Patent application number | Description | Published |
20120019980 | PILLAR TYPE CAPACITOR OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - An embodiment of the invention includes a pillar type capacitor where a pillar is formed over an upper portion of a storage node contact. A bottom electrode is formed over sidewalls of the pillar, and a dielectric film is formed over pillar and the bottom electrode. A top electrode is then formed over the upper portion of the dielectric film. | 01-26-2012 |
20120098132 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device with a stable structure having high capacitance by changing the pillar type storage node structure and a method of manufacturing the same are provided. The method includes forming a sacrificial layer on a semiconductor substrate including a storage node contact plug, etching the sacrificial layer to form a region exposing the storage node contact plug, forming a first conductive material within an inner side of the region, burying a second conductive material within the region in which the first conductive material is formed, and removing the sacrificial layer to form a pillar type storage node. | 04-26-2012 |
20130127013 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a semiconductor device, a support wall is formed between storage nodes to more effectively prevent leaning of a capacitor, and the storage nodes are formed using a damascene process, which may increase a contact area between each storage node and a storage node contact. | 05-23-2013 |
Patent application number | Description | Published |
20100167494 | Selective Etching Method and Method for Forming an Isolation Structure of a Memory Device - A disclosed selective etching method comprises mixing a polymer with carbon nanotubes, applying the mixture to an etching target layer to form a carbon nanotube-polymer composite layer, forming a hard mask by patterning the carbon nanotube-polymer composite layer, such that a part of the etching target layer is selectively exposed, and selectively etching the etching target layer exposed through the hard mask. The polymer preferably includes a photoresist. Also disclosed is a method for forming an isolation structure of a memory device using the selective etching method. | 07-01-2010 |
20100209824 | PHOTOMASK - A photomask that includes an assistant pattern is provided. The photomask comprises a target pattern transcribed over a wafer by an exposing process, and an assistant pattern formed symmetrically with a main pattern of the target pattern based on the outer pattern of the target pattern, thereby minimizing the loss of the outer pattern and maximizing the process margin in the defocus environment. | 08-19-2010 |
20140042632 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The semiconductor device includes a semiconductor substrate including a first region straightly connected to a cell string region and a second region adjacent to the first region, a first conductive pattern having a first pitch in the first region, a second conductive pattern connected to the first conductive pattern in the first region and having a structure in which S shaped characters are continuously connected in a zigzag shape, and a third conductive pattern spaced from the second conductive pattern in the second region and having an essentially oval shape in which a central portion thereof is divided. An exposure process margin is improved in an X-decoder region and a failure such as a bridge is reduced to improve characteristics of the semiconductor device. | 02-13-2014 |
Patent application number | Description | Published |
20090101955 | MOLECULAR ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME - A molecular electronic device, and a method of fabricating the same, includes a first electrode having a plurality of prominences and depressions on which a plurality of molecules are self-assembled. Capacitance of a molecular electronic device used as a capacitor is increased by forming prominences and depressions on the surface of the first electrode thereby enabling more molecules to be self-assembled on the surface of the lower electrode. | 04-23-2009 |
20120112339 | SEMICONDUCTOR DEVICE - A semiconductor device and a method of forming the same are disclosed, which forms a low-dielectric-constant oxide film only at a peripheral part of a bit line conductive material, resulting in reduction in parasitic capacitance of the bit line. The semiconductor device includes a bit line formed over a semiconductor substrate, a first spacer formed over sidewalls of the bit line, and a second spacer formed over sidewalls of the first spacer, configured to have a dielectric constant lower than that of the first spacer. | 05-10-2012 |
20130154101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and a method for manufacturing the same are disclosed. In the semiconductor device, an upper part of a storage node contact plug is increased in size, and an area of overlap between a storage node formed in a subsequent process and a storage node contact plug is increased, such that resistance of the storage node contact plug is increased and device characteristics are improved. The semiconductor device includes at least one bit line formed over a semiconductor substrate, a first storage node contact plug formed between the bit lines and coupled to an upper part of the semiconductor substrate, and a second storage node contact plug formed over the first storage node contact plug, wherein a width of a lower part of the second storage node contact plug is larger than a width of an upper part thereof. | 06-20-2013 |
