Patent application number | Description | Published |
20100213958 | SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE - This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate. | 08-26-2010 |
20100226101 | Multi-Part Substrate Assemblies for Low Profile Portable Electronic Devices - Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact. | 09-09-2010 |
20100246143 | Electromagnetic Interference Shielding for Compact Electronic Devices - Improved approaches for providing electromagnetic interference shielding to one or more electrical components within a housing of a portable electronic device are disclosed. According to one aspect of certain embodiments, an electromagnetic shield can be attached to one or more edges of a substrate (e.g., printed circuit board) provided within a housing of a portable electronic device. Advantageously, this allows the substrate space to be efficiently utilized such that relatively wide electrical components can be provided on the substrate without having to further increase the width of the substrate to provide space for an EMI shielding structure and its attachment to the substrate. The housing of the portable electronic device can be compact, such as a low profile housing. | 09-30-2010 |
20110013373 | SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT - This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity. | 01-20-2011 |
20120075817 | MULTI-PART SUBSTRATE ASSEMBLIES FOR LOW PROFILE PORTABLE ELECTRONIC DEVICES - Multi-part substrate arrangements that yield low profile configurations are disclosed. One aspect pertains to portable electronic devices are able to have low profiles through use of multi-part substrate arrangements. Another aspect pertains to methods for assembling two or more separate substrates into a multi-part substrate. By use of multi-part substrate arrangements according to the invention, portable electronic devices are able to be thinner and more compact. | 03-29-2012 |
20130063914 | SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT - This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity. | 03-14-2013 |
20130141861 | SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE - This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate. | 06-06-2013 |
20140055969 | BOARD ASSEMBLIES WITH MINIMIZED WARPAGE AND SYSTEMS AND METHODS FOR MAKING THE SAME - Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of the board and by selectively copper flooding certain regions of the board. Pre-conditioning of the board may assist in preventing board warpage. A reflow fixture may fix a board during solder pasting and reflow processing thereof. After reflow, an underfill fixture may fix the board during underfill processing. Each of these fixtures may include respective clamp members that may hold various portions of the board to correct and/or prevent warpage of the board. | 02-27-2014 |
Patent application number | Description | Published |
20110255250 | PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES - Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards. | 10-20-2011 |
20110255850 | ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES - Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can. | 10-20-2011 |
20120140423 | Printed Circuit Board With Integral Radio-Frequency Shields - Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces. | 06-07-2012 |
20130125392 | Mounting of Components Using Solder Paste Fiducials - A printed circuit board may have patterned traces. Components may be mounted to the printed circuit board using solder. Solder paste may be printed onto the printed circuit board using a stencil. Following reflow operations, the solder paste may form solder bumps that connect component leads to traces on the printed circuit board. Misalignment between the mounted components and printed circuit board traces can be minimized by forming fiducials from solder paste. During the process of printing solder paste patterns on the printed circuit board, solder paste printing equipment may form the solder paste fiducials. Component mounting equipment may use cameras or other imaging equipment to gather information on the location of the solder paste fiducials. The component mounting equipment may then mount the components on the printed circuit using the information on the location of the solder paste fiducials. | 05-23-2013 |
20130201615 | THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES - Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers. | 08-08-2013 |
20130201616 | THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES - Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components. | 08-08-2013 |
