Perng, TW
Baw-Ching Perng, Baoshan Township TW
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20100289092 | POWER MOSFET PACKAGE - A power MOSFET package includes a semiconductor substrate having opposite first and second surfaces, having a first conductivity type, and forming a drain region, a doped region extending downward from the first surface and having a second conductivity type, a source region in the doped region and having the first conductivity type, a gate overlying or buried under the first surface, wherein a gate dielectric layer is between the gate and the semiconductor substrate, a first conducting structure overlying the semiconductor substrate, having a first terminal, and electrically connecting the drain region, a second conducting structure overlying the semiconductor substrate, having a second terminal, and electrically connecting the source region, a third conducting structure overlying the semiconductor substrate, having a third terminal, and electrically connecting the gate, wherein the first, the second, and the third terminals are substantially coplanar, and a protection layer between the semiconductor substrate and the terminals. | 11-18-2010 |
20110042819 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the invention, a chip package is provided. The chip package includes a semiconductor substrate having an upper surface and an opposite lower surface, a through-hole penetrating the upper surface and the lower surface of the semiconductor substrate, a chip disposed overlying the upper surface of the semiconductor substrate, a conducting layer overlying a sidewall of the through-hole and electrically connecting the chip, a first insulating layer overlying the upper surface of the semiconductor substrate, a second insulating layer overlying the lower surface of the semiconductor substrate, and a bonding structure disposed overlying the lower surface of the semiconductor substrate, wherein a material of the second insulating layer is different from that of the first insulating layer. | 02-24-2011 |
20110127670 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package includes a substrate having an upper and a lower surface and including: at least a first contact pad; a non-optical sensor chip disposed overlying the upper surface, wherein the non-optical sensor chip includes at least a second contact pad and has a first length; a protective cap disposed overlying the non-optical sensor chip, wherein the protective cap has a second length, an extending direction of the second length is substantially parallel to that of the first length, and the second length is shorter than the first length; an IC chip disposed overlying the protective cap, wherein the IC chip includes at least a third contact pad and has a third length, and an extending direction of the third length is substantially parallel to that of the first length; and bonding wires forming electrical connections between the substrate, the non-optical sensor chip, and the IC chip. | 06-02-2011 |
20130193520 | POWER MOSFET PACKAGE - A power MOSFET package includes a semiconductor substrate having opposite first and second surfaces, having a first conductivity type, and forming a drain region, a doped region extending downward from the first surface and having a second conductivity type, a source region in the doped region and having the first conductivity type, a gate overlying or buried under the first surface, wherein a gate dielectric layer is between the gate and the semiconductor substrate, a first conducting structure overlying the semiconductor substrate, having a first terminal, and electrically connecting the drain region, a second conducting structure overlying the semiconductor substrate, having a second terminal, and electrically connecting the source region, a third conducting structure overlying the semiconductor substrate, having a third terminal, and electrically connecting the gate, wherein the first, the second, and the third terminals are substantially coplanar, and a protection layer between the semiconductor substrate and the terminals. | 08-01-2013 |
20130256869 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - An embodiment provides a chip package including a substrate, a cavity extending downward from an upper surface of the substrate, a metal layer overlying the substrate and conformally covering a sidewall and a bottom portion of the cavity, a chip having an upper surface and located on the metal layer in the cavity, wherein the upper surface is not lower than an upper surface of the metal layer outside of the cavity, and the protective layer covering the chip. | 10-03-2013 |
20140073089 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package includes a substrate having an upper and a lower surface and including: at least a first contact pad; a non-optical sensor chip disposed overlying the upper surface, wherein the non-optical sensor chip includes at least a second contact pad and has a first length; a protective cap disposed overlying the non-optical sensor chip, wherein the protective cap has a second length, an extending direction of the second length is substantially parallel to that of the first length, and the second length is shorter than the first length; an IC chip disposed overlying the protective cap, wherein the IC chip includes at least a third contact pad and has a third length, and an extending direction of the third length is substantially parallel to that of the first length; and bonding wires forming electrical connections between the substrate, the non-optical sensor chip, and the IC chip. | 03-13-2014 |
