Patent application number | Description | Published |
20110043933 | RENS MOVING MODULE - Disclosed herein is a Lens moving MODULE. The Lens moving MODULE includes a lens barrel having at least one lens which brings an image of a subject into focus. A housing having a space for the lens barrel, and friction member formed in axially. A piezoelectric actuator provided in an outer circumferential surface of the lens barrel, and generating vibration when external voltage is applied to the piezoelectric actuator, with a through hole formed for having the friction member. An elastic member include the friction member, and inserted into the through hole of the piezoelectric actuator, and applying the vibrations to the friction member. | 02-24-2011 |
20110109968 | IMAGE STABILIZATION MECHANISM FOR CAMERA MODULE - Disclosed herein is an image stabilization mechanism for a camera module. The image stabilization mechanism includes a base, a movable stage receiving a lens barrel therein and having a magnet, and a piezoelectric actuator. The piezoelectric actuator is installed to the base, moves the movable stage in an X-axis or Y-axis direction to remove shake of the lens barrel, and maintains contact with the movable stage because of magnetic attractive force between the piezoelectric actuator and the magnet. The image stabilization mechanism reduces the number of components, thus simplifying the structure and minimizing an increase in height. | 05-12-2011 |
20110149421 | LENS ACTUATING MODULE - Disclosed herein is a lens actuating module. In the lens actuating module, a housing has an installation space therein. A lens barrel is disposed in the installation space of the housing. The lens barrel includes a lens. An actuating means is provided at a first position in the installation space of the housing in an optical axial direction. The actuating means is connected to the lens barrel to move the lens barrel. A base magnet is provided at a second position in the installation space of the housing. A lens magnet is mounted to the outer surface of the lens barrel at a position facing the base magnet to generate a repulsive force between the lens magnet and the base magnet. | 06-23-2011 |
20120169181 | Piezoelectric Actuator - Disclosed herein is a piezoelectric actuator. According to the present invention, the manufacturing cost of the piezoelectric actuator can be reduced by simplifying the patterns of electrodes constituting the piezoelectric actuator, the piezoelectric actuator itself or an electronic product employing the piezoelectric actuator can be made smaller by using only planar simple translational movement of the piezoelectric actuator, and the piezoelectric actuator capable of independently performing linear translational movement in two directions on the plane can be provided. | 07-05-2012 |
20130094844 | CAMERA MODULE HAVING AUTO-FOCUS APPARATUS - The present invention discloses a camera module having an auto-focus apparatus including: a piezoelectric actuator for generating a force for moving a driven member; a rod connected to the piezoelectric actuator and transmitting the force of the piezoelectric actuator to the driven member; a lens barrel having at least one lens; and a connecting member for coupling the rod and the lens barrel together by a magnetic force. The connecting member has a rod guide groove corresponding to the rod and the rod is inserted and coupled to the rod guide groove in a movable manner. Since the lens barrel as a driven member is magnetically coupled to the rod which is adapted to move by the piezoelectric actuator, it is possible to easily assure the tilting performance of lens while securing and maintaining a preload. In addition, the overall size of the camera module can be reduced. | 04-18-2013 |
Patent application number | Description | Published |
20110126077 | COOPERATIVE TRANSMISSION METHOD AND COMMUNICATION SYSTEM USING THE SAME - A cooperative transmission method includes: a first operation of coding, by a source node, a message desired to be transmitted according to a first encoding scheme to generate a first codeword and transmitting the first codeword to a relay node and a destination node; a second operation of decoding, by the relay node, the first codeword which has been received from the source node, coding the decoded message according to a second coding scheme to generate a second codeword, coding a part corresponding to parity of the second codeword according to the first coding scheme to generate a third codeword, and transmitting the third codeword to the destination node; and a third operation of decoding, by the destination node, the first codeword which has been received from the source node and the third codeword which has been received from the relay node, combining the message generated by decoding the first codeword and the parity part of the second codeword generated by decoding the third codeword to generate a fourth codeword according to the second coding scheme, and decoding the fourth codeword to estimate the message desired to be transmitted. | 05-26-2011 |
20110133991 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE - Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment. | 06-09-2011 |
20110193415 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency. | 08-11-2011 |
20110241609 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells. | 10-06-2011 |
20110248890 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE FOR ENHANCING BANDWIDTH - Disclosed herein is a dielectric resonator antenna embedded in a multilayer substrate for enhancing bandwidth. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator. Accordingly, the dielectric resonator antenna has low sensitivity to fabrication errors and an external environment, and can enhance the radiation characteristics of the antenna when multiple resonances occur. | 10-13-2011 |
20110248891 | DIELECTRIC RESONANT ANTENNA USING A MATCHING SUBSTRATE - Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode. | 10-13-2011 |
20110266879 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING ZERO REFRACTIVE INDEX - Disclosed herein is an apparatus for transmitting and receiving wireless energy using meta-material structures having a zero refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. When external power is applied thereto, the wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially when the generated wireless energy is transmitted, using a magnetic resonance method while concentrating the wireless energy in one direction. | 11-03-2011 |
