Prasher
Bhavana Prasher, New Delhi IN
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20140030709 | Biomarker for Detecting High-Altitude Adaptation and High-Altitude Pulmonary Edema - Present invention relates to the Biomarkers for detecting high altitude adaptation and hypoxia responsiveness and the method thereof. The invention specifically relates to the Gene variants SNPIDs rs479200 and rs480902 in the first intron of EGLN1 (Prolyl Hydroxylase 2) gene as biomarkers for adaptation to high altitude and predisposition for high altitude pulmonary edema and hypoxia responsiveness using a novel integrative approach of phenotyping concepts of Ayurveda with population genetics, and disease genomics. More specifically, the C allele of SNP ID rs480902 and T allele of rs479200 of EGLN1 gene is more frequent in patients of HAPE and nearly absent in native highlanders. The present invention also provides primers and methods suitable for the detection of these allelic variants for the prediction of individual's adaptability to high altitude and hypoxia and/or the genetic analysis of the EGLN1 gene in a population. | 01-30-2014 |
Jognandan Kumar Prasher, North Ryde AU
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20140176644 | INKJET PRINTER HAVING PRINTHEAD PLUMBED FOR OPTIMIZED COLOR MIXING - An inkjet printer including an inkjet printhead positioned relative to a media feed direction. The printhead has a plurality of color planes for ejecting different inks, each color plane including a nozzle row defined in a nozzle face of the printhead, and each nozzle in a respective color plane being supplied with a same ink. The printhead is plumbed such that a first color plane positioned furthest upstream with respect to the media feed direction ejects yellow ink and a second color plane neighboring the first color plane ejects black ink. | 06-26-2014 |
Ravi Prasher, Tempe, AZ US
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20100046167 | COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANNEL AND A THIN FILM THERMOELECTRIC COOLING DEVICE IN THE MICROCHANNEL - An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel. | 02-25-2010 |
Ravi Prasher, Mesa, AZ US
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20080237843 | Microelectronic package including thermally conductive sealant between heat spreader and substrate - A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder. | 10-02-2008 |
Ravi Prasher, Austin, TX US
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20160133814 | FUEL-FLEXIBLE THERMAL POWER GENERATOR FOR ELECTRIC LOADS - An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus. | 05-12-2016 |
Shiv Prasher, Baie D'Urfe CA
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20150087072 | SOIL ANALYSIS APPARATUS, METHOD, AND SYSTEM - A soil analysis apparatus includes at least one sensor element for measuring a property of the soil; a blade assembly having at least one blade and being displaceable between a raised position and an excavation position, the at least one blade being operable to excavate the soil at a test location when the blade assembly is in the excavation position, the blade assembly being further operable to enter a sensor permitting configuration; and a first actuator operable to displace the at least one sensor element between an initial position and a sensing position along a sensor displacement path, the sensor element being proximate the soil at the test location when in the sensing position. | 03-26-2015 |