20150041985 | Semiconductor Device and Method of Making Wafer Level Chip Scale Package - A semiconductor device has a semiconductor wafer and a first conductive layer formed over the semiconductor wafer as contact pads. A first insulating layer formed over the first conductive layer. A second conductive layer including an interconnect site is formed over the first conductive layer and first insulating layer. The second conductive layer is formed as a redistribution layer. A second insulating layer is formed over the second conductive layer. An opening is formed in the second insulating layer over the interconnect site. The opening extends to the first insulating layer in an area adjacent to the interconnect site. Alternatively, the opening extends partially through the second insulating layer in an area adjacent to the interconnect site. An interconnect structure is formed within the opening over the interconnect site and over a side surface of the second conductive layer. The semiconductor wafer is singulated into individual semiconductor die. | 02-12-2015 |
Cherng-Kang Perng, Taipei TW
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20110159051 | Composite for Thermo-Sensitive Cell-Tissue Transplanted Scaffold and Use thereof - A composite comprising a stem cell; a biodegradable layer, which can provide an environment for the stem cell to grow and to differentiate, and; a N-isopropylacrylamide (NIPAAm), which can polymerize with the biodegradable layer and possess the temperature-responsive character for easy stripping. The present invention further provides a method for treating a patient with a skin defect, consisting of (a) providing said patient with a composite consisting of a N-isopropylacrylamide (NIPAAm) layer polymerized with a biodegradable layer containing gelatin and a layer of polypropylene (PP) non-woven, wherein a bone marrow derived mononuclear cell with CD45 negative and glycophorin A negative is cultivating on the biodegradable layer; (b) covering said composite on the skin defect of the patient; and (c) treating the composite with water below 25° C. to strip off the layer of polypropylene (PP) non-woven. | 06-30-2011 |
Cherng-Kang Perng, Taipei City TW
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20080274054 | Composite for Thermo-Sensitive Cell-Tissue Transplanted Scaffold and Use thereof - A composite comprising a stem cell; a biodegradable layer, which can provide an environment for the stem cell to grow and to differentiate, and; a N-isopropylacrylamide (NIPAAm), which can polymerize with the biodegradable layer and possess the temperature-responsive character for easy stripping. This invention also provides a method of treating a subject with a skin defect by covering the composite of the present invention on the skin defect of the subject in need of such treatment. Furthermore, using this composite with different growth factors, stem cells can be induced to differentiate into skin-related, neuronal cells, neuron, and insulin-positive cells in biodegradable scaffolds as well as transplanted graft. Finally, this invention also provides a quick and convenient method of monitoring cell growth or tissue engineering in an animal. | 11-06-2008 |
20130238092 | Composite for Thermo-Sensitive Cell-Tissue Transplanted Scaffold and Use thereof - A composite comprising a stem cell; a biodegradable layer, which can provide an environment for the stem cell to grow and to differentiate, and; a N-isopropylacrylamide (NIPAAm), which can polymerize with the biodegradable layer and possess the temperature-responsive character for easy stripping. The present invention further provides a method for treating a patient with a skin defect, consisting of (a) providing said patient with a composite consisting of a N-isopropylacrylamide (NIPAAm) layer polymerized with a biodegradable layer containing gelatin and a layer of polypropylene (PP) non-woven, wherein a bone marrow derived mononuclear cell with CD45 negative and glycophorin A negative is cultivating on the biodegradable layer; (b) covering said composite on the skin defect of the patient; and (c) treating the composite with water below 25° C. to strip off the layer of polypropylene (PP) non-woven. | 09-12-2013 |
Chiy-Ferng Perng, Taipei City TW
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20090259835 | SYSTEM AND METHOD FOR TRACKING AND RECORDING SYSTEM CONFIGURATIONS OF ELECTRONIC DEVICES - A system for tracking and recording system configurations of an electronic device includes: a storage device; and a microprocessor, for checking whether a current system configuration of the electronic device is different from a first reference configuration of the electronic device, and storing the current system configuration into the storage device if the current system configuration is different from the first reference configuration. | 10-15-2009 |