Patent application number | Description | Published |
20120131258 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD FOR OPERATING THE SAME - A semiconductor memory apparatus includes, inter alia, a master chip and a plurality of slave chips. Each of the slave chips includes a plurality of banks. A first reception signal, a first timing signal, a bank address signal, and a slice selection signal to the slave chips may be provided by a master chip. The slave chips include a slice determining unit configured to compare the slice selection signal and a slice code and generate a slice enable signal, and a bank selecting unit configured to receive the bank address signal in response to the first reception signal and the slice enable signal and generate a bank enable signal in response to the bank address signal and the first timing signal. | 05-24-2012 |
20140374923 | SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR SYSTEM - Provided is a semiconductor apparatus including a plurality of semiconductor chips coupled through an electrical coupling unit. Each of the semiconductor chips includes: a chip ID signal generation unit configured to generate a chip ID signal; and a chip enable signal generation unit configured to receive a clock enable signal in response to the chip ID signal, wherein one of the semiconductor chips shares the received clock enable signal as a transfer clock enable signal with the other semiconductor chips, and the chip enable signal generation unit detects whether or not an error occurs in the chip ID signals of the plurality of semiconductor chips, selects any one of the transfer clock enable signal and the clock enable signal applied, and outputs the selected signal as a chip enable signal. | 12-25-2014 |
20150115268 | SEMICONDUCTOR APPARATUS AND TESTING METHOD THEREOF - A semiconductor apparatus having a through via to be electrically coupled with a chip includes a latch memory cell configured to be electrically coupled with the through via and receive a signal transmitted through the through via, and output a stored signal to the through via. | 04-30-2015 |
Patent application number | Description | Published |
20080230830 | NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on a semiconductor substrate in which active regions are defined by isolation layers, forming a charge trap layer on the first dielectric layer, removing the first dielectric layer and the charge trap layer over the isolation layers, forming a second dielectric layer on the isolation layers including the charge trap layer, and forming a conductive layer on the second dielectric layer. | 09-25-2008 |
20090108332 | Non-volatile memory device with charge trapping layer and method for fabricating the same - Disclosed herein are a non-volatile memory device and a method of manufacturing the same. The non-volatile memory device includes a substrate, a tunneling layer disposed on the substrate, a charge trapping layer disposed on the tunneling layer, a blocking layer disposed on the charge trapping layer, and a control gate electrode disposed on the blocking layer. The blocking layer in contact with the charge trapping layer includes an aluminum nitride layer. | 04-30-2009 |
20090108334 | Charge Trap Device and Method for Fabricating the Same - A charge trapping device includes a plurality of isolation layers, a plurality of charge trapping layers, a blocking layer, and a control gate electrode. The isolation layers define active regions, and the isolation layers and active regions extend as respective stripes along a first direction on a semiconductor substrate. The charge trapping layers are disposed on the active regions in island forms where the charge trapping layers are separated from each other in the first direction and disposed on the respective active regions between the isolation layers in a second direction perpendicular to the first direction. The blocking layer is disposed on the isolation layers and the charge trapping layers. The control gate electrode is disposed on the charge trapping layer. | 04-30-2009 |
20090114977 | NONVOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER AND METHOD FOR FABRICATING THE SAME - Disclosed herein is a nonvolatile memory device having a charge trapping layer and a method of making the same. The nonvolatile memory device includes a substrate, a tunneling layer disposed on the substrate, a charge trapping layer disposed on the tunneling layer, a first blocking layer disposed on the charge trapping layer, a second blocking layer disposed on the first blocking layer, and a control gate electrode disposed on the second blocking layer. A first band gap between the first blocking layer and the charge trapping layer is larger than a second band gap between the second blocking layer and the charge trapping layer. | 05-07-2009 |
