Patent application number | Description | Published |
20090270615 | METHOD OF PREPARING BENZOXAZINES - This invention relates to a novel synthesis for the preparation of benzoxazine components from phenolic components, aldehyde components, and amine components in a solvent other than toluene. | 10-29-2009 |
20100140542 | BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH - A composition of matter in liquid form at a temperature of 50° C. or less comprising a monofunctional benzoxazine compound embraced by the structure | 06-10-2010 |
20110213096 | Curing Agents for Epoxy Resins - A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction. | 09-01-2011 |
20110265913 | THERMALLY DECOMPOSABLE POLYMER COATED METAL POWDERS - The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer. | 11-03-2011 |
20110301291 | OXAZOLINE AND/OR OXAZINE COMPOSITIONS - A curable composition comprising an oxazoline and/or an oxazine and a cationic cure initiator, in the absence of any phenolic compounds, is suitable for use as a molding or coating composition for semiconductor boards and devices. | 12-08-2011 |
20130079475 | ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS - Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. | 03-28-2013 |
20140182746 | DI- OR POLY-FUNCTIONAL ELECTRON DEFICIENT OLEFINS COATED METAL POWDERS FOR SOLDER PASTE - The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes. | 07-03-2014 |
20140209951 | OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF - Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices. | 07-31-2014 |
20140220337 | ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS - Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. | 08-07-2014 |
20140264165 | OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF - Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices. | 09-18-2014 |