20140008110 | PCB MANUFACTURING PROCESS AND STRUCTURE - The described embodiment relates generally to the field of PCB fabrication. More specifically conductive spheres are used in a bonding sheet to enable inter-layer communication in a multi-layer printed circuit board (PCB). The conductive spheres in the bonding sheet can be used in place of or in conjunction with conventional electroplated vias. This allows the following advantages in multi-layer PCB fabrication: dielectric substrate layers made of varying types of material; PCBs with higher resilience to stress and shock; and PCBs that are more flexible. | 01-09-2014 |
20140028518 | Antenna Structures and Shield Layers on Packaged Wireless Circuits - An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures. | 01-30-2014 |
20140085850 | Printed circuit board with compact groups of devices - Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted. | 03-27-2014 |
20140134760 | DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT BOARDS - Methods and devices for embedding semiconductors in printed circuit boards (PCBs) are provided. In one example, a method of manufacturing a PCB having a die assembly embedded therein includes removing a release film from an adhesive layer of the die assembly. The method also includes disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB. The method includes disposing a second layer of the PCB over the first layer such that the die assembly is within an intermediate portion between the first layer and the second layer. The method also includes filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin. | 05-15-2014 |
20140146495 | Printed Circuit Board With Integral Radio-Frequency Shields - Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces. | 05-29-2014 |
20140308465 | Liquid-Based Pressure Sensitive Adhesive for Grounding Applications - An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths. | 10-16-2014 |
20150131245 | CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCUIT BOARDS - Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed. | 05-14-2015 |
20150359099 | LOW AREA OVER-HEAD CONNECTIVITY SOLUTIONS TO SIP MODULE - Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins to form interconnect paths between a module and other components. | 12-10-2015 |
20150364253 | HEEL FILLET CAPACITOR WITH NOISE REDUCTION - Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component. | 12-17-2015 |
Patent application number | Description | Published |
20090193865 | Guided keeper assembly and method for metal forming dies - A guided keeper assembly and method for metal forming dies includes a base having a mounting face, a connector portion and a central aperture. A guide pin has a cylindrical center portion closely received in the central aperture of the base for reciprocation, an enlarged first end with an alignment member, and an outwardly opening circumferential groove. A retainer ring is removably mounted in and protrudes radially outwardly of the groove to securely, yet detachably, retain the base on the guide pin between the enlarged head and the retainer ring in an assembled condition to facilitate transport and mounting of the guided keeper assembly. | 08-06-2009 |
20090193951 | Modular spring retainer and method for metal forming dies and the like - A modular spring retainer and method for metal forming dies includes a base shaped for detachable connection with an associated die plate, having a threaded central aperture, and an adjacent lock dowel aperture which extends through the threaded central aperture to form a window. A cylindrically-shaped spring retainer is configured to receive a spring therein, and has a threaded exterior portion which engages the threaded central aperture of the base, such that mutual rotation of the same adjusts the longitudinal position of the spring. A locking dowel is closely received in the lock dowel aperture in the base, and has an unthreaded exterior surface which protrudes through the window and abuttingly engages an adjacent portion of the threaded exterior surface of the spring retainer to securely, yet detachably, retain the spring member in a selected longitudinal position. | 08-06-2009 |
20100199743 | GUIDED KEEPER ASSEMBLY AND METHOD FOR METAL FORMING DIES - A guided keeper assembly and method for metal forming dies includes a base having a flat mounting face and at least one marginal fastener aperture to detachably mount the base to an associated die shoe, as well as a central guide aperture. The assembly also includes a guide pin having a central portion closely received in the central guide aperture of the base for precisely guiding reciprocal motion between the die pad and an associated die shoe. The guide pin has an enlarged head at a first end thereof which abuts the mounting face of the base to positively limit travel between the die shoe and the die pad, and a shoulder at the opposite or second end thereof with an alignment mechanism that precisely locates the second end of the guide pin on the die pad. A first fastener extends through the marginal fastener aperture in the base to securely, yet detachably, connect the same with the die shoe. A second fastener securely, yet detachably, connects the second end of the guide pin with the die pad. | 08-12-2010 |