20110204430 | NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on a semiconductor substrate in which active regions are defined by isolation layers, forming a charge trap layer on the first dielectric layer, removing the first dielectric layer and the charge trap layer over the isolation layers, forming a second dielectric layer on the isolation layers including the charge trap layer, and forming a conductive layer on the second dielectric layer. | 08-25-2011 |
Patent application number | Description | Published |
20130114349 | SEMICONDUCTOR SYSTEM INCLUDING A CONTROLLER AND MEMORY - A semiconductor system includes three or more memory chips and a controller with first and second memory buffers configured to communicate with the three or more memory chips. The first and second memory buffers alternately transmit data to sequentially communicate with the three or more memory chips. | 05-09-2013 |
20130163331 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF - A semiconductor memory device and a method of operating the same results in reduced programming time. The semiconductor memory device includes advanced circuitry that enables reductions in programming and verification times, leading to a substantial reduction in the total time required to program the device. | 06-27-2013 |
20130166853 | SEMICONDUCTOR MEMORY DEVICE AND OPERATING METHOD THEREOF - In a semiconductor memory device, when input data is latched to page buffers, first, the data is sequentially latched to even page buffers and subsequently latched to odd page buffers, and then the data is programmed to each memory cell. Thus, when data having a size of a half page or smaller is read, a read operation is performed only on even memory cells or odd memory cells, thus reducing a time required for the read operation. | 06-27-2013 |
20130294165 | SEMICONDUCTOR MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME AND CONTROL METHOD THEREOF - A semiconductor memory device includes first cell strings connected to first bit lines and second cell strings connected to second bit lines corresponding to the first bit lines, respectively. Data is stored in memory cells of the first cell strings, and the second cell strings are configured as a data non-storage region. At least one memory cell of each of the second cell strings is in a programmed state. | 11-07-2013 |
20140063950 | SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor device including a memory block, which includes memory cells coupled to bit lines. The semiconductor device further includes a first sensing circuit coupled to an even bit line and configured to sense current flow through the even bit line in response to an even bit line control signal and an even discharge signal. The semiconductor device further includes a second sensing circuit coupled to an odd bit line and configured to sense current flow through the odd bit lines in response to an odd bit line control signal and an odd discharge signal. The first sensing circuit and second sensing circuit are configured to supply a ground voltage to the odd bit line when sensing the current flow through the even bit line, and to supply the ground voltage to the even bit line when sensing the current flow through the odd bit line. | 03-06-2014 |
20140108725 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array configured to include sub memory blocks and a redundancy memory block, data line groups configured to deliver data to be programmed into the sub memory blocks and data read from the sub memory blocks, a redundancy data line group configured to deliver data to be programmed into the redundancy memory block and data read from the redundancy memory block, and switching circuits configured to couple selectively the data line groups to the redundancy data line group. | 04-17-2014 |
20140177332 | OPERATING CIRCUIT CONTROLLING DEVICE, SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device is kept in a busy state by controlling a ready/busy pad when a detection signal is output since an external voltage is less than a reference voltage, prevents generation of an operating voltage by a pump circuit by preventing generation of a pump clock, and resets a microcontroller by preventing generation of micro clock. Accordingly, the semiconductor memory device may be prevented from malfunctioning through a series of operations when the external voltage is less than the reference voltage. | 06-26-2014 |
Patent application number | Description | Published |
20090289326 | Semiconductor device and method of fabricating the same - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 11-26-2009 |
20090291542 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes: forming an etch stop pattern over a conductive layer, the etch stop pattern having a first opening exposing a top surface of the conductive layer; forming an insulation layer over the etch stop pattern; selectively etching the insulation layer to form a second opening exposing the top surface of the conductive layer; and enlarging the second opening until the etch stop pattern is exposed. | 11-26-2009 |
20120007219 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 01-12-2012 |
20120094462 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 04-19-2012 |
Patent application number | Description | Published |
20090289326 | Semiconductor device and method of fabricating the same - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 11-26-2009 |