20110267247 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING NEGATIVE REFRACTIVE INDEX - Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point. | 11-03-2011 |
20120038220 | WIRELESS POWER TRANSMISSION APPARATUS AND TRANSMISSION METHOD THEREOF - Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system. | 02-16-2012 |
20120146425 | WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a wireless power signal if it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are automatically tracked, and wireless power is supplied to the load device in an optimized state. A wireless to power reception unit is connected to the load device, and configured to receive the wireless power signal, provide the wireless power signal to the load device, and reflect a reflected wireless power signal towards the wireless power transmission unit. | 06-14-2012 |
20120206311 | DIELECTRIC WAVEGUIDE ANTENNA - Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna. | 08-16-2012 |
20120217926 | WIRELESS POWER TRANSFER - Disclosed herein is a wireless power transfer system. The wireless power transfer system includes a wireless power transmitter receiving power input from the outside to generate a wireless power signal to be transmitted in wireless and transmitting the generated wireless power signal in wireless by a magnetic resonance manner using an LC serial-parallel resonance circuit; a wireless power receiver installed in a charging device to receive the wireless power signal transmitted from the wireless power transmitter by the magnetic resonance manner using the LC serial-parallel resonance circuit and output the received wireless power signal; and a charging circuit installed in the charging device to allow the power output from the wireless power receiver to charge an embedded battery, thereby making it possible to efficiently provide power in wireless. | 08-30-2012 |
20120280648 | APPARATUS AND METHOD FOR CHARGING WIRELINE AND WIRELESS POWERS - Disclosed herein are an apparatus and a method for charging wireline and wireless powers. The apparatus for charging wireline and wireless powers includes: a main battery; an auxiliary battery; a wireline charging module providing wireline power to the main and auxiliary batteries; and a wireless charging module connected to the wireline charging module to thereby provide wireless power to the main and auxiliary batteries. Therefore, wireline charging and the wireless charging may be simultaneously performed, thereby making it possible to save a time required to charge power and to improve the convenience for users according to various charging scenarios using the wireline charging and the wireless charging. | 11-08-2012 |
20130057202 | CHARGING APPARATUS USING PAD TYPE ELECTRODE CONTACT POINT - Disclosed herein is a charging apparatus using a pad type electrode contact point, the charging apparatus including: a charging plate having a plate shape; and an attaching plate installed on a portable terminal to provide the power to a charging circuit of the portable terminal. | 03-07-2013 |
20140168024 | DIELECTRIC WAVEGUIDE ANTENNA - Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna. | 06-19-2014 |
Patent application number | Description | Published |
20130002093 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module including: a piezoelectric element repeatedly extended and compressed according to application of external power to generate vibration force; a vibration plate having the piezoelectric element coupled to one surface thereof and repeatedly extended and compressed integrally with the piezoelectric element to transfer the vibration force of the piezoelectric element to an external component; a weight body having a central portion coupled to the other side of the vibration plate in order to increase the vibration force of the piezoelectric element; and a coupling member fixedly coupling the central portion of the weight body and the vibration plate to each other. | 01-03-2013 |
20130003270 | SUPPORT STRUCTURE OF TOUCH PANEL - Disclosed herein is a support structure of a touch panel. According to the present invention, by implementing a touch panel support structure having the maximum resistance to vibration and warpage transferred to the touch panel by a vibration generating device, it is possible to uniformize a vibration width by minimizing a deviation of vibration displacement for each position of a touch panel and it is possible to safely protect the touch panel by effectively absorbing external shock through a cushion operation of a buffering member. | 01-03-2013 |
20130300255 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module including a vibration plate that is surrounded by an upper case and a lower case, and includes a first stopper capable of preventing direct collision between a piezoelectric element and an internal constituent member, for example, an upper plate while vibrating linearly therein. In particular, the piezoelectric vibration module may further include a second stopper in the lower case. | 11-14-2013 |
20130300256 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module that includes a side damper between a vibration plate with a piezoelectric element and an upper case so as to ensure reliability against external shock applied to the side and narrows a spaced distance between the vibration plate and the upper case. | 11-14-2013 |
20130300261 | PIEZOELECTRIC VIBRATION MODULE - Disclosed herein is a piezoelectric vibration module in which piezoelectric elements generating vibration force by repetitively extending and being shrinkingly deformed through application of flat external power are placed symmetrically around the center of a lower plate of a vibration plate. | 11-14-2013 |
20140055006 | VIBRATION GENERATION DEVICE - There is provided a vibration generation device. The vibration generation device may include a housing including an internal space; a piezoelectric actuator mounted in the housing to be disposed in the internal space and including a piezoelectric element deformed in a horizontal direction; a direction conversion member fixed to the piezoelectric actuator; and a vibrator disposed in the internal space while being fixed to the direction conversion member, and displaced in a vertical direction due to a deformation of the piezoelectric actuator in the horizontal direction. | 02-27-2014 |
Patent application number | Description | Published |
