Patent application number | Description | Published |
20090126910 | APPARATUS AND METHOD FOR FACILITATING SERVICING OF A LIQUID-COOLED ELECTRONICS RACK - Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system. | 05-21-2009 |
20090154159 | LIGHT SOURCE FOR ILLUMINATING AN ELECTRONICS RACK TO FACILITATE SERVICING THEREOF - An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes. | 06-18-2009 |
20090156114 | APPARATUS AND METHOD FOR FACILITATING AIR COOLING OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly. | 06-18-2009 |
20090215289 | LARGE ARRAY SURFACE MOUNT TECHNOLOGY CONNECTOR CRADLE ASSEMBLY - A large array connector assembly for containing a plurality of wafers is disclosed. The large array connector assembly includes a plurality of guide blocks that includes first and second guide blocks. The first guide block being located at a first end of the assembly. The second guide block being located at a second end of the assembly. A first plate is mechanically coupled to a first portion of the first guide block and a first portion of the second guide block. The first plate includes a plurality of slots each for receiving a tab extending from a corresponding wafer so as to substantially prevent movement of the corresponding wafer in first and second directions while allowing a given degree of movement in a third direction. A second plate is mechanically coupled to a second portion of the first guide block and a second portion of the second guide block. | 08-27-2009 |
20090238235 | METHOD AND APPARATUS FOR DEFECT DETECTION IN A COLD PLATE - Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold. | 09-24-2009 |
20100071876 | COLD PLATE APPARATUS WITH A CONTROLLED HEAT TRANSFER CHARACTERISTIC BETWEEN A METALLURGICALLY BONDED TUBE AND HEAT SINK FOR FACILITATING COOLING OF AN ELECTRONICS COMPONENT - A cold plate apparatus is provided which includes a tube formed of a first metal, a casted heat sink member formed of a second metal surrounding a heat transfer region of the tube, and an alloy layer disposed between the tube and the heat sink member. The tube has its first and second ends, with the heat transfer region being disposed between its ends. The first and second ends of the tube extend from the heat sink member, and a metallurgical bond exists between the tube and heat sink member in the heat transfer region of the tube. The alloy layer formed during casting of the heat sink member by the first metal and second metal reacting peritectically, and with the thickness of the alloy layer minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond. | 03-25-2010 |
20100181663 | LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMULATION FOR THERMAL INTERFACE MATERIAL AND PACKAGE - An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less. | 07-22-2010 |
20110067910 | COMPONENT SECURING SYSTEM AND ASSOCIATED METHOD - A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil. | 03-24-2011 |
20110070775 | DELAYED CONTACT ACTION CONNECTOR - A connector having a plurality of terminals for connecting to a circuit card and a method therefore are disclosed. The connector includes a socket having a casing with an aperture for receiving the circuit card therein and a plurality of terminals made of electrically conductive material. At least one of the plurality of terminals includes an elongated portion and a substantially L-shaped portion joined together by a U-shaped portion. The elongated portion has a proximal end and a distal end, and includes a support section and a bending section between the proximal end and the distal end. The terminal is secured to the casing by the support section at or near the proximal end of the elongated portion. The U-shaped portion is disposed at the distal end of the elongated portion. The terminal continues from the U-shaped portion to a region approximately halfway towards the proximal end of the elongated portion and turns away from the elongated portion thereby forming the substantially L-shaped portion. The L-shaped portion ends in a lip section curving towards the proximal end of the elongated portion. | 03-24-2011 |
20120038377 | CORROSION SENSORS - Corrosion sensor apparatus are disclosed for detection of contamination affecting metal based components and devices. For example, an apparatus comprises: a set of corrosion sensor elements comprising a first corrosion sensor element and at least a second corrosion element, each corrosion sensor element being coupled between a source and a monitor, wherein a width of the first corrosion sensor element is different than a width of the second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements comprising a first reference sensor element and at least a second reference sensor element, each reference sensor element being coupled between the source and the monitor, wherein a width of the first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of the second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements. | 02-16-2012 |
20120176148 | METHODS AND APPARATUS FOR DETECTION OF GASEOUS CORROSIVE CONTAMINANTS - A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection. | 07-12-2012 |
20130118353 | SERVER RACK FRONT DOOR WITH CONTAMINATION FILTER AND SENSOR - An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air. | 05-16-2013 |
20130149195 | CORROSION SENSORS - Corrosion sensor apparatus for detection of contamination affecting metal based components and devices. For example, an apparatus includes: a set of corrosion sensor elements, wherein a width of a first corrosion sensor element is different than a width of a second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements wherein a width of a first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of a second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements. | 06-13-2013 |
20130180271 | CONDUCTIVE DUST DECTECTION - An apparatus is provided, which includes a dust detector, a voltage source, and a controller. The dust detector includes two opposing surfaces and a conductive dust sensor. The two opposing surfaces are disposed in spaced, opposing relation to allow for the passage of airflow between the surfaces, and the conductive dust sensor is disposed at a surface of the two opposing surfaces. The voltage source is configured and controlled to establish an electrostatic field at least partially between the two opposing surfaces to facilitate directing conductive particles in the airflow passing between the two opposing surfaces towards the dust sensor. The controller monitors for a leakage current within the conductive dust sensor and determines whether the leakage current exceeds a predetermined trigger level indicative of the presence of conductive dust, and if so, automatically indicates a conductive dust warning. | 07-18-2013 |
20130183872 | LAND GRID ARRAY INTERPOSER WITH COMPRESSIBLE CONDUCTORS - An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor. | 07-18-2013 |
20140047702 | THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component. | 02-20-2014 |
20140102669 | COOLING METHOD WITH AUTOMATED SEASONAL FREEZE PROTECTION - An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year. | 04-17-2014 |
20140102672 | COOLING SYSTEM WITH AUTOMATED SEASONAL FREEZE PROTECTION - An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year. | 04-17-2014 |
20140111229 | CORROSION SENSORS - Corrosion sensor apparatus for detection of contamination affecting metal based components and devices. For example, an apparatus includes: a set of corrosion sensor elements, wherein a width of a first corrosion sensor element is different than a width of a second corrosion sensor element, wherein each corrosion sensor element is susceptible to corrosion caused by an operating environment of the corrosion sensor elements; and a set of reference elements wherein a width of a first reference sensor element is substantially equal to the width of the first corrosion sensor element and a width of a second reference sensor element is substantially equal to the width of the second corrosion sensor element, wherein each reference sensor element is not substantially susceptible to corrosion caused by the operating environment of the corrosion sensor elements. | 04-24-2014 |
20140152449 | Early Detection of Environmental Conditions That Will Lead to Creep Corrosion on Printed Circuit Boards in Data Centers - Apparatus and method for directly detecting the atmospheric conditions leading to creep corrosion of printed circuit boards (PCBs) well before the PCBs in the computers start suffering from creep corrosion. The embodiment indicates the propensity of the air towards creep corrosion on PCBs. Additionally, to avoid the false reading due to condensed moisture, condensed moisture may be avoided by using a heater attached to the creep corrosion monitor that keeps the creep corrosion monitor above the dew point temperature. | 06-05-2014 |
20140202573 | IMPLEMENTING PRE-TREATMENT OF WATER COOLING HOSES TO INCREASE RELIABILITY - Pre-treated water cooling hoses and a method for implementing pretreatment of water cooling hoses for increased reliability are provided. Pretreatment of the water cooling hoses includes attaching the water cooling hose to a water cooling system, filling the water cooling system with a high concentration corrosion inhibitor solution, and running the system for an extended time to saturate the attached hose with the high concentration corrosion inhibitor. | 07-24-2014 |
20140230524 | METHODS AND APPARATUS FOR DETECTION OF GASEOUS CORROSIVE CONTAMINANTS - A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection. | 08-21-2014 |