20090291542 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes: forming an etch stop pattern over a conductive layer, the etch stop pattern having a first opening exposing a top surface of the conductive layer; forming an insulation layer over the etch stop pattern; selectively etching the insulation layer to form a second opening exposing the top surface of the conductive layer; and enlarging the second opening until the etch stop pattern is exposed. | 11-26-2009 |
20120007219 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 01-12-2012 |
20120094462 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. | 04-19-2012 |
Patent application number | Description | Published |
20100062581 | METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE - Provided is a method of fabricating a non-volatile semiconductor device. The method includes: forming a first hard mask layer over a substrate; etching the first hard mask layer and the substrate to form a plurality of isolation trenches extending in parallel to one another in a first direction; burying a dielectric layer in the isolation trenches to form a isolation layer; forming a plurality of floating gate mask patterns extending in parallel to one another in a second direction intersecting with the first direction over a resulting structure where the isolation layer is formed; etching the first hard mask layer by using the floating gate mask patterns as an etch barrier to form a plurality of island-shaped floating gate electrode trenches; and burying a conductive layer in the floating gate electrode trenches to form a plurality of island-shaped floating gate electrodes. | 03-11-2010 |
20140269039 | ELECTRONIC DEVICE AND VARIABLE RESISTANCE ELEMENT - A variable resistance element includes: first and second magnetic layers having a lanthanide series element alloyed in a nickel-iron compound; and a tunnel barrier layer interposed between the first and second magnetic layers. | 09-18-2014 |
20140281231 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - This technology relates to an electronic device and a method for fabricating the same. An electronic device in accordance with this technology includes semiconductor memory. The semiconductor memory may include a magnetization-pinned layer configured to include a first magnetic layer, a second magnetic layer, and a non-magnetic layer interposed between the first magnetic layer and the second magnetic layer, a free magnetization layer spaced apart from the magnetization-pinned layer, a tunnel barrier layer interposed between the magnetization-pinned layer and the free magnetization layer, and a magnetic spacer configured to come in contact with a side of the first magnetic layer and at least part of a side of the second magnetic layer. | 09-18-2014 |
20140299950 | ELECTRONIC DEVICES HAVING SEMICONDUCTOR MEMORY UNITS - Disclosed are electronic devices comprising a semiconductor memory unit capable of reducing the switching current of a variable resistance element for switching between different resistance states. One implementation of a disclosed electronic device may include a first magnetic layer having an easy magnetization axis in a first direction and having a variable magnetization direction, a third magnetic layer having a magnetization direction pinned in the first direction, a second magnetic layer interposed between the first magnetic layer and the third magnetic layer, and having a magnetization direction pinned in a second direction different from the first direction, a tunnel barrier layer interposed between the first magnetic layer and the second magnetic layer, and a non-magnetic layer interposed between the second magnetic layer and the third magnetic layer. | 10-09-2014 |
20150052302 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - The disclosed technology provides an electronic device and a fabrication method thereof, in which an etching margin in formation of a variable resistance element is secured and process difficulty is reduced. An electronic device according to an implementation includes a semiconductor memory, the semiconductor memory including: a variable resistance element including a stack of a first magnetic layer, a tunnel barrier layer and a second magnetic layer; a contact plug coupling a top of the variable resistance element and including a magnetism correcting layer; and a conductive line coupled to the variable resistance element through the contact plug including the magnetism correcting layer. | 02-19-2015 |
20150092480 | ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME - An electronic device includes a semiconductor memory, wherein the semiconductor memory includes: a seed layer including conductive hafnium silicate; a first magnetic layer formed over the seed layer; a tunnel barrier layer formed over the first magnetic layer; and a second magnetic layer formed over the tunnel barrier layer. | 04-02-2015 |
20150249110 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a semiconductor memory that includes: an inter-layer dielectric layer which is formed over a substrate; a contact plug which is coupled with the substrate by passing through the inter-layer dielectric layer and has a protruding portion over the inter-layer dielectric layer; a first variable resistance pattern which is formed over the contact plug; and a protective layer which covers the first variable resistance pattern and a portion of sidewalls of the contact plug in such a manner that the sidewalls of the contact plug are exposed. | 09-03-2015 |