20100017590 | Method and Related Computer System Capable of Executing Programs for a Computer System - A method capable of executing programs for a computer system operating in a shut down state includes generating a control instruction while a key of the computer system is pressed down; storing the control instruction; and performing actions according to the control instruction when the computer system is booted up. | 01-21-2010 |
Chiy-Ferng Perng, Shulin City TW
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20120081891 | Structure of light tube - A structure of light tube includes a main body, a power supply module, and at least one light emission element. The main body has first and second heat dissipation zones and an accommodation chamber. The main body has two ends respectively and electrically connected to two conductive terminals. The power supply module is received and retained in the accommodation chamber of the main body. The power supply module includes an enclosure forming a receiving space in which a power supply device is received and retained. The light emission element is coupled to the main body so that heat from the light emission element is directly drained through the main body, while the power supply dissipates heat through natural air flows without relying on the main body, so that there parts do not cause thermal interference with each other and the performance of heat dissipation is improved to thereby extend the lifespan of the light tube. Further, the light emission element and the power supply are of modularized arrangements, which allow the users to conduct maintenance and repairing operation with simple tools by themselves. | 04-05-2012 |
Chiy-Ferng Perng, Taipei TW
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20090077436 | METHOD FOR RECORDING MEMORY PARAMETER AND METHOD FOR OPTIMIZING MEMORY - The invention relates to a method for recording a memory parameter and a method for optimizing a memory. In the invention, adjusted enhancement parameter data can be stored in a non-volatile memory of a memory module. Then, the setting value of a parameter of a memory module is portable, and users can write the needed setting value of the memory parameter into the non-volatile memory of the memory module. In other words, in the invention, no matter whether the memory module is applied to the same computer or not, the enhancement parameter data can be applied to prevent the users from repeatedly setting the memory parameter of the memory module in different computers. | 03-19-2009 |
20090112941 | COMPUTER SYSTEM AND FIRMWARE RECOVERY METHOD FOR COMPUTER SYSTEM - A firmware recovery method for a computer system including the following steps is provided. The computer system enters a firmware recovery mode. It is determined whether a display unit initial firmware is stored in a non-volatile memory. While the display unit initial firmware is not completely stored in the non-volatile memory, the display unit initial firmware is read from a storage apparatus for initializing a display unit. The display unit displays a firmware recovery hint. A complete initial firmware is read from the storage apparatus and then stored to the non-volatile memory. Finally, the computer system is turned on again. | 04-30-2009 |
20090174718 | SETTING METHODS AND MOTHERBOARD FOR DISPLAY PARAMETERS - Setting methods and motherboard for display parameters are provided. A display card is sought. If the display card is identified, a default parameter for display is accessed and stored to a BIOS via a bus. Then, the default parameter is adjusted to a modified parameter. After the default parameter is adjusted to the modified parameter, the display card accesses and executes the modified parameter. | 07-09-2009 |
20090282235 | METHOD, ELEMENT AND CIRCUIT BOARD FOR CONTROLLING SHUTDOWN OF ELECTRONIC DEVICE - The invention provides a method, an element and a circuit board for controlling an electronic device to be shut down. The method according to the invention includes the steps as follows. First, a power control signal is received, and the duration of the power control signal at a preset signal level is calculated. Then, whether the duration is greater than a threshold value is determined. If yes, an interrupt signal is generated and transmitted to a processing module of the electronic device to drive the processing module to set the preset mechanism of the electronic device according to the interrupt signal. | 11-12-2009 |
20110029816 | PERSONAL COMPUTER DIAGNOSTIC TEST BEFORE EXECUTING OPERATING SYSTEM - A personal computer component diagnostic method is executed to recognize the status or potential problems of a computer before executing an operating system. The personal computer component diagnostic method comprising: calling a BIOS program; executing a component basic diagnostic program; and executing a component functional test after executing a predetermined step. The component functional test includes a CPU MSR/MTRR test, a hard disk S.M.A.R.T. test, a boot path test and a PCI device scanning test. | 02-03-2011 |
Chiy-Ferng Perng, New Taipei City TW