20110296893 | TWO-PIECE GUIDE PIN AND METHOD - A two-piece guide pin for metal forming dies includes a guide pin body formed from a cut length of an elongate, solid bar of stock having a cylindrical shape and a hard and smooth finished exterior surface with an outside diameter selected for close reception and reciprocal motion in an associated die bore. An alignment member is formed on a first end of the guide pin body. A guide pin head is formed from a cut length of an elongate, solid bar of stock having an outside diameter that is substantially greater than that of the guide pin body, and is rigidly connected with the second end of the guide pin body in a generally concentric relationship to define an enlarged head that positively limits travel between an associated die shoe and die pad. | 12-08-2011 |
20110302988 | GUIDED KEEPER AND METHOD FOR METAL FORMING DIES - A guided keeper assembly and method for metal forming dies includes a base having a mounting face, at least one marginal fastener aperture to detachably mount the base to an associated die shoe, and a central guide aperture. A guide pin with a cylindrically shaped body portion is closely received in the central aperture of the base. A first end of the guide pin has an enlarged head to positively limit travel between the die shoe and die pad, and an opposite second end with a generally flat terminal shoulder configured for close reception in a blind hole in the die pad. The shoulder has a fastener aperture extending perpendicularly therethrough at a location spaced radially offset from the central axis of the guide pin. A fastener extends through the fastener aperture in the die pad and engages in the fastener aperture in the second end of the guide pin to securely, yet detachably, connect the second end portion of the guide pin with the die pad and positively prevent the guide pin from rotating axially relative to the die pad. | 12-15-2011 |
20120055224 | GUIDED KEEPER AND METHOD FOR METAL FORMING DIES - A guided keeper and method for metal forming dies includes a base with a head portion and an opposite externally threaded mounting portion received in a mating die aperture. A scalloped shoulder portion with arc-shaped notches is located axially between the head and the mounting portions of the base, and a retainer ring groove is located axially between the head and the scalloped shoulder portion of the base. A cap screw is retained in the die, and has a cylindrical head received in one of the arc-shaped notches in the base to retain the base in place. A retainer ring is mounted in the ring groove in the base and retains the cap screw in place. | 03-08-2012 |
20120055226 | GUIDED KEEPER AND METHOD FOR METAL FORMING DIES - A locking collar assembly for metal forming dies includes a disc-shaped locking collar with a cylindrical outer surface closely received in a collar bore in one face of a first die member. A circular recess in the outer face of the locking collar has an internal retainer ring groove. A counter bore shaped fastener hole extends through the collar and a part of the recess, and has shank, head and shoulder portions. A socket head cap screw is inserted in the fastener hole with a threaded end anchored in a threaded end aperture in one of the guide pins, with the head seated on the shoulder of the fastener hole. A retainer ring is mounted in the collar ring groove and overlies the cap screw head to positively prevent the cap screw from unintentionally unfastening from the guide pin. | 03-08-2012 |
20120151984 | GAS SPRING MOUNTING ASSEMBLY AND METHOD FOR METAL FORMING DIES - A gas spring mount and related method for metal forming dies includes a one-piece, generally U-shaped clamping band with an arcuate medial portion shaped to receive an associated gas spring body therein, and two enlarged ends with through apertures. Threaded mounting screws extend through the through apertures in the clamping band ends, and are anchored into threaded retainer holes in an associated die member. At least one of the mounting screws has a tapered head and is disposed laterally offset from the associated threaded retainer hole in the die, whereby tightening of the one screw shifts the related enlarged end of the mounting band laterally toward the opposite enlarged end to pull the clamping band constrictingly against the gas spring body to securely, yet detachably retain the same therein. | 06-21-2012 |
