Patent application number | Description | Published |
20080229950 | SEAMLESS IMPRINT ROLLER AND METHOD OF MAKING - This invention provides a structure and method of forming a seamless imprint roller. The method includes providing a translucent cylindrical core. At least one uniform seamless layer of material is deposited about the cylindrical core. This uniform seamless layer of material is then processed to define a translucent three dimensional imprint pattern seamlessly disposed about the core. The pattern includes at least one structure extending from the core and having one or more elevations. The pattern and more specifically the structures are inherently aligned to one another and the cylindrical core. | 09-25-2008 |
20080248605 | METHOD OF FORMING A PRESSURE SWITCH THIN FILM DEVICE - This invention provides a method of forming at least one pressure switch thin film device. The method includes providing a substrate and depositing a plurality of thin film device layers as a stack upon the substrate. An imprinted 3D template structure is provided upon the plurality of thin film device layers. The plurality of thin film device layers and the 3D template structure are then etched and at least one thin film device layer is undercut to provide a plurality of aligned electrical contact pairs and adjacent spacer posts. A flexible membrane providing a plurality of separate electrical contacts is deposited upon the spacer posts, the separate electrical contacts overlapping the contact pairs. The spacer posts provide a gap between the electrical contacts and the contact pairs. | 10-09-2008 |
20080315918 | Thin film transistor logic - A thin-film logic circuit, which can be fabricated entirely of TFTs of the same conductivity type, includes a logic stage connected to a supply voltage and a level shifter connected to a wider voltage range provided by the supply voltage and ground. The logic circuit produces output signals with full rail-to-rail signal range from ground to the supply voltage and can implement or include a basic logic component such as an inverter, a NAND gate, or a NOR gate or more complicated circuits in which many basic logic components are cascaded together. Such logic circuits can be fabricated directly on flexible structures or large areas such as in flat panel displays. | 12-25-2008 |
20090108397 | THIN FILM DEVICE WITH LAYER ISOLATION STRUCTURE - This invention provides a thin film device with layer isolation structures. Specifically, a plurality of patterned thin film device layers provide a first rail and a second rail. There is at least one overpass between the first rail and the second rail. The overpass is defined by an array of spaced holes disposed transversely through the continuous material of the first rail on either side of the overpass. The holes are in communication with isolation voids adjacent to the second rail adjacent to the overpass. | 04-30-2009 |
20090142560 | THIN FILM DEVICE WITH MINIMIZED SPATIAL VARIATION OF LOCAL MEAN HEIGHT - This invention provides a thin film device with minimized spatial variation of local mean height. More specifically, the thin film device has a substrate and at least one first structure having a first spatially varying weighted local mean height determined by a layer weighting function. The first structure has a first maximum height, a first minimum height and a first variation for a given averaging area. A compensation structure is also provided upon the substrate, the compensation structure having a second spatially varying weighted local mean height determined by the layer weighting function. The compensation structure also has a second maximum height, a second minimum height and a second variation for the given averaging area. The first structure and compensation structure combine to provide a combined structure upon the substrate with minimized spatial variation of a combined weighted local mean. | 06-04-2009 |
20100078640 | Thin Film Transistor Backplane - A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer. | 04-01-2010 |
20110256725 | STRUCTURE AND METHOD FOR THIN FILM DEVICE WITH STRANDED CONDUCTOR - Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD. | 10-20-2011 |
20110309365 | THIN FILM TRANSISTOR BACKPLANE - A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer. | 12-22-2011 |