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20120281387 | Structure of light-emitting diode - A structure of light-emitting diode includes a base, a circuit board, at least one light emission chip, a light-transmitting resin layer, and a light adjustment film. The base forms a cavity. The circuit board is mounted at a bottom of the cavity. The light emission chip is electrically connected to the circuit board. The light-transmitting resin layer is received in the cavity and bonded to the circuit board to encapsulate the light emission chip. The light adjustment film is separately provided and is set on a top of the light-transmitting resin layer and contains therein uniformly distributed powders of phosphor to allow the light-emitting diode to project uniform light. As such, the light adjustment film is made separately to facilitate uniform distribution of phosphor and thus helps improving quality of customized product to have the color light emitting therefrom according to a desired specification and concentrated, and also facilitating encapsulation operation to form light-emitting diodes that give off different color lights. | 11-08-2012 |
20140239326 | LIGHT EMITTING DIODE BACKLIGHT MODULE - A light emitting diode (LED) backlight module includes a transparent conductive substrate that has an electrode-bearing surface and a plurality of transparent conductive electrodes disposed on the electrode-bearing surface, an LED chip that is welded on the transparent conductive electrodes by flip-chip packaging techniques, and a reflecting member that is spaced apart from and that corresponds in position to the LED chip so as to reflect light generated from the LED chip to the transparent conductive substrate. | 08-28-2014 |
Dung-Ching Perng, Tainan City TW
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20120167979 | THIN FILM SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a thin film solar cell, which comprises: a substrate; a first electrode disposed on the substrate; a barrier layer disposed on the first electrode, wherein the material of the barrier layer is a conductive material; an ohmic contacting layer disposed on the barrier layer; an absorption layer disposed on the ohmic contacting layer; a buffer layer disposed on the absorption layer; a transparent conductive layer disposed on the buffer layer; and a second electrode disposed on the transparent conductive layer. In addition, the present invention also provides a method for manufacturing the aforementioned thin film solar cell. | 07-05-2012 |
Jiin-Shing Perng, Hsinchu County TW
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20120168839 | POWER DEVICE PACKAGE STRUCTURE - The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate. | 07-05-2012 |
Jyi-Ching Perng, Hukou Township TW
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20130061756 | ADSORPTION UNIT, ADSORTION DEVICE, AND METHOD FOR REGENERATING THEREOF - An adsorption unit is provided, including an electrical heating substrate defined with a fluid channel therein, and an adsorptive material layer formed on the electrical heating substrate to contact the fluid channel for adsorbing moisture or volatile organic compounds (VOCs) in a gas flow through the fluid channel. | 03-14-2013 |
Jyi-Ching Perng, Hsinchu County TW
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20130047631 | WATER DISPENSER - A water dispenser including a water inlet system, a drinking water storage system, a heat-exchange water system, a refrigeration system, a heating system and a water outlet system is provided. The drinking water storage system connects the water inlet system. The refrigeration system connects the drinking water storage system and has a water cooling tank and a first thermoelectric element. The cooling side of the first thermoelectric element contacts the water cooling tank. The heating system connected the drinking water storage system has a low-temperature water heating tank and a second thermoelectric element. A heating side of the second thermoelectric element contacts the low-temperature water heating tank. The heat-exchange system connects the water inlet system, a heating side of the first thermoelectric element and a cooling side of the second thermoelectric element. The water outlet system connects the refrigeration system and the heating system. | 02-28-2013 |
20130312426 | DRINKING DISPENSER AND THERMOELECTRIC HEAT PUMP APPARATUS THEREOF - A drinking dispenser has a warm water container; a hot water container coupled to the warm water container; a water supplying apparatus separately coupled to the warm water container and the hot water container; and a thermoelectric heat pump apparatus, configured with a pump that is arranged coupling to the water container and a thermoelectric module in respective coupled to the water container and the pump. | 11-28-2013 |
Li -Hsiang Perng, Kaohsiung TW
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20140198508 | WIDE-ANGLE ILLUMINATION DEVICE - Disclosed is a wide-angle illumination device including a base, a conical structure, a fixing structure, at least one light emitting diode and a lampshade, and the fixing structure is provided for fixing the conical structure onto the base, and the conical structure has at least three triangular sides and a top, and the light emitting diodes are disposed on the top and each side respectively. The top and each side are aligned towards different directions to form projection surfaces of different angles and expand the illumination range of the light emitting diodes, so as to achieve a wide-angle illumination effect while enhancing the luminance and the light uniformity. | 07-17-2014 |
Li-Hsiang Perng, Fongyuan City TW