20120151985 | GAS SPRING MOUNTING ASSEMBLY AND METHOD FOR METAL FORMING DIES - A gas spring mount and related method for metal forming dies includes a one-piece, split clamping ring having a generally ovate plan shape with two spaced apart axes of symmetry. A generally circular clamping portion extends around the first axis, and is shaped to receive a gas spring body therein. A hook-shaped end extends around the second axis, and is shaped to receive a tapered head mounting member therein. A resilient free end is located operably between the clamping portion and the hook-shaped end portion, whereby tightening of the mounting member shifts the hook-shaped end outwardly and the free end inwardly to constrictingly pull the clamping ring securely against the gas spring body, and contemporaneously attach the assembly to an associated die member. | 06-21-2012 |
20120210766 | GUIDED KEEPER ASSEMBLY AND METHOD FOR METAL FORMING DIES - A guided keeper assembly and related method includes a cylindrical base that mounts to a die member using a multi-piece, interlocking flange. The flanges have outer fastener holes and inner arcuate walls that matingly engage a complimentary profile on the outer surface of the base to axially interconnect the same. The flanges also have male and female end connectors which snap lock together around the base in an assembled condition. Mounting screws pass through the fastener holes in the flanges and are anchored in the die member to securely retain the guided keeper assembly in place. A retainer ring is mounted in an associated groove in the base over the heads of the screws to prevent unintentional unfastening of the screws from the die member. | 08-23-2012 |
20120304728 | GUIDED KEEPER ASSEMBLY AND METHOD FOR METAL FORMING DIES - A guided keeper assembly for metal forming dies includes a base having a mounting face and a fastener aperture to mount the base to an associated die shoe, as well as a central guide aperture. A guide pin having a central portion is closely received in the central guide aperture for precisely guiding reciprocal motion between the die pad and the die shoe. The guide pin has an enlarged head at one end which abuts the base to positively limit travel between the die shoe and the die pad, and a shoulder at an opposite end with an alignment mechanism that precisely locates the guide pin on the die pad. A fastener extends through the fastener aperture in the base to securely connect the same with the die shoe. Another fastener securely connects the second end of the guide pin with the die pad. | 12-06-2012 |
20130091920 | MODULAR PILOT ASSEMBLY WITH SELF-CONTAINED STRIPPER AND METHOD FOR METAL FORMING DIES - A pilot assembly and method has a cylindrical pilot body with a tapered outer end, a grooved inner end, and a central portion with at least one inwardly curved side wall relief, as well as internally mounted reciprocating ejector pins with outer ends that protrude through holes in the outer body end to strip stock from the pilot. A spring has its outer end mounted in the groove in the outer body end, and an inner end attached to the inner body end in a pre-tensed condition. A cap screw has an enlarged head that has at least a portion thereof fit into the pilot sidewall relief, and a threaded shank that anchors the pilot in an associated die member. | 04-18-2013 |
20130167612 | MODULAR PILOT ASSEMBLY WITH SELF-CONTAINED STRIPPER AND METHOD FOR METAL FORMING DIES - A pilot assembly and method has a cylindrical pilot sleeve with an apertured outer end in which a separate pilot pin is received, a grooved inner end, and a central portion with at least one inwardly curved sidewall relief, as well as internally mounted reciprocating ejector pins with outer ends that protrude through holes in the outer body end to strip stock from the pilot pin. A spring has its outer end mounted in the sleeve groove, and an inner end captured in a die pocket in a pretensed condition. A mounting screw has an enlarged head that has at least a portion thereof fit into the pilot sidewall relief, and a threaded shank that anchors the pilot sleeve in the die. | 07-04-2013 |
20130180308 | RETRACTABLE STOCK GUIDE AND METHOD FOR METAL FORMING DIES - A retractable stock guide has a stationary guide rail on which a retractable guide cap is operably supported. The guide rail and cap have two through holes at opposite ends through which two mounting studs extend to attach the stock guide to an associated die member. The holes in the guide cap are ovate, and the heads of the mounting studs are tapered, whereby tightening of the mounting stud shifts the guide cap relative to the guide rail from an aligned, retracted load/unload condition, to an inwardly protruding, extended run condition, wherein the stock strip is slidingly captured between two like stock guides and the mounting surface of the die. Two ball bearing guides can be substituted for the stationary guide rail. | 07-18-2013 |
