Patent application number | Description | Published |
20140179263 | SYSTEM AND METHOD FOR RESPONDING TO AGGRESSIVE BEHAVIOR ASSOCIATED WITH WIRELESS DEVICES - An embodiment of the invention describes a wireless device comprising a Subscriber Identity Module (SIM) further comprising a memory for storing program code for performing a plurality of operations, and a processor for processing the program code to execute the plurality of operations, the operations including receiving over-the-air instructions via a wireless network from a control center to create a rules set in the SIM, wherein the rules set defines an acceptable behavior of the wireless device, monitoring requests from a wireless modem of the wireless device for access files stored in the SIM, detecting an aggressive behavior of the wireless device based on the rules set, and blocking the wireless modem from generating traffic in the wireless network. | 06-26-2014 |
20140315514 | SYSTEM AND METHOD FOR RESPONDING TO AGGRESSIVE BEHAVIOR ASSOCIATED WITH WIRELESS DEVICES - An embodiment of the invention describes a wireless device comprising a Subscriber Identity Module (SIM) further comprising a memory for storing program code for performing a plurality of operations, and a processor for processing the program code to execute the plurality of operations, the operations including receiving over-the-air instructions via a wireless network from a control center to create a rules set in the SIM, wherein the rules set defines an acceptable behavior of the wireless device, monitoring requests from a wireless modem of the wireless device for access files stored in the SIM, detecting an aggressive behavior of the wireless device based on the rules set, and blocking the wireless modem from generating traffic in the wireless network. | 10-23-2014 |
20150133077 | SYSTEM AND METHOD FOR RESPONDING TO AGGRESSIVE BEHAVIOR ASSOCIATED WITH WIRELESS DEVICES - An embodiment of the invention describes a wireless device comprising a Subscriber Identity Module (SIM) further comprising a memory for storing program code for performing a plurality of operations, and a processor for processing the program code to execute the plurality of operations, the operations including receiving over-the-air instructions via a wireless network from a control center to create a rules set in the SIM, wherein the rules set defines an acceptable behavior of the wireless device, monitoring requests from a wireless modem of the wireless device for access files stored in the SIM, detecting an aggressive behavior of the wireless device based on the rules set, and blocking the wireless modem from generating traffic in the wireless network. | 05-14-2015 |
Patent application number | Description | Published |
20090020905 | Reduced Cycle Time Manufacturing Processes for Thick Film Resistive Devices - A process of forming a resistive device such as s load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer. | 01-22-2009 |
20090021342 | Thick Film Layered Resistive Device Employing a Dielectric Tape - A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer. | 01-22-2009 |
20090250173 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate. | 10-08-2009 |
20100319186 | METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM - A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform. | 12-23-2010 |
20140014265 | REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES - A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer. | 01-16-2014 |