20160079524 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a semiconductor memory that includes: a variable resistance element formed over a substrate; and a carbon-containing aluminum nitride layer formed on sidewalls and in an upper portion of the variable resistance element. | 03-17-2016 |
Patent application number | Description | Published |
20110242908 | COMMAND DECODER AND A SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME - A command decoder includes a snoop read control signal generation unit that generates a snoop read control signal from a internal chip select signal according to a level of a transmission mode control signal, and an internal snoop read command generation unit that generates an internal snoop read command by driving a first node in response to an internal command and the snoop read control signal. | 10-06-2011 |
20110299348 | SEMICONDUCTOR MEMORY DEVICE AND INTEGRATED CIRCUIT - A semiconductor memory device includes a write control signal generating circuit and a write enable signal generating unit. The write control signal generating circuit is configured to generate a write control signal activated during a time period from an input time point of a read command to an end time point of a data output time period. The write enable signal generating unit is configured to output a write command as a write enable signal in response to the write control signal. | 12-08-2011 |
20120195140 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a first pad allocated to receive a row address, a second pad allocated to discriminate a first input/output mode and a second input/output mode, a detector configured to generate a detection signal in response to logic levels of the first and second pads, and a column address controller configured to deassert a column address to a logic low level in response to a deasserted detection signal. The semiconductor integrated circuit may selectively support one of first and second memory capacities and one of the first and second input/output modes using the logic levels of the first and second pads. | 08-02-2012 |
20120254650 | SEMICONDUCTOR MEMORY APPARATUS - A semiconductor memory apparatus includes a synchronized signal generation circuit, a serial-to-parallel data conversion unit and a data storage region. The synchronized signal generation unit outputs one of a data input/output strobe signal and a delay locked clock signal as synchronized signals in response to a control signal in a write operation. The serial-to-parallel data conversion unit converts serial data into parallel data in response to the synchronized signals. The parallel data is stored in the data storage region. | 10-04-2012 |
20130051157 | SEMICONDUCTOR MEMORY DEVICE AND REFRESH METHOD THEREOF - A semiconductor memory device includes a memory core configured to sequentially activate first and second banks in response to first and second bank active signals which are sequentially enabled in response to first and second enable signals when a self-refresh operation is to be performed, select a word line by row addresses, and perform a refresh operation for memory cells which are connected with the word line; and an address counter configured to perform a counting operation for the row addresses in response to a counter signal, and interrupt the counting operation for the row addresses in a case where both the first and second banks are not activated when the self-refresh operation is ended. | 02-28-2013 |
20130315016 | COLUMN REPAIR CIRCUIT - A column repair circuit of a semiconductor memory apparatus includes a plurality of mats and performs a column repair operation to replace failed cells among a plurality of memory cells provided in the mats. The column repair circuit includes two or more fuse units configured to perform the column repair operation. Each of the fuse units includes a plurality of fuses, and is configured in such a manner that m mats correspond to one fuse or n mats correspond to one fuse, where m and n are natural numbers equal to or more than 1 and different from each other. | 11-28-2013 |
Patent application number | Description | Published |
20090039459 | ISOLATION FILM IN SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - The present invention relates to an isolation film in a semiconductor device and method of forming the same. An isolation film is formed in a doped region of a peripheral region, in which the doped region is isolated from a deep well region of a cell region and the isolation film is thicker than an isolation film of the cell region so that a parasitic transistor is not generated and a leakage current can be prevented. | 02-12-2009 |
20100181609 | Flash Memory Device and Method of Manufacturing the Same - Disclosed herein are flash memory devices and methods of making the same. According to one embodiment, a flash memory device includes first trenches formed in a semiconductor substrate and arranged in parallel, second trenches discontinuously formed in the semiconductor substrate and arranged between the first trenches, first isolation structures respectively formed within the first trenches, second isolation structures respectively formed within the second trenches, and active regions defined by the first isolation structures and the second isolation structures. | 07-22-2010 |
