Patent application number | Description | Published |
20140118741 | METHOD OF DETECTING MOLECULES AND OPTICAL SENSOR - The present disclosure relates to an example method and optical sensor for detecting molecules of a particular substance by means of an optical sensor. Such an example method may include bringing the sensor into contact with a fluid to be analyzed, coupling light of a first wavelength into an optical resonator of the optical sensor, coupling light of a second wavelength into the same resonator or into a second optical resonator of the optical sensor, detecting, for each of the first and the second wavelengths, an optical signal coupled out of an optical path containing the respective resonator, varying an optical length of the respective resonator or the respective wavelength and detecting a broadening of this resonance indicating an absorption of the light fed into the respective resonator by molecules accumulated at the active layer of this resonator. | 05-01-2014 |
20140253917 | OPTICAL RESONATOR FOR SENSOR ARRANGEMENT AND MEASURING METHOD - A sensor arrangement including a light source, a first optical element, a second optical element, a first photo detector, and a second photo detector. The light source is optically coupled to the first optical element that is optically coupled to the second optical element. The first photo detector is optically coupled to the first optical element for detecting a first component of the part of the light which is not transmitted by the second optical element, and the second photo detector is optically coupled to the second optical element for detecting a second component of the part of the light which is transmitted by the second optical element. One of the first and the second optical elements is an optical filter and the other is a sensor element, where the sensor element or the filter is tunable. | 09-11-2014 |
20140326858 | OPTICAL SENSOR ARRANGEMENT AND METHOD FOR MEASURING AN OBSERVABLE - An optical sensor arrangement for measuring an observable including at least one light source for generating a first light component of a first frequency including a first mode and a second light component of a second frequency including a second mode orthogonal to the first mode, an optical resonator having differing optical lengths for the first and second modes, at least one of the optical lengths being variable depending on the observable and a dependence of the respective optical length being different for the first and second modes, and a detector unit coupled to the optical resonator for coupling out the two light components and being configured for detecting a frequency difference between a resonance frequency of the optical resonator for the first mode and a resonance frequency of the optical resonator for the second mode. | 11-06-2014 |
Patent application number | Description | Published |
20140265392 | WAFER HANDLING APPARATUS - Disclosed is a wafer support and alignment apparatus. The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer. The wafer support component includes at least one flat portion to support the wafer, at least one alignment lip portion protruding upward from the at least one flat portion, and at least one recessed pocket carved out of a portion of the at least one base portion. The at least one recessed pocket is adapted to receive at least one pad. | 09-18-2014 |
20140265393 | WAFER HANDLING APPARATUS - Disclosed is an end effector apparatus including a base including a wrist coupling component. The base may be substantially triangular in shape. A plurality of fingers extends from the base. Each finger includes a plurality of wafer support pads for supporting wafers being processed. Each finger has a width dimension, a height dimension and a length dimension, wherein the height dimension tapers smaller along at least a tip portion of the finger. | 09-18-2014 |
20140265394 | COMPOSITE END EFFECTORS - An end effector includes a base, a plurality of fingers extending from the base, and a plurality of pads disposed on each of said fingers to support a substrate. The fingers comprise a carbon fiber material and taper from a first diameter and first wall thickness proximate said base to a second diameter smaller than said first diameter and second wall thickness smaller than said first wall thickness distal said base. A method includes adhering a plurality of pads along a plurality of tapered fingers, and adhering proximal ends of the plurality of tapered fingers with corresponding recesses of a base. The assembled pads, tapered fingers and base are placed on a fixture such that top surfaces of the plurality of pads rest on a top surface of the fixture and the assembly is held in place on the fixture until the adhesive has cured at room temperature. | 09-18-2014 |
20150060433 | HIGH TEMPERATURE PLATEN POWER CONTACT - A heated platen having a heating element and an electrical contact assembly for the heating element is generally described. Various examples provide a dielectric plate including a heating element and a terminal disposed therein. An electrical connection assembly configured to connect the heating element to a power source is also provided. The electrical connection including an electrical connection plug, a conductive sleeve disposed within the electrical connection plug, and a connector pin having a bottom portion and a top portion, the bottom portion disposed within the sleeve, the top portion having a spring structure, the spring structure configured to maintain electric contact with the terminal throughout a range of temperatures. | 03-05-2015 |