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20100062333 | Plastics electrode material and secondary cell using the material - A plastics electrode material includes a mixture having a nitrogen-containing conductive polymer and a conductive carbon material mixed with the polymer. The polymer is polyquinoline, polyphenylquinoxaline, polycarbazole, polypyridine, polypyrrole, polyaniline or polyindole. The conductive carbon material is 1% to 40% by weight of the mixture. The mixture is activated by a 0.2 M to 5 M proton-containing acidic electrolytic solution. The present invention further comprises second cells using the plastics electrode material. Because the conductive carbon material and high concentration acidic electrolytic solution are added to the polymer, the plastics electrode material has a high conductivity. Thus, the secondary cells have a high efficiency of charging and discharging and a long cyclic life. | 03-11-2010 |
Ming-Han Perng, New Taipei City TW
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20160118160 | Wire Structure Improvement - A wire structure improvement comprises a first ground layer on which a first insulation layer is placed and plural transmission conductors and plural ground conductors are orderly arranged in the first insulator next to the first ground layer. A second insulation layer is disposed on the transmission conductors and the ground conductors opposite to the first insulation layer, and a second ground layer is disposed on the second insulator. The first ground layer and the second ground layer are interconnected through the ground conductors. In general, the structure improvement of the wire features cost down, boosting production pace and transmission rate and diminishing electromagnetic interference, radio interference and common mode impedance. | 04-28-2016 |
Ming-Han Perng, Taipei County TW
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20090243935 | PLANE SUPER WIDE BAND COUPLING ANTENNA - A plane super wide band coupling antenna comprises an isolating substrate for installing with a metal thin film layer by printing; a first radiating portion being a metal thin film layer printed upon the isolating substrate; the first radiating portion having a coupling section and being extended with a feeding point; a second radiating portion being a metal thin film layer printed upon the isolating substrate; the second radiating portion extending from a ground portion on the isolating substrate and being a bended structure; the second radiating portion being formed with gaps with the first radiating portion; the ground portion being formed by a metal thin film layer; one end thereof being electrically connected to the second radiating portion; a signal feeding wire being a coaxial cable; and the main signal wire of the signal feeding wire being electrically connected to the feeding point of the first radiating portion. | 10-01-2009 |
Ming-Han Perng, Taipei Hsien TW
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20090096675 | SUPER WIDE BANDWIDTH COUPLING ANTENNA - A super wide bandwidth coupling antenna comprises a first radiation portion made of electric conductor; the first radiation having a body and a feeding frame extending from a body of the first radiation portion; a second radiation portion formed by an electric conductor; a supporting frame extending from a body of the second radiation portion; a ground portion made of electric conductor; one end of the ground portion being connected to the supporting frame of the second radiation portion; a signal feeding wire having a main signal end wire which is electrically connected to the feeding frame of the first radiation portion; a ground end wire of the signal feeding wire being electrically connected to the ground portion; an isolation post for positioning the first radiation portion and second radiation portion with an insulating gap between the first radiation portion and second radiation portion. | 04-16-2009 |
Ming-Hwei Perng, Hsinchu City TW
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20080272781 | Q-SPACE SAMPLING METHOD AND DIFFUSION SPECTRUM IMAGING METHOD EMPLOYING THE SAME - A q-space sampling method includes: (a) receiving a required sampling number and a range of sampling region in q-space set by a user; (b) obtaining a sampling interval by iteration using a regular non-rectangular sampling lattice when an actual sampling number converges to the required sampling number; and (c) obtaining positions of sampling data in q-space based on the sampling interval and the regular non-rectangular sampling lattice. A diffusion spectrum imaging method using the q-space sampling method is also disclosed. | 11-06-2008 |
20110046838 | AUTOMATIC SEARCH SYSTEM AND METHOD - An automatic search system and a method for assisting a mobile apparatus to search for a matching device are provided. The automatic search method includes the following steps. First, N sets of consecutive images are captured at N time points respectively when the mobile apparatus moves along a first direction. The N is a positive integer greater than 1. Next, the N sets of consecutive images are received, and several image features of the N sets of images are compared, so as to determine accordingly whether the matching device exists in the first direction. If it is determined that the matching device exists, a route signal and an adjustment signal are generated. Next, according to the route signal, the mobile apparatus is controlled to move to an adjacent position of the matching device. Also, according to the adjustment signal, the mobile apparatus is controlled to be combined with the matching device. | 02-24-2011 |