20100207248 | Patterns of Semiconductor Device and Method of Forming the Same - A method of forming patterns of a semiconductor device comprises providing a semiconductor substrate comprising a first region wherein first patterns are to be formed and a second region wherein second patterns are to be formed, each of the second patterns having a wider width than the first patterns, forming an etch target layer over the semiconductor substrate, forming first etch patterns over the etch target layer of the first and second regions, forming second etch patterns on both sidewalls of each of the first etch patterns, wherein the second etch pattern formed in the second region has a wider width than the second etch pattern formed in the first region, removing the first etch patterns, forming third etch patterns over the etch target layer of the second region, the third etch pattern overlapping part of the second pattern, and etching the etch target layer using the third etch patterns and the second etch patterns as an etch mask, to form the first and second patterns. | 08-19-2010 |
20100291750 | METHOD OF FABRICATING FLASH MEMORY DEVICE - A semiconductor device includes a semiconductor substrate having a cell region and a peripheral region. A cell array is defined within the cell region, the cell array having first, second, third, and fourth sides. A first decoder is defined within the peripheral region and provided adjacent to the first side of the cell array. A first isolation structure is formed at a first boundary region provided between the first side of the cell array and the peripheral region. A first active region is formed at a second boundary region that is provided between the second side of the cell array and the peripheral region. The first isolation structure has a first portion that has a first depth and a second portion that has a second depth. | 11-18-2010 |
Patent application number | Description | Published |
20120081970 | SEMICONDUCTOR MEMORY APPARATUS AND PROGRAM VERIFICATION METHOD - A non-volatile memory apparatus includes a memory cell array, a power supply configured to generate an operation voltage according to an operation mode and provide the memory cell array with the operation voltage, and a controller configured to provide the memory cell array with a first verification voltage and a second verification voltage in a program verification operation, detect a high speed program cell by the first verification voltage and the second verification voltage from selected memory cells to be programmed and set the high speed program cell to be in a program inhibition state, and detect a low speed program cell by the second verification voltage. | 04-05-2012 |
20120195130 | SEMICONDUCTOR MEMORY DEVICE AND DATA ERASE METHOD THEREOF - A semiconductor memory device includes: a plurality of memory cells coupled in series between a bit line and a source line; and a bit line control voltage supply unit configured to provide a control voltage to the bit line according to an operation mode, wherein the bit line control voltage supply unit provides a control voltage having a ground voltage level to the bit line during a soft programming operation. | 08-02-2012 |
20120221825 | NONVOLATILE MEMORY SYSTEM AND FEATURE INFORMATION SETTING METHOD - A nonvolatile memory system includes a controller and a nonvolatile memory apparatus, where the controller provides the nonvolatile memory apparatus with a first feature setting command or a second feature setting command according to device information of the nonvolatile memory apparatus in a mode change of the nonvolatile memory apparatus. | 08-30-2012 |
20140068150 | DATA STORAGE DEVICE AND OPERATING METHOD THEREOF - A data storage device includes: a first memory device. a second memory device configured to share a write control signal and a read control signal which are provided to the first memory device. and a controller configured to control the first and second memory devices, wherein the controller provides the write control signal and the read control signal to the first and second memory devices at the same time, the first memory device receives only the read control signal according to a first mask signal, and the second memory device receives only the write control signal according to a second mask signal. | 03-06-2014 |
20140156882 | MEMORY DEVICE, OPERATING METHOD THEREOF, AND DATA STORAGE DEVICE INCLUDING THE SAME - A memory device includes a data read/write block configured to store data in memory cells and read data from the memory cells; an input/output buffer block configured to buffer input data inputted through data pads and control signals inputted through control signal pads, and provide buffered input data and control signals to the data read/write block, and buffer read data read out through the data read/write block, and output buffered read data to an external device through the data pads, and a control logic configured to activate or deactivate the input/output buffer block based on an address which is inputted from the external device. | 06-05-2014 |