20120091861 | CERAMIC COMPOSITION FOR PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR COMPRISING THE SAME - The present invention relates to a ceramic composition for a piezoelectric actuator and a piezoelectric actuator comprising the same. The ceramic composition for piezoelectric actuator includes a piezoelectric ceramic powder expressed by a Chemical Formula: (1-x)Pb(Zr | 04-19-2012 |
20120139850 | HAPTIC DRIVING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME - There is provided a haptic driving assembly capable of providing more uniform haptic feedback, and an electronic device using the same. The haptic driving assembly includes: at least one actuator; and a vibration transferring part disposed to contact at least one surface of the actuator and transferring vibrations generated in the actuator to the outside through a liquid phase medium. | 06-07-2012 |
20130042690 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor including: a case; a piezoelectric element mounted on an inner side bottom surface of the case; a first sound absorbing material having a through-hole formed at an area thereof corresponding to a mounting area of the piezoelectric element and including the piezoelectric element disposed at a portion thereof based on a thickness of the through-hole; and a second sound absorbing material formed on the first sound absorbing material so as to cover the entire surface of the first sound absorbing material including the through-hole, wherein the through-hole formed has a thickness thicker than that of the piezoelectric element. | 02-21-2013 |
20130043772 | CASE FOR ULTRASONIC SENSOR AND ULTRASONIC SENSOR USING THE SAME - Disclosed herein are a case for an ultrasonic sensor and an ultrasonic sensor using the same. The case for an ultrasonic sensor has a cylindrical shape and includes a disposition area of a piezoelectric element and a first groove formed in an inner side bottom surface thereof, wherein the first groove is formed along an edge of the disposition area of the piezoelectric element. | 02-21-2013 |
20130081470 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor including: a cylindrical case; a piezoelectric element; a sound absorbing material; a temperature compensation capacitor inserted into and fixed to the groove; a first pin terminal connected to one electrode of the temperature compensation capacitor and an exposed electrode of the piezoelectric element while penetrating through the groove of the sound absorbing material; a second pin terminal inserted into and fixed to the groove of the sound absorbing material and connected to the other electrode of the temperature compensation capacitor; and a lead wire inserted into and fixed to the groove of the sound absorbing material and having one terminal connected to the second pin terminal and the other terminal connected to an inner wall of the case, and a method for manufacturing the same. | 04-04-2013 |
20130112000 | ULTRASONIC SENSOR - Disclosed herein is an ultrasonic sensor, including: a case partitioning an inner space; a temperature-compensation ceramic maintaining a temperature of a sensor to be constant; sockets accommodating the temperature-compensation ceramic; a negative (−) terminal and a positive (+) terminal connected to the sockets, respectively; a piezoelectric ceramic connected to the positive (+) terminal and vibrating when power is supplied thereto; and an acoustic absorbent absorbing vibration of the piezoelectric ceramic. | 05-09-2013 |
20130134833 | ULTRASONIC SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a case having one end closed and the other end opened; a piezoelectric element fixedly coupled to one end of an inner portion of the case; a sound absorbing member coupled to an upper surface of the piezoelectric element so as to cover a portion of the piezoelectric element; a conductive member having one end connected to the piezoelectric element and the other end connected to the sound absorbing member; and a lead wire electrically coupled to the conductive member and the case. | 05-30-2013 |
Patent application number | Description | Published |
20120125096 | INERTIAL SENSOR - Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values. | 05-24-2012 |
20120152020 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. There is provided an inertial sensor | 06-21-2012 |
20120159754 | POLLING METHOD OF PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING INERTIAL SENSOR USING THE SAME - Disclosed herein is a method of manufacturing an inertial sensor using a polling method of a piezoelectric element performing a polling after packaging the piezoelectric element, the method of manufacturing an inertial sensor including: forming a driving electrode and a sensing electrode on a flexible substrate on which a piezoelectric material is deposited; electrically connection the driving electrode and the sensing electrode; packaging the flexible substrate; polling by applying voltage and heat to the driving electrode and the sensing electrode; and electrically separating the driving electrode from the sensing electrode by applying heat to the driving electrode and the sensing electrode. | 06-28-2012 |
20120266460 | METHOD OF MANUFACTURING INERTIAL SENSOR - Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor | 10-25-2012 |
20120266673 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method. | 10-25-2012 |
20120297874 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. An inertial sensor | 11-29-2012 |
20130019679 | INERTIAL SENSOR AND ANGULAR VELOCITY DETECTION METHOD USING THE SAME - Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other. | 01-24-2013 |
20130036818 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor | 02-14-2013 |
20130068021 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a sensor part including a driving body displaceably mounted on a flexible substrate part, a driving unit moving the driving body, and a displacement detection unit detecting a displacement of the driving body, wherein the inertial sensor includes an application specific integrated circuit (ASIC) including the sensor part coupled thereto; a printed circuit board including the ASIC coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, whereby the driving body and the flexing substrate part is protected and an interval between the driving body and the flexible substrate part is optimized to obtain efficient driving characteristics and a Q factor and improve a freedom of design in a space use. | 03-21-2013 |
