having a coating configured to reduce the likelihood of damage to the second surface of the panel and to provide desired electrostatic discharge protection for the panel. | 03-27-2014 |
20140087633 | SYSTEMS AND METHODS RELATED TO ABLATION DURING MANUFACTURE OF RADIO-FREQUENCY MODULES - Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel. In some situations, it can be desirable to remove a portion of an upper surface of the overmold to, for example, better expose upper portions of shielding wirebonds. In some embodiments, an ablation system can include a blasting apparatus configured to provide a stream of ablating particles to a blasting region. A first transport section that moves a panel through the blasting region can be separate from a second transport section that feeds or removes the panel to or from the first transport section. Such a configuration can substantially isolate the second transport section from the stream of ablating particles. | 03-27-2014 |
20140166770 | DEVICES AND METHODS RELATED TO PAINT MIST COLLECTION DURING MANUFACTURE OF RADIO-FREQUENCY MODULES - Disclosed are systems, devices and methods related to paint mist collection during manufacture of packaged radio-frequency (RF) modules. In some embodiments, a mist-collection system can be implemented, where the system includes a platform configured to support a panel having an array of RF modules formed thereon. The system can further include a mist-collector positioned relative to the platform, with the mist-collector having an input in communication with an output. The mist-collector can be configured to provide suction at a region along one or more sides of the platform to thereby capture at least some of a paint mist generated during the paint-spraying process through the input. The system can further include a pump in communication with the mist-collector to provide the suction. | 06-19-2014 |
20140175621 | SYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices. | 06-26-2014 |
20140175622 | SEGMENTED CONDUCTIVE TOP LAYER FOR RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation. | 06-26-2014 |
20140307394 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection. | 10-16-2014 |
20150126139 | VIA PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data. | 05-07-2015 |