Radigan
James Radigan, Sammamish, WA US
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20100325608 | GENERATION OF PARALLEL CODE REPRESENTATIONS - A generated grouped representation of existing source code can define regions of the existing source code. A set of the regions that can run in parallel can be identified based on the grouped representation. The grouped representation can be converted into a modified representation, such as modified source code or a modified intermediate compiler representation, which can be configured to be resolved or executed to self-schedule the set of regions to run in parallel as a set of tasks. Additionally, the source code can include one or more exception handling routines, and user input can be received to identify in one or more lambda expressions one or more regions of the source code to be run in parallel as one or more tasks. | 12-23-2010 |
James J. Radigan, Sammamish, WA US
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20160092183 | Compiler Caching for Runtime Routine Redundancy Tracking - A compiler-created cache contains target addresses of multiple indirect routine call sites. Ordinals assigned to indirect routine call sites are used to hardcoded offsets into the cache. Ordinals may be computed using a routine counter and an indirect call site counter. At runtime a target address of an indirect routine call site is compared to an entry in the cache using the hardcoded offset for efficiency. If the target address matches the cache entry, then a redundant call is avoided; otherwise, the call is not redundant, and the cache is updated. The call tested for redundancy may be a security check for malware, or a computationally expensive routine which calculates a return value without any side effects. Stack pointer validity may be checked. The cache may be guarded with code for trustworthy computing. Tail merging may be performed. | 03-31-2016 |
James Patrick Radigan, Phoenix, AZ US
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20110167531 | Goggle Attachment System With a Tail for a Helmet - A protective goggle assembly includes a protective goggle having two side straps, each side strap comprises a free end and a first surface attachment region adjacent to the free end on at least one surface of each side strap; and a strap assembly that encircles the user's head, on each side of the strap assembly a second surface attachment region is provided that is configured to engage the first surface attachment region of the side straps. Free ends of the base band of the strap assembly are connected to an elastic ring to form a complete encircling band. The base band has a tail for securing the base band in position on a helmet. The complete encircling band is configured to fit around a soldier's helmet and the elastic ring being configured to fit over and around a night vision goggle mount at a front of the helmet. | 07-14-2011 |
20110265237 | Eyewear Attachment System For A Helmet - An eyewear attachment system for a military helmet is provided having an auxiliary adapter with a width and a length spanning between a first end and a second end. The auxiliary adapter has an eyelet with an open center portion at the first end configured to receive an anchor member of a first connector therethrough to secure the auxiliary adapter to a helmet wherein the first connector is free to connect with a primary eyewear strap. The auxiliary adapter has an auxiliary connector at the second end configured to connect with a strap of a secondary eyewear, such as a goggle. The auxiliary adapter is pivotable about the anchor to accommodate a connection between the auxiliary adapter and a secondary eyewear strap. | 11-03-2011 |
Kevin P. Radigan, Burnt Hills, NY US
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20130081258 | TWO-PHASE, WATER-BASED IMMERSION-COOLING APPARATUS WITH PASSIVE DEIONIZATION - Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment. | 04-04-2013 |
20130097862 | DRY-COOLING UNIT WITH GRAVITY-ASSISTED COOLANT FLOW - A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure. | 04-25-2013 |
Kevin P. Radigan US
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20140085823 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140146468 | IMMERSION-COOLED AND CONDUCTION-COOLED METHOD FOR ELECTRONIC SYSTEM - A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component. | 05-29-2014 |
Kevin P. Radigan, Albany, NY US
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20140124189 | COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES - A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position. | 05-08-2014 |
Steve Radigan, Fremont, CA US
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20140248763 | Vertical Bit Line Non-Volatile Memory Systems And Methods Of Fabrication - Three-dimensional (3D) non-volatile memory arrays having a vertically-oriented thin film transistor (TFT) select device and methods of fabricating such a memory are described. The vertically-oriented TFT may be used as a vertical bit line selection device to couple a global bit line to a vertical bit line. A select device pillar includes a body and upper and lower source/drain regions. At least one gate is separated horizontally from the select device pillar by a gate dielectric. The gates overlie the global bit lines with one or more insulating layers therebetween to provide adequate isolation between the gates and the global bit lines. Processes for fabricating the vertical TFT select devices utilize a gate dielectric and optional dielectric bases to provide isolation between the gates and bit lines. | 09-04-2014 |
20160064222 | Vertical Bit Line Non-Volatile Memory Systems And Methods Of Fabrication - Three-dimensional (3D) non-volatile memory arrays having a vertically-oriented thin film transistor (TFT) select device and methods of fabricating such a memory are described. The vertically-oriented TFT may be used as a vertical bit line selection device to couple a global bit line to a vertical bit line. A select device pillar includes a body and upper and lower source/drain regions. At least one gate is separated horizontally from the select device pillar by a gate dielectric. The gates overlie the global bit lines with one or more insulating layers therebetween to provide adequate isolation between the gates and the global bit lines. Processes for fabricating the vertical TFT select devices utilize a gate dielectric and optional dielectric bases to provide isolation between the gates and bit lines. | 03-03-2016 |
Steven Radigan, Fremont, CA US
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20090323385 | Method for fabricating high density pillar structures by double patterning using positive photoresist - A method of making a semiconductor device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer into a first photoresist pattern, wherein the first photoresist pattern comprises a plurality of spaced apart first photoresist features located over the underlying layer, and etching the underlying layer using the first photoresist pattern as a mask to form a plurality of first spaced apart features. The method further includes removing the first photoresist pattern, forming a second photoresist layer over the plurality of first spaced apart features, and patterning the second photoresist layer into a second photoresist pattern, wherein the second photoresist pattern comprises a plurality of second photoresist features covering edge portions of the plurality of first spaced apart features. The method also includes etching exposed portions of the plurality of first spaced apart features using the second photoresist pattern as a mask, such that a plurality of spaced apart edge portions of the plurality of first spaced apart features remain, and removing the second photoresist pattern. | 12-31-2009 |
20100219510 | METHOD FOR FABRICATING HIGH DENSITY PILLAR STRUCTURES BY DOUBLE PATTERNING USING POSITIVE PHOTORESIST - A method of making a semiconductor device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer into a first photoresist pattern, wherein the first photoresist pattern comprises a plurality of spaced apart first photoresist features located over the underlying layer, and etching the underlying layer using the first photoresist pattern as a mask to form a plurality of first spaced apart features. The method further includes removing the first photoresist pattern, forming a second photoresist layer over the plurality of first spaced apart features, and patterning the second photoresist layer into a second photoresist pattern, wherein the second photoresist pattern comprises a plurality of second photoresist features covering edge portions of the plurality of first spaced apart features. The method also includes etching exposed portions of the plurality of first spaced apart features using the second photoresist pattern as a mask, such that a plurality of spaced apart edge portions of the plurality of first spaced apart features remain, and removing the second photoresist pattern. | 09-02-2010 |
20110171809 | METHOD FOR FABRICATING HIGH DENSITY PILLAR STRUCTURES BY DOUBLE PATTERNING USING POSITIVE PHOTORESIST - A method of making a semiconductor device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer into a first photoresist pattern, wherein the first photoresist pattern comprises a plurality of spaced apart first photoresist features located over the underlying layer, and etching the underlying layer using the first photoresist pattern as a mask to form a plurality of first spaced apart features. The method further includes removing the first photoresist pattern, forming a second photoresist layer over the plurality of first spaced apart features, and patterning the second photoresist layer into a second photoresist pattern, wherein the second photoresist pattern comprises a plurality of second photoresist features covering edge portions of the plurality of first spaced apart features. The method also includes etching exposed portions of the plurality of first spaced apart features using the second photoresist pattern as a mask, such that a plurality of spaced apart edge portions of the plurality of first spaced apart features remain, and removing the second photoresist pattern. | 07-14-2011 |
William Radigan, Albuquerque, NM US
Patent application number | Description | Published |
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20100113899 | Alignment System for Optically Sampling a Hand - This invention relates to measurements of material properties by determination of the response of a sample to incident radiation, and more specifically to the measurement of analytes such as glucose or alcohol in human tissue. Some example embodiments of the present invention provide an optical sampling apparatus including an optical subsystem, having a receiver for receiving light expressed from tissue; and an alignment subsystem, adapted to urge a portion of a hand placed in operative relationship with the alignment subsystem into a defined configuration relative to the receiver. In some such example embodiments, the alignment subsystem includes a substrate having a plurality of projections therefrom disposed in a pattern such that the projections urge a portion of a hand placed on the substrate to a defined configuration relative to the receiver. In some such example embodiments, the alignment subsystem includes a substrate having a surface defining a volume approximating the shape of a portion of a hand such that the volume urges a portion of a hand placed therein to a defined configuration relative to the receiver. In some such example embodiments, the alignment subsystem includes a surface having a generally U-shaped cross-section and extending for a distance, wherein the surface is mounted relative to the sampling means such that a finger placed in the U-shaped cross-section of the surface is urged to a defined configuration relative to the receiver. In some such sample embodiments, the alignment subsystem is customized to portion of the hand of a specific individual. | 05-06-2010 |
20100160747 | SELECTION OF PREFERRED SAMPLING LOCATION ON HAND VIA MINIMIZATION OF SAMPLING ERROR, AND OPTICAL ALIGNMENT FOR REPEATABLY SAMPLING TISSUE - The present invention relates to measurements of material properties by determination of the response of a sample to incident radiation, and more specifically to the measurement of analytes such as glucose or alcohol in human tissue. The invention is particularly useful in connection with noncontact optical sampling of skin. Some example embodiments of the invention provide for selection of preferred sampling locations responsive to optically-determined characteristics of the tissue. Some example embodiments of the invention provide for precise and repeatable alignment of the tissue based on optically-determined characteristics of the tissue. | 06-24-2010 |