20130068022 | MICRO ELECTRO MECHANICAL SYSTEMS COMPONENT - Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane | 03-21-2013 |
20130074598 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a sensor part including a driving body, a flexible substrate part displaceably supporting the driving body, a support part supporting the flexible substrate part so that the driving body is freely movable in a state in which it is floated, and a lower cap covering a lower portion of the driving body and coupled to the support part; an application specific integrated circuit (ASIC) including the sensor part stacked thereon and coupled thereto; a printed circuit board including the ASIC stacked thereon and coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, wherein the cap includes an air discharging hole formed in order to discharge internal air to the outside. | 03-28-2013 |
20130081464 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. The inertial sensor includes a sensor part including a driving mass, a flexible substrate part displaceably supporting the driving mass, and a support part supporting the flexible substrate part so that the driving mass is freely movable in a state in which the driving mass is floated; a lower cap covering a lower portion of the driving mass and coupled with the support part and provided with a stopper part limiting a displacement of the driving mass; and a dry film resist coupling the sensor part with the cover and providing an interval between the driving mass and the stopper. | 04-04-2013 |
20130133426 | INERTIAL SENSOR - Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element. | 05-30-2013 |
Patent application number | Description | Published |
20130118672 | SUBSTRATE BONDING METHOD - Disclosed herein is a substrate bonding method including stacking a plurality of bonding objects including anisotropic conductive films (ACFs) and flexible printed circuit boards (FPCBs), which are sequentially stacked, on a substrate including bonding surfaces having a plurality of steps, according to the plurality of steps of the bonding surfaces of the substrate, and pressurizing the plurality of bonding objects to the substrate by a bonding tool of a bonding unit having pressurization surfaces having a shape corresponding to the bonding surfaces of the substrate to bond the plurality of bonding objects to each other. | 05-16-2013 |
20130154719 | CONNECTION STRUCTURE BETWEEN SUBSTRATE AND FPCB FOR TOUCH PANEL - Disclosed herein is a connection structure between a substrate and a flexible printed circuit board (FPCB) for a touch panel, including: a substrate; first sensing electrodes; second sensing electrodes; first electrode wirings; second electrode wirings; and a flexible printed circuit board connected to the substrate so as to be electrically connected to the first and second electrode wirings, wherein a first connection portion of the first electrode wiring and a second connection portion of the second electrode wiring to which the flexible printed circuit board is electrically connected are formed on the upper and lower surfaces of the substrate, respectively, so as to face each other in a vertical direction. Therefore, the flexible printed circuit substrate may be connected to the substrate by a single assembling process. | 06-20-2013 |
20130154966 | TOUCH PANEL - Disclosed herein is a touch panel in which an upper transparent substrate and a lower transparent substrate are adhered to each other such that an upper detecting electrode that is formed on surfaces of convex portions of the upper transparent substrate crosses a lower detecting electrode that is formed in one direction in which concave portions and the convex portions of the lower transparent substrate are formed, and the surfaces of the convex portions on which the upper detecting electrode is formed and the surfaces of the concave portions on which the lower detecting electrode is formed face each other. Thus, a distribution of an electric field is concentrated on a sensing electrode, thereby improving the sensitivity of the touch panel, compared to a general electrode structure. | 06-20-2013 |
20130277194 | TOUCH PANEL - Disclosed herein is a touch panel including: a transparent substrate; an electrode formed on the transparent substrate; and a visibility reducing layer having a width smaller than that of the electrode and interposed between the electrode and the transparent substrate. | 10-24-2013 |
20130278546 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate; a first electrode pattern formed on the transparent substrate in a mesh pattern; an insulating layer formed on the transparent substrate; and a second electrode pattern formed on an exposed surface of the insulating layer and having an intersecting area facing the first electrode pattern formed in a mesh pattern and an area other than the intersecting area formed in a surface type. By this configuration, even though the thickness of the insulating layer is thinly manufactured, it is possible to secure the desired touch sensitivity and effectively shield noises occurring from an image display device. | 10-24-2013 |
20130293485 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a touch panel, the method including: (A) supplying a raw glass plate; (B) forming an electrode layer on each of a plurality of a glass substrate unit areas on the raw glass plate; (C) forming a protection layer to cover the electrode layer on the glass substrate unit areas; (D) cutting the raw glass plate into the glass substrate units; and (E) tempering the cut glass substrate units. | 11-07-2013 |
20130342475 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel according to a first embodiment of the present invention includes a transparent substrate that is partitioned into an active region and an inactive region outside the active region, a first electrode that is formed in the active region of one surface of the transparent substrate, a second electrode that is formed in the active region of the other surface of the transparent substrate, and a low dielectric constant film that is formed along a peripheral edge of the active region while being formed in the inactive region of the one surface of the transparent substrate. In the touch panel, touch sensitivity is improved by minimizing influence of a polarization phenomenon on changes in capacitance on the peripheral edge of the active region in which a detection region is reduced. | 12-26-2013 |
