Patent application number | Description | Published |
20140151704 | Method, System, and Apparatus for Preparing Substrates and Bonding Semiconductor Layers to Substrates - Embodiments of preparing substrates for subsequent bonding with semiconductor layer are described herein. A substrate may be prepared with one or more chemicals or a sacrificial layer to limit or remove substrate contaminants and reduce substrate surface damage. Other embodiments may be described and claimed. | 06-05-2014 |
20140171010 | Semiconductor Devices with Switchable Ground-Body Connection - Semiconductor devices with switchable connection between body and a ground node are presented. Methods for operating and fabricating such semiconductor devices are also presented. | 06-19-2014 |
20140184334 | Optimization Methods for Amplifier with Variable Supply Power - Optimization methods via various circuital arrangements for amplifier with variable supply power are presented. In one embodiment, a switch can be controlled to include or exclude a feedback network in a feedback path to the amplifier to adjust a response of the amplifier dependent on a region of operation of the amplifier arrangement (e.g. linear region or compression region). | 07-03-2014 |
20140184336 | Amplifier Dynamic Bias Adjustment for Envelope Tracking - An envelope tracking amplifier having stacked transistors is presented. The envelope tracking amplifier uses dynamic bias voltages at one or more gates of the stacked transistors in addition to a dynamic bias voltage at a drain of a transistor. | 07-03-2014 |
20140184337 | Control Systems and Methods for Power Amplifiers Operating in Envelope Tracking Mode - Control systems and methods for power amplifiers operating in envelope tracking mode are presented. A set of corresponding functions and modules are described and various possible system configurations using such functions and modules are presented. | 07-03-2014 |
20140264625 | Merged Active Devices on a Common Substrate - Merged active devices on a common substrate are presented. Methods for operating and fabricating such merged active devices are also presented. | 09-18-2014 |
20140266383 | Self-Activating Adjustable Power Limiter - A fast response time, self-activating, adjustable threshold limiter including a limiting element LE, a first coupling element CE | 09-18-2014 |
20140266433 | Systems and Methods for Optimizing Amplifier Operations - Methods and systems for optimizing amplifier operations are described. The described methods and systems particularly describe a feed-forward control circuit that may also be used as a feed-back control circuit in certain applications. The feed-forward control circuit provides a control signal that may be used to configure an amplifier in a variety of ways. | 09-18-2014 |
20140266455 | VARIABLE IMPEDANCE MATCH AND VARIABLE HARMONIC TERMINATIONS FOR DIFFERENT MODES AND FREQUENCY BANDS - An amplifier with switchable and tunable harmonic terminations and a variable impedance matching network is presented. The amplifier can adapt to different modes and different frequency bands of operation by appropriate switching and/or tuning of the harmonic terminations and/or the variable impedance matching network. | 09-18-2014 |
20140292086 | Dual Supply Override - A monolithically integrated circuit with one or more supply overrides without need of an override control pin to the IC is presented. The internal circuitry to control such an override is presented and various override conditions are also presented. | 10-02-2014 |
20140292398 | Systems and Methods for Generation of Internal Chip Supply Bias from High Voltage Control Line Inputs - Systems and methods for generating internal chip supply bias from high voltage control line inputs are presented. One of a plurality of the high voltage control lines is selected and accordingly internal path switching circuitry is enabled to pass the selected high voltage control line while protecting the associated components from over-stress. | 10-02-2014 |