20110074927 | METHOD FOR DETERMINING EGO-MOTION OF MOVING PLATFORM AND DETECTION SYSTEM - A method for determining ego-motion of a moving platform and a system thereof are provided. The method includes: using a first lens to capture a first and a second left image at a first and a second time, and using a second lens to capture a first and a second right image; segmenting the images into first left image areas, first right image areas, second left image areas, and second right image areas; comparing the first left image areas and the first right image areas, the second left image areas and the second right image areas, and the first right image areas and the second right image areas, so as to find plural common areas; selecting N feature points in the common areas to calculate depth information at the first and the second time, and determining the ego-motion of the moving platform between the first time and the second time. | 03-31-2011 |
20110085026 | DETECTION METHOD AND DETECTION SYSTEM OF MOVING OBJECT - A detection method of a moving object is provided. The method includes: using a left lens system to capture a first and a second left image, and using a right lens system to capture a first right image and a second right image; subdividing the first right image into plural color blocks; selecting N control points on the first left image, and searching M first corresponding points in the first right image; calculating first depth information according to the control points and the first corresponding point, and calculating a possible area in the second right image to search P second corresponding points; using the first corresponding points and the second corresponding points to calculate a two-dimensional planar conversion parameter, and converting pixels in the color block to new positions to obtain a converted image; and identifying a difference area between the second right image and the converted image as an area. | 04-14-2011 |
Ruey Kuen Perng, Zhubei City TW
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20130191805 | Simulation Of Circuits With Repetitive Elements - Aspects of the invention relate to simulation of circuits with repetitive elements. With various implementations of the invention, a circuit design for simulation is analyzed to derive information of memory-circuit device groups that comprise word-line-driven device groups. If the circuit design is hierarchically structured, the circuit design is flattened to the device level but keep the memory-circuit device groups intact. The circuit design is then partitioned into a plurality of subcircuits for simulation. During transient simulation, whether an instance of a word-line-driven device group is activated is first determined. If activated, whether device model values exist for the word-line-driven device group at a voltage state associated with the activated instance is then determined. If they exist, the device model values are associated with the activated instance. If they do not exist, the device model values are computed for, stored for and associated with the activated instance. | 07-25-2013 |
Shin-Yao Perng, Hisinchu TW
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20100079247 | RADIO FREQUENCY IDENTIFICATION COMMUNICATION SYSTEM AND METHOD THEREOF - A radio frequency identification (RFID) communication system and method is provided to resolve the power-consuming problems of an active RFID tag while operating at a receiving mode in a long duration. A designated channel is established between the reader and the RFID tag, and also the reader sends a designated message so that the actuated active RFID tag can receive the designated messages and dynamically enter into a receiving mode. Therefore, normal communications may be conducted between the reader and the RFID and the usage period or technical performance can be improved as well. | 04-01-2010 |
Shwu-Huey Perng, Hsinchu County TW
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20100133179 | SYSTEM AND METHOD FOR TREATING WASTEWATER CONTAINING AMMONIA - Treatment system for wastewater containing ammonium is provided. The treatment system of the present invention includes an ammonia oxidation reactor and a membrane reactor disposed on the back of the ammonia oxidation reactor. The ammonia oxidation reactor includes biological carriers for carrying the ammonium oxidation bacteria and nitrite oxidation bacteria, a pH level controller for increasing the pH level to above 7.5, and a DO (dissolved oxygen) controller for reducing the DO content to less than 1.0 mg/L. The membrane reactor composed of a membrane and an aerator is used to separate the solids and liquids of the effluent of the ammonia oxidation reactor. In addition, a method for treating wastewater containing ammonium is also provided. | 06-03-2010 |
20100163482 | SYSTEM AND METHOD FOR TREATING AMMONIA-BASED WASTEWATER - A system for treating ammonia-based wastewater is provided. The system includes a first reactor, including: denitrification bacteria for denitrification; a second reactor disposed on the back of the first reactor, wherein the second reactor includes an aerator and aerobic heterotrophic bacteria, and has an HRT of less than 6 hours; a third reactor disposed on the back of the first reactor, wherein the third reactor contains nitrification bacteria carried on the carriers for improving nitrification; and a solid-liquid-separating reactor disposed on the back of the third for separating the solids and liquids in the effluent of the third reactor. | 07-01-2010 |
Tsong-Pyng Perng, Hsinchu City TW
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20160067697 | Nanoporous Thin Film and Method for Fabricating the Same - The present invention relates to a nanoporous thin film and a method for fabricating the same. The nanoporous thin film fabricating method for fabricating a nanoporous thin film with a composite photocatalyst structure for a photodegradation and a water purification includes providing a porous substrate with a plurality of through-nanopores therein, each of which through-nanopores have an inner tube wall; forming an oxide-based photocatalyst layer over the porous substrate and the inner tube wall by using a first chemical-based deposition process; and forming a metal-based photocatalyst layer on a part of the oxide-based photocatalyst layer by using a second chemical-based deposition process. | 03-10-2016 |
Tsong-Pyng Perng, Jhongli City TW
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20080248367 | FUEL CELL MODULE COMPATIBLE WITH A DRY CELL - The present invention provides a fuel cell module compatible with a dry cell. The fuel cell module includes an enclosure, a power generating unit, a hydrogen storage unit and positive/negative output ends. The hollow enclosure has an internal space, and is provided with some preset through-holes, allowing external oxygen to enter into the space. The power generating unit and hydrogen storage unit are mounted into the space of the enclosure. Positive and negative output ends are placed at both sides or adjacent at one side of the enclosure, thereby guiding the positive and negative charge generated by the power generating unit; since the fuel cell modules are compatible with existing conventional dry cells. These modules are widely applied to existing electrical or electronic products. | 10-09-2008 |
Tsu-Hsiu Perng, Zhubei City TW
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20140206161 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A CAPPING LAYER - A method of semiconductor device fabrication includes forming a first dummy gate structure in a first region of a semiconductor substrate and forming a second dummy gate structure in a second region of the semiconductor substrate. A protective layer (e.g., oxide and/or silicon nitride hard mask) is formed on the second dummy gate structure. The first dummy gate structure is removed after forming the protective layer, thereby providing a first trench. A capping layer (e.g., silicon) is formed in the first trench. A metal gate structure may be formed on the capping layer. The protective layer may protect the second dummy gate structure during the removal of the first dummy gate structure. | 07-24-2014 |
20140239354 | FinFETs and Methods for Forming the Same - A finFET and methods for forming a finFET are disclosed. A structure comprises a substrate, a fin, a gate dielectric, and a gate electrode. The substrate comprises the fin. The fin has a major surface portion of a sidewall, and the major surface portion comprises at least one lattice shift. The at least one lattice shift comprises an inward or outward shift relative to a center of the fin. The gate dielectric is on the major surface portion of the sidewall. The gate electrode is on the gate dielectric. | 08-28-2014 |
20150031182 | METHOD OF MANUFACTURING A FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE - A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a semiconductor substrate; a fin structure disposed over the semiconductor substrate; and a gate structure disposed over a portion of the fin structure. The gate structure traverses the fin structure and separates a source region and a drain region of the fin structure, the source and drain region defining a channel therebetween. The source and drain region of the fin structure include a strained source and drain feature. The strained source feature and the strained drain feature each include: a first portion having a first width and a first depth; and a second portion disposed below the first portion, the second portion having a second width and a second depth. The first width is greater than the second width, and the first depth is less than the second depth. | 01-29-2015 |
20150270401 | Combination FinFET and Methods of Forming Same - An embodiment fin field effect transistor (finFET) includes a fin extending upwards from a semiconductor substrate and a gate stack. The fin includes a channel region. The gate stack is disposed over and covers sidewalls of the channel region. The channel region includes at least two different semiconductor materials. | 09-24-2015 |
Tsu-Hsiu Perng, Hsin-Chu TW
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20120012932 | FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE AND METHOD OF MANUFACTURING SAME - A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a semiconductor substrate; a fin structure disposed over the semiconductor substrate; and a gate structure disposed on a portion of the fin structure. The gate structure traverses the fin structure and separates a source region and a drain region of the fin structure, the source and drain region defining a channel therebetween. The source and drain region of the fin structure include a strained source and drain feature. The strained source feature and the strained drain feature each include: a first portion having a first width and a first depth; and a second portion disposed below the first portion, the second portion having a second width and a second depth. The first width is greater than the second width, and the first depth is less than the second depth. | 01-19-2012 |
20130307088 | METAL GATE FINFET DEVICE AND METHOD OF FABRICATING THEREOF - A method and device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer. | 11-21-2013 |
20150115372 | METAL GATE FINFET DEVICE - A device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer. | 04-30-2015 |
Woei-Luen Perng, Taipei City TW
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20130162567 | METHOD FOR OPERATING TOOL LIST AND PORTABLE ELECTRONIC DEVICE USING THE SAME - A method for operating a tool list applied to a portable electronic device is provided. The portable electronic device comprises a display surface including an operation area and a tool control area. The tool control area includes a tool list for receiving a tool selection signal. The method for operating the tool list includes following steps: receiving a first control signal by the display surface, wherein the first control signal is different from the tool selection signal, and disabling the tool list according to the first control signal. A portable electronic device using the method described above is also disclosed. | 06-27-2013 |
Wuu-Haur Perng, Longtan Township TW
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20120078543 | LIQUID-LEVEL GAUGE TESTING DEVICE AND TESTING METHOD THEREOF - A liquid-level gauge testing device includes a table, a height control unit, an indicator unit, and a liquid container. The height control unit includes a displacement mechanism mounted on the table and a carrier coupled with the displacement mechanism to move upward and downward. The indicator unit is mounted on the table and coupled with the carrier. The liquid container is arranged below the carrier. By providing the table, the height control unit, the indicator unit, the container and other relevant components, the liquid-level gauge testing device is able to provide increased testing accuracy with simplified testing procedures and reduced testing time. A liquid-level gauge testing method is also disclosed. | 03-29-2012 |
Yi-Wen Perng, Hsinchu City TW
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20110179898 | SENSORLESS ADAPTIVE SAFETY ACTUATOR (SASA) - One aspect of the instant disclosure is to provide a sensorless adaptive safety actuator. The safety actuator comprises a driving unit, a transmission unit coupled to the driving unit, and an output unit coupled to the transmission unit. The transmission unit comprises a load-adaptable retracting mechanism. When the output unit experiences a mechanical load exceeding a critical value, the load-adaptable retracting mechanism causes the transmission unit to decouple from the driving unit. Thus, responding to an accident where the impact on the output unit causes a force/torque overload, the instant safety actuator is capable of effectively stopping the force/torque transmission to the work output device without the use of active sensors. | 07-28-2011 |
Yung-Yih Perng, Taipei TW
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20110282983 | Multimedia Communication Device Within Cloud Computing Techniques - The present invention provides an improved multimedia communication device within cloud computing techniques including a display mechanism for multimedia playing; an operation mechanism linking with the display mechanism for interpretation and implementation of the display mechanism; and a servo mechanism linking with the display mechanism for certification program of the operation mechanism and transmission of the list of multimedia service to the display mechanism; thus, the multimedia playing frequency channel located in our server cloud computing is detected at any time and the contents of the frequency channel are updated immediately; not only the needed frequency channel is quick found by an user, but also it ensures that all frequency channels located in our server cloud computing are normally linked by the user. | 11-17-2011 |
Yuping Perng, Taipei TW
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20080252493 | Method of setting specific scan codes for manual input device - A method of setting specific scan codes for a manual input device includes the steps of establishing a transmission channel between the manual input device and a scan code register of a computing device, receiving at least one scan code, which corresponds to at least one input key of the manual input device and is for setting a customized specific code for enabling the computing device to perform a specific function, from the manual input device, saving the customized specific code to the scan code register of the computing device, and closing the transmission channel. | 10-16-2008 |