20130342476 | TOUCH PANEL - Disclosed herein is a touch panel, including a transparent substrate on which a wiring array is formed; a first connector formed on an end of the wiring array; a flexible printed circuit board (FPCB) on which a circuit terminal is formed; and a second connector formed on the circuit terminal and bonded to the first connector, in which a protrusion is formed on one of the first connector and the second connector and a groove is formed on the other one, thereby easily aligning the wiring array and the FPCB with each other and increasing the connection reliability therebetween. | 12-26-2013 |
20140016290 | TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a touch panel including: a first transparent substrate partitioned into an active area and a bezel area provided in edges of the active area; a mark formed so as to protrude on the bezel area; and a second transparent substrate coupled to the first transparent substrate so that at least one corner thereof corresponds to the mark. | 01-16-2014 |
20140049485 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate; an electrode formed in a mesh pattern on the transparent substrate; and a wiring formed in a wavy pattern on the transparent substrate and connected to the electrode, the wiring having curve shape of first peaks and second peaks alternately continuing along a longitudinal direction. | 02-20-2014 |
20140078074 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel includes an electrode pattern that is formed of a combination of unit patterns having protrusions and recessed notches along each side of the electrode pattern. | 03-20-2014 |
20140078111 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel | 03-20-2014 |
20140083827 | TOUCH PANEL - Disclosed herein is a touch panel including an electrode pattern configured of a combination of unit patterns in which a hole is formed at an intersection region between sides. | 03-27-2014 |
Patent application number | Description | Published |
20110126077 | COOPERATIVE TRANSMISSION METHOD AND COMMUNICATION SYSTEM USING THE SAME - A cooperative transmission method includes: a first operation of coding, by a source node, a message desired to be transmitted according to a first encoding scheme to generate a first codeword and transmitting the first codeword to a relay node and a destination node; a second operation of decoding, by the relay node, the first codeword which has been received from the source node, coding the decoded message according to a second coding scheme to generate a second codeword, coding a part corresponding to parity of the second codeword according to the first coding scheme to generate a third codeword, and transmitting the third codeword to the destination node; and a third operation of decoding, by the destination node, the first codeword which has been received from the source node and the third codeword which has been received from the relay node, combining the message generated by decoding the first codeword and the parity part of the second codeword generated by decoding the third codeword to generate a fourth codeword according to the second coding scheme, and decoding the fourth codeword to estimate the message desired to be transmitted. | 05-26-2011 |
20120146425 | WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a wireless power signal if it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are automatically tracked, and wireless power is supplied to the load device in an optimized state. A wireless to power reception unit is connected to the load device, and configured to receive the wireless power signal, provide the wireless power signal to the load device, and reflect a reflected wireless power signal towards the wireless power transmission unit. | 06-14-2012 |
20130113421 | DISPLAY DEVICE AND DISPLAY SYSTEM INCORPORATING WIRED AND WIRELESS CHARGING APPARATUSES - Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode. | 05-09-2013 |
Patent application number | Description | Published |
20080296055 | Printed circuit board and method of fabricating the same - This invention relates to a printed circuit board and a method of fabricating the same, in which the thickness of a circuit pattern is decreased to thus realize a fine circuit, the circuit pattern is embedded in an insulating layer to thus decrease the thickness of a printed circuit board, and the time and cost required for the process of fabricating a printed circuit board are decreased. | 12-04-2008 |
20080307641 | Method of fabricating paste bump for printed circuit board - This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board. | 12-18-2008 |
20080308315 | Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity. | 12-18-2008 |
20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
20110099807 | Method of manufacturing printed circuit board - A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern. | 05-05-2011 |
20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
20120080401 | METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer. | 04-05-2012 |
20120175162 | PRINTED CIRCUIT BOARD - A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer. | 07-12-2012 |
Patent application number | Description | Published |
20120170149 | SPINDLE MOTOR - Disclosed herein is a spindle motor, including: a rotating part having a rotating shaft and a magnet and a fixing part including a bearing supporting the rotating shaft and an armature corresponding to the magnet, the rotating part rotated by electromagnetic force of the magnet and the armature, wherein the fixing part includes: a plate supporting the rotating shaft; and a flexible circuit board mounted on the top portion of the plate and disposed between the plate and the armature to shield conduction therebetween. | 07-05-2012 |
20120256515 | SPINDLE MOTOR - Disclosed herein is a spindle motor configured of a rotating part including a shaft and a magnet and a fixing part including a bearing supporting the shaft and an armature facing the magnet, the rotating part being rotated by electromagnetic force between the magnet and the armature, wherein the fixing part includes: a base plate supporting the shaft; a bearing holder mounted on an upper portion of the base plate and fixed to an outer diameter of the bearing; and a flexible printed circuit board attached on upper portions of the base plate and the bearing holder so that it is disposed between the base plate and the armature and the bearing holder and the armature, thereby insulating the base plate and the bearing holder from the armature. | 10-11-2012 |
