Poucher
Frank Poucher, Raheen County Limerick IE
Patent application number | Description | Published |
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20150123256 | STRESS SHIELD FOR INTEGRATED CIRCUIT PACKAGE - A stress shield for a plastic integrated circuit package is disclosed. A shield plate is attached by an adhesive to a top surface of an integrated circuit die such that the shield plate covers less than all of the top surface and leaves bond pads exposed. A molding material is applied over the shield plate and the integrated circuit die. The shield plate shields the integrated circuit die from stresses imparted by the molding material. | 05-07-2015 |
James Poucher, St. Paul, MN US
Patent application number | Description | Published |
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20130318678 | COLD WEATHER GARMENT SYSTEM - A cold weather garment system including various features to improve usability of the garments. The garments may include drains made from mesh fabric to enable bulk water, moisture, heat, and perspiration to escape from the garment. The garments may also include adjustable length pant legs, a beverage holder, or a removably fastenable towel. | 12-05-2013 |
Neal Poucher, North Oaks, MN US
Patent application number | Description | Published |
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20150094695 | SURGICAL SYSTEM FOR AND A METHOD OF DISSECTION OF TISSUE AWAY FROM AN ORGAN OR BODY LUMEN - A surgical system adapted for dissection of tissue away from a body lumen includes a tissue dissection tool and a catheter. The tissue dissection tool includes a shaft connected between a handle and a tissue dissection head. At least the tissue dissection head of the tissue dissection tool is magnetized to a first polarity. The catheter is insertable into a urethra, with a wall of the catheter magnetized to the first polarity. When the catheter is inserted into the urethra, the first polarity of the catheter is configured to repel the first polarity of the tissue dissection head of the tool away from the catheter and away from in the urethra. | 04-02-2015 |
Patrick F. M. Poucher, Raheen IE
Patent application number | Description | Published |
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20130292793 | LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT - An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed. | 11-07-2013 |