20140013816 | GUIDE PIN ASSEMBLY FOR METAL FORMING DIES AND METHOD - A guide pin assembly for metal forming dies includes a cylindrical guide pin body with an external retainer groove adjacent one end thereof in which a retainer ring is received. An annular guide pin ring with an outside diameter greater than the pin body, has a counterbore adjacent the outside end thereof and a retainer groove in a medial portion thereof which receives the outer portion of the retainer ring to securely interconnect the pin body and the ring and thereby form an enlarged head at one end of the pin body which positively limits reciprocal motion between two associated die members. A circular guide pin head cap covers the outer end of the head ring, and includes a support collar that is closely received in the counterbore of the ring, and engages the retainer ring to securely hold the same in place. | 01-16-2014 |
20140047894 | LOW PROFILE PILOT ASSEMBLY AND METHOD FOR METAL FORMING DIES - A pilot assembly and method for metal forming dies has a generally cylindrical pilot with a stripper that strips stock from the pilot when metal forming dies diverge. The pilot assembly is secured to one die member by a fastener by itself or in combination with a window mount. A spring within the pilot assembly contacts the stripper to force the stripper to reciprocate when the dies are pulled apart. Thus, the pilot assembly helps locate the stock within the metal forming die while also having a stripper to help strip the stock from the pilot. | 02-20-2014 |
20140076107 | TWO-PIECE GUIDE PIN AND METHOD - A two-piece guide pin for metal forming dies includes a guide pin body formed from a cut length of an elongate, solid bar of stock having a cylindrical shape and a hard and smooth finished exterior surface with an outside diameter selected for close reception and reciprocal motion in an associated die bore. An alignment member is formed on a first end of the guide pin body. A guide pin head is formed from a cut length of an elongate, solid bar of stock having an outside diameter that is substantially greater than that of the guide pin body, and is rigidly connected with the second end of the guide pin body in a generally concentric relationship to define an enlarged head that positively limits travel between an associated die shoe and die pad. | 03-20-2014 |
20140144202 | SHOULDER PILOT ASSEMBLY WITH SELF-CONTAINED STRIPPER AND METHOD FOR METAL FORMING DIES - A pilot assembly with a self-contained stripper and method for metal forming dies has a cylindrical pilot with internally mounted reciprocating ejector pins with outer ends that protrude through holes in the body of the pilot to strip stock from the pilot. The pilot assembly is secured to the die by a window mount such that one or more surfaces of the pilot abut surfaces on the window mount and die to secure the pilot to the die and window mount when the window mount is secured, via a fastener, to the die. A spring within the pilot assembly contacts an end of the ejector pins to force the pins to reciprocate when the dies are pulled apart. The assembly can be made without the locating pilot surface to provide a stripper assembly for stripping the stock from the associated die. | 05-29-2014 |
20140157857 | PILOT ASSEMBLY WITH PRESS FIT INSERT/BODY CONSTRUCTION AND METHOD FOR METAL FORMING DIES - A pilot assembly and method has a cylindrical pilot body with a pilot insert having tapered outer end. The pilot assembly has at least one inwardly curved sidewall relief, as well as internally mounted reciprocating ejector pins with outer ends that protrude through holes in the outer body end to strip stock from the pilot. A spring has its outer end mounted in the groove in the pilot body, and an inner end attached to the inner end of the pilot insert in a pre-tensed condition. A cap screw has an enlarged head that has at least a portion thereof fit into the pilot sidewall relief, and a threaded shank that anchors the pilot in an associated die member. | 06-12-2014 |
20150033818 | GUIDED KEEPER ASSEMBLY AND METHOD FOR METAL FORMING DIES - A guided keeper assembly for metal forming dies includes a base having a mounting face and a fastener aperture to mount the base to an associated die shoe, as well as a central guide aperture. A guide pin having a central portion is closely received in the central guide aperture for precisely guiding reciprocal motion between the die pad and the die shoe. The guide pin has an enlarged head at one end which abuts the base to positively limit travel between the die shoe and the die pad, and a shoulder at an opposite end with an alignment mechanism that precisely locates the guide pin on the die pad. A fastener extends through the fastener aperture in the base to securely connect the same with the die shoe. Another fastener securely connects the second end of the guide pin with the die pad. | 02-05-2015 |
20150052965 | LOW PROFILE PILOT ASSEMBLY AND METHOD FOR METAL FORMING DIES - A pilot assembly and method for metal forming dies has a generally cylindrical pilot with a stripper that strips stock from the pilot when metal forming dies diverge. The pilot assembly is secured to one die member by a fastener by itself or in combination with a window mount. A spring within the pilot assembly contacts the stripper to force the stripper to reciprocate when the dies are pulled apart. Thus, the pilot assembly helps locate the stock within the metal forming die while also having a stripper to help strip the stock from the pilot. | 02-26-2015 |
20150068269 | GUIDED KEEPER AND METHOD FOR METAL FORMING DIES - A locking collar assembly for metal forming dies includes a disc-shaped locking collar with a cylindrical outer surface closely received in a collar bore in one face of a first die member. A circular recess in the outer face of the locking collar has an internal retainer ring groove. A counterbored shaped fastener hole extends through the collar and a part of the recess, and has shank, head and shoulder portions. A socket head cap screw is inserted in the fastener hole with a threaded end anchored in a threaded end aperture in one of the guide pins, with the head seated on the shoulder of the fastener hole. A retainer ring is mounted in the collar ring groove and overlies the cap screw head to positively prevent the cap screw from unintentionally unfastening from the guide pin. | 03-12-2015 |
20150190859 | RETRACTABLE STOCK GUIDE AND METHOD FOR METAL FORMING DIES - A retractable stock guide has a stationary guide rail on which a retractable guide cap is operably supported. The guide rail and cap have two through holes at opposite ends through which two mounting studs extend to attach the stock guide to an associated die member. The holes in the guide cap are ovate, and the heads of the mounting studs are tapered, whereby tightening of the mounting stud shifts the guide cap relative to the guide rail from an aligned, retracted load/unload condition, to an inwardly protruding, extended run condition, wherein the stock strip is slidingly captured between two like stock guides and the mounting surface of the die. Two ball bearing guides can be substituted for the stationary guide rail. | 07-09-2015 |
20150196947 | GUIDE PIN HEAD - A guide pin assembly for metal forming dies includes a cylindrical guide pin body with a tapered guide pin head to guide associated die members from converging and diverging positions. A base is used to secure the guide pin assembly to one of the die members in a reciprocating die. The base includes a tapered surface that coincides with the tapered surface of the guide pin head to transfer the directional force, caused by the diverging die members, on the guide pin assembly to other die components. The guide pin assembly includes additional dampening components between the guide pin assembly and the base to dampen the impact caused by the diverging die members. | 07-16-2015 |
20150273561 | LOW PROFILE PILOT ASSEMBLY AND METHOD FOR METAL FORMING DIES - A pilot assembly and method for metal forming dies has a generally cylindrical pilot with a stripper that strips stock from the pilot when metal forming dies diverge. The pilot assembly is secured to one die member by a fastener by itself or in combination with a window mount. A spring within the pilot assembly contacts the stripper to force the stripper to reciprocate when the dies are pulled apart. Thus, the pilot assembly helps locate the stock within the metal forming die while also having a stripper to help strip the stock from the pilot. | 10-01-2015 |
20150306654 | STOCK EJECTOR ASSEMBLY - A stock ejector assembly and method for metal forming dies includes a stock ejector with a large spring and a ring-style stripper. The ring-style stripper provides a larger surface area for contacting the stock. The large compression spring is preloaded and when a load is applied, the stripper retracts and the spring pressure increases. When the dies separate, the stock ejector pushes the part off flat surfaces, separating surfaces sealed by adhesion, including but not limited to oil or lubricant adhesion. | 10-29-2015 |
20150375292 | MODULAR PILOT ASSEMBLY WITH SELF-CONTAINED STRIPPER AND METHOD FOR METAL FORMING DIES - A pilot assembly and method has a cylindrical pilot body with a tapered outer end, a grooved inner end, and a central portion with at least one inwardly curved side wall relief, as well as internally mounted reciprocating ejector pins with outer ends that protrude through holes in the outer body end to strip stock from the pilot. A spring has its outer end mounted in the groove in the outer body end, and an inner end attached to the inner body end in a pre-tensed condition. A cap screw has an enlarged head that has at least a portion thereof fit into the pilot sidewall relief, and a threaded shank that anchors the pilot in an associated die member. | 12-31-2015 |