20130093283 | SPINDLE MOTOR - Disclosed herein is a spindle motor. The spindle motor uses a general (non neodymium) permanent magnet rather than a neodymium magnet as a permanent magnet and compensates for a reduced counter electromotive force (B-EMF) value by allowing the center of a connection part formed in a round shape between poles around which coils are wound to be different from that of a core to increase a coil inductance value, thereby making it possible to easily sense and control a rotation state of the spindle motor. | 04-18-2013 |
20140001899 | MOTOR STRUCTURE AND FLAT TYPE VIBRATION MOTOR STRUCTURE USING THE SAME | 01-02-2014 |
20140054983 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator including a fixing part including a housing having a certain space formed therein and a coil disposed within the housing, a vibration part including magnets disposed to face the coil such that electromagnetic force acts with the coil, weight bodies coupled to the magnets, and a moving case accommodating the magnets and the weight bodies therein, and an elastic member connecting the fixing part to the vibration part. | 02-27-2014 |
Patent application number | Description | Published |
20080204971 | Integrated multilayer chip capacitor module and integrated circuit apparatus having the same - An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material. | 08-28-2008 |
20090034154 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically connected to the internal electrodes through the leads. The average number of leads in each internal electrode is smaller than half (½) of the total number of external electrodes. The leads of the internal electrodes having opposite polarities and adjacent in the lamination direction are disposed to be adjacent to each other as seen from the lamination direction. All the internal electrodes having the same polarity are electrically connected to each other in the capacitor. | 02-05-2009 |
20090073634 | Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor - A circuit board including: a substrate having a mounting area for mounting a vertical multilayer chip capacitor having first and second external electrodes of a first polarity and a third external electrode of a second polarity; first to third pads arranged on the mounting area, the first and second pads having the first polarity and disposed separately from each other on the mounting area, the third pad having the second polarity and disposed between the first and second pads to be connected to the third external electrode; at least one first via formed in the substrate and connected to the first pad; at least one second via formed in the substrate and connected to the second pad; and a plurality of third vias formed in the substrate and connected to the third pad. The first via is disposed adjacent to the third pad relative to a central line of the first pad, the second via is disposed adjacent to the third pad relative to a central line of the second pad, one or more of the third vias are disposed adjacent to the first via relative to a central line of the third pad, and the rest of the third vias are disposed adjacent to the second via relative to the central line of the third pad. | 03-19-2009 |
20090086403 | MULTILAYER CAPACITOR - There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode. | 04-02-2009 |
20100149769 | CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE - A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode. | 06-17-2010 |
20130120900 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. | 05-16-2013 |
20130229748 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T | 09-05-2013 |
20130314843 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is | 11-28-2013 |
20140133064 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-15-2014 |
20140138136 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-22-2014 |
Patent application number | Description | Published |
20120306303 | SPINDLE MOTOR - Disclosed herein is a spindle motor including a rotating part including a rotating shaft, a hub, and a magnet and a fixing part including a sleeve supporting the rotating shaft and an armature opposite to the magnet, wherein a working fluid is injected between the rotating shaft and the sleeve so as to form a fluid dynamic bearing part, and the sleeve is as a sintered sleeve by sintering and a top and a bottom of an inner peripheral surface of the sleeve is protruded toward the rotating shaft, whereby the spindle motor improving dynamic pumping capability and extending a span of a radial bearing part to a top end and a bottom end of the sleeve as compared with the spindle motor according to the prior art can be provided. | 12-06-2012 |
20130069464 | SPINDLE MOTOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a spindle motor including: a rotor including a shaft, a hub, and a magnet; a stator including a sleeve rotatably supporting the shaft, a base having the sleeve coupled thereto, and an armature facing the magnet and including a core and a coil; and a fluid dynamic bearing part formed between the rotor and the stator by being filled with oil, wherein the armature is coupled to an outer peripheral portion of the sleeve. | 03-21-2013 |
20130076186 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a rotor including a shaft, a hub, and a magnet; a stator including a sleeve rotatably supporting the shaft, a base having the sleeve coupled thereto, and an armature facing the magnet, fixedly coupled to the base, and including a core and a coil; and a fluid dynamic bearing part formed between the rotor and the stator by being filled with oil, wherein the stator further includes a pulling plate disposed to face the magnet in an axial direction of a shaft, coupled to the base, and protruded upwardly toward the core in a axial direction of a shaft. | 03-28-2013 |
Patent application number | Description | Published |
20080204971 | Integrated multilayer chip capacitor module and integrated circuit apparatus having the same - An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material. | 08-28-2008 |
