Patent application number | Description | Published |
20120180016 | Standard Cell Architecture Using Double Poly Patterning for Multi VT Devices - An apparatus fabricated using a standard cell architecture including devices having different voltage thresholds may include a first set of polylines associated with a first channel length, where each polyline within the first set of polylines is separated by a substantially constant pitch. The apparatus may further include a second set of polylines associated with a second channel length and aligned with the first set of polylines, where each polyline within the second set of polylines is laterally separated by the substantially constant pitch. The apparatus may further include a first active region below the first set of polylines, and a second active region below the second set of polylines, where the first active region and the second active region are separated by a distance of less than 170 nm. | 07-12-2012 |
20120210284 | Method and Apparatus for Characterizing and Reducing Proximity Effect on Cell Electrical Characteristics - Circuit elements are characterized for effects of proximity context on electrical characteristic. Based on the characterization, proximity context cell models, and corresponding modeled electrical characteristic values are obtained. Logic cells are characterized and modeled according to the proximity context cell models. Optionally the electrical characteristic can be time delay, leakage, dynamic power, or coupling noise among other parameters. | 08-16-2012 |
20130032885 | AREA EFFICIENT GRIDDED POLYSILICON LAYOUTS - Gridded polysilicon semiconductor layouts implement double poly patterning to cut polylines of the layout into polyline segments. Devices are arranged on the polyline segments of a common polyline to reduce the area used to implement a circuit structure relative to conventional gridded polysilicon layout. Stacking of PMOS and NMOS devices is enabled by using double poly patterning to implement additional cuts which form additional polyline segments. Metal layer routing may connect nodes of separate polyline segments. | 02-07-2013 |
20140124868 | SHARED-DIFFUSION STANDARD CELL ARCHITECTURE - A semiconductor standard cell includes an N-type diffusion area and a P-type diffusion area, both extending across the cell and also outside of the cell. The cell also includes a conductive gate above each diffusion area to create a semiconductive device. A pair of dummy gates are also above the N-type diffusion area and the P-type diffusion area creating a pair of dummy devices. The pair of dummy gates are disposed at opposite edges of the cell. The cell further includes a first conductive line configured to couple the dummy devices to power for disabling the dummy devices. | 05-08-2014 |
20140246715 | DECOUPLING CAPACITOR FOR INTEGRATED CIRCUIT - An integrated circuit includes a capacitor having first, second and third nodes. The first and second nodes of the first transistor are connected together and the first and second nodes of the second transistor are connected together. The third node of the first transistor is connected to the third node of the second transistor. Each of the third nodes is constructed so that each node comprises a width and a length that is at least ten percent of the width. | 09-04-2014 |
20140354338 | LENGTH-OF-DIFFUSION PROTECTED CIRCUIT AND METHOD OF DESIGN - A circuit includes a pulsed-latch circuit. The pulsed-latch circuit includes a first plurality of transistors. One or more of the first plurality of transistors is length-of-diffusion (LOD) protected. | 12-04-2014 |
20150019802 | MONOLITHIC THREE DIMENSIONAL (3D) RANDOM ACCESS MEMORY (RAM) ARRAY ARCHITECTURE WITH BITCELL AND LOGIC PARTITIONING - A monolithic three dimensional (3D) memory cell array architecture with bitcell and logic partitioning is disclosed. A 3D integrated circuit (IC) (3DIC) is proposed which folds or otherwise stacks elements of the memory cells into different tiers within the 3DIC. Each tier of the 3DIC has memory cells as well as access logic including global block control logic therein. By positioning the access logic and global block control logic in each tier with the memory cells, the length of the bit and word lines for each memory call are shortened, allowing for reduced supply voltages as well as generally reducing the overall footprint of the memory device. | 01-15-2015 |
20150022250 | MONOLITHIC THREE DIMENSIONAL (3D) FLIP-FLOPS WITH MINIMAL CLOCK SKEW AND RELATED SYSTEMS AND METHODS - Monolithic three dimensional (3D) flip-flops with minimal clock skew and related systems and methods are disclosed. The present disclosure provides a 3D integrated circuit (IC) (3DIC) that has a flop spread across at least two tiers of the 3DIC. The flop is split across tiers with transistor partitioning in such a way that keeps all the clock related devices at the same tier, thus potentially giving better setup, hold and clock-to-q margin. In particular, a first tier of the 3DIC has the master latch, slave latch, and clock circuit. A second tier has the input circuit and the output circuit. | 01-22-2015 |