20090073634 | Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor - A circuit board including: a substrate having a mounting area for mounting a vertical multilayer chip capacitor having first and second external electrodes of a first polarity and a third external electrode of a second polarity; first to third pads arranged on the mounting area, the first and second pads having the first polarity and disposed separately from each other on the mounting area, the third pad having the second polarity and disposed between the first and second pads to be connected to the third external electrode; at least one first via formed in the substrate and connected to the first pad; at least one second via formed in the substrate and connected to the second pad; and a plurality of third vias formed in the substrate and connected to the third pad. The first via is disposed adjacent to the third pad relative to a central line of the first pad, the second via is disposed adjacent to the third pad relative to a central line of the second pad, one or more of the third vias are disposed adjacent to the first via relative to a central line of the third pad, and the rest of the third vias are disposed adjacent to the second via relative to the central line of the third pad. | 03-19-2009 |
20090086403 | MULTILAYER CAPACITOR - There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode. | 04-02-2009 |
20100149769 | CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE - A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode. | 06-17-2010 |
20140133064 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-15-2014 |
20140138136 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-22-2014 |
20140151103 | LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF - A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. | 06-05-2014 |
20140185186 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV. | 07-03-2014 |
Patent application number | Description | Published |
20110001365 | LINEAR VIBRATION MOTOR - Disclosed herein is a linear vibration motor. The motor includes a casing surrounding the top and widthwise side of the motor, and a bracket surrounding the bottom and lengthwise side of the motor. A plate is provided on an inner surface of a side of the bracket and integrally has a cylindrical part to accommodate a coil. A mass body is provided in a central portion of the bracket and vibrates horizontally, a yoke is provided on a side surface of the mass body, and a magnet is mounted to a central portion of the yoke to be inserted into an internal space of the coil. A spring couples the plate with the yoke, thus transmitting vibratory force to the motor. An extension part extends from an end of the spring, and a bearing is provided on an end of the extension part, thus minimizing friction with the casing. | 01-06-2011 |
20110012441 | HORIZONTAL LINEAR VIBRATOR - The present invention provides a horizontal linear vibrator which can increase vibration strength while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The bracket and the casing form the internal space therein. A coil is provided above the bracket such that the center axis thereof is oriented in a horizontal direction. The vibration unit is disposed through the coil and comprises a magnetic field generating unit and a weight. The magnetic field generating unit includes a magnet assembly and a yoke. The magnet assembly has magnets which are provided on opposite sides of a magnetic body core such that the similar magnetic poles of the magnets face each other. The weight is mounted to the magnetic field generating unit. The springs are coupled to the casing or the bracket and elastically support the vibration unit. | 01-20-2011 |
20110018364 | HORIZONTAL LINEAR VIBRATOR - The present invention provides a horizontal linear vibrator which can reduce the thickness but increase the strength of vibrations while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The casing defines an internal space therein. A first magnet is attached to an upper plate of the casing. The bracket is coupled to the lower end of the casing. The second magnet is attached to the bracket such that different poles of the first and second magnets face each other. The vibration unit has a weight, and a cylindrical coil which is provided in or under the weight. The springs are coupled to the sidewall plates of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction. | 01-27-2011 |
20110018365 | HORIZONTAL LINEAR VIBRATOR - The present invention provides a horizontal linear vibrator which can reduce the thickness but increase the strength of vibrations while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit, a cylindrical coil and springs. The bracket is coupled to the casing to form an internal space. The vibration unit includes a weight, a pair of yokes and magnets. The weight has an opening therein. The yokes are disposed on the inner surfaces of the weight. The magnets are provided in the yokes such that different poles of the magnets face each other. The cylindrical coil is perpendicularly mounted to the bracket and disposed in space between the pair of yoke. The springs are coupled to both ends of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction. | 01-27-2011 |
20110018367 | HORIZONTAL LINEAR VIBRATOR - The present invention provides a horizontal linear vibrator which can reduce the thickness but increase vibration strength while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The casing defines an internal space therein. The bracket is disposed under the casing. A cylindrical coil is provided on the bracket. The vibration unit has a magnet, a yoke and a weight. The yoke contains the magnet therein and is open on the lower end thereof. The weight is coupled to the outer surface of the yoke. The springs are coupled to sidewall plates of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction. | 01-27-2011 |
20110062803 | HORIZONTAL LINEAR VIBRATOR - Disclosed herein is a horizontal linear vibrator. The horizontal linear vibrator includes: a case and a bracket that are assembled with each other to form an inner space; a hollow coil that is installed in the case or the bracket; a vibrator that includes a magnetic field unit including one or more magnet disposed to penetrate through the inside of the hollow coil and a yoke formed to enclose the hollow coil and the magnets to generate magnetic field and a weight mounted in the magnetic field unit; a buffer member that is provided between the hollow coil and the yoke; and a spring member whose one end is fixed to the case or the bracket and other end is fixed to the vibrator and elastically supports the vibrator so as to horizontally move the vibrator. Thereby, there is provided the horizontal linear vibrator that has a horizontal vibration structure capable of maintaining the lifetime and response characteristics of the horizontal linear vibrator, implementing the sliminess thereof, increasing the vibration quantity thereof while controlling the motion displacement and improving the durability thereof. | 03-17-2011 |
20110227426 | LINEAR VIBRATOR - Disclosed herein is a linear vibrator having a mass body which is accommodated in a casing defining an internal space and is vibrated. The linear vibrator includes a bracket supporting the linear vibrator from a lower position. The bracket has a depression in a bottom thereof such that a coil lead wire of a coil is placed in the depression, thus preventing friction between the coil lead wire and a movable unit. | 09-22-2011 |
20130033127 | LINEAR VIBRATION DEVICE - Disclosed herein is a linear vibration device. The linear vibration device includes a stator including magnets, a bracket, and a case having an inner space formed therein and coupled with the bracket; and a vibrator including coils facing the magnets, a weight body coupled with the coil, an FPC coupled with a top portion of the weight body, and an elastic member of which the one end is coupled with the case and the other end is coupled with the coil, the vibrator being accommodated in the case, wherein the magnets include a first magnet and a second magnet facing the first magnet, coupled with a top surface of the bracket, and including a magnetic fluid applied to a bottom portion and a side portion thereof. | 02-07-2013 |
Patent application number | Description | Published |
20130068039 | SPECIMEN CONVEYANCE APPARATUS - Disclosed herein is a specimen conveyance apparatus including: a main body having a plate-like shape and including a storage chamber having a recess-like shape formed thereon; a cover member covering the main body; a sealing member inserted between the main body and the cover member and blocking the storage chamber and the outside; a suction pipe installed within the main body, having a suction valve, and sucking external air; a filter installed within the main body, removing a reactive gas and particulate foreign material from air sucked through the suction pipe, and allowing an inert gas to pass therethrough toward the storage chamber; a discharge pipe installed within the main body, having a discharge valve, and discharging a gas to the outside; and a pump discharging a gas present in the storage chamber to the outside through the discharge pipe. | 03-21-2013 |
20130248583 | REFLOW INSPECTION SYSTEM AND CONTROL METHOD THEREOF - Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process. | 09-26-2013 |
20130251887 | NANO-PATTERNING APPARATUS, SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF - Disclosed herein is a nano-patterning system including a nano-patterning apparatus. The nano-patterning apparatus includes: a holder unit including a transfer unit and an insulating unit; a tip unit inserted into the holder unit, downwardly protruded, and having a flow channel; a flow path having one end connected to the flow channel through one side of the transfer unit or the insulating unit and extending to the outside to serve as a movement path allowing a nano-patterning material to move therealong; a pressing unit pressing the nano-patterning material at one side of the flow path; and a storage unit connected to the other end of the flow path and storing the nano-patterning material. | 09-26-2013 |
20130292457 | SOLDER SHEET AND SMOLDERING METHOD USING THE SAME - Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability. | 11-07-2013 |
20130334290 | SOLDER PASTE DROPLET EJECTION APPARATUS, PATTERNING SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF - Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe. | 12-19-2013 |
Patent application number | Description | Published |
20100294543 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-25-2010 |
20110061901 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF - Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator. | 03-17-2011 |
20110083885 | METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME - Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated. | 04-14-2011 |
20110101392 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided. | 05-05-2011 |
20110140144 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided. | 06-16-2011 |
20110284382 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers. | 11-24-2011 |
20110303437 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element. | 12-15-2011 |
20110303440 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 12-15-2011 |
20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
20120000697 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer. | 01-05-2012 |
20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. | 03-22-2012 |
20120073863 | ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member. | 03-29-2012 |
20120103588 | HEAT-DISSIPATING SUBSTRATE - Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components. | 05-03-2012 |
20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
20120225508 | PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided. | 09-06-2012 |
20120273116 | HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-01-2012 |
20120319260 | POWER MODULE PACKAGE AND SYSTEM MODULE HAVING THE SAME - Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate. | 12-20-2012 |
20130009291 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves. | 01-10-2013 |
20130010425 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer. | 01-10-2013 |
20130042963 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 02-21-2013 |
20130105954 | SEMICONDUCTOR PACKAGE | 05-02-2013 |
20140096380 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 04-10-2014 |
20140174940 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF - Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator. | 06-26-2014 |
Patent application number | Description | Published |
20120181885 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a rotor including a rotational axis and a magnet; and a stator including a bearing supporting the rotational axis and an armature corresponding to the magnet; wherein the rotor rotates by electromagnetic force between the magnet and the armature, the stator includes a printed circuit connected to the armature and having a hole for both set assembling and grounding formed therein; and a base plate having the printed circuit board coupled to an upper surface thereof so as to be stacked thereon and having a hole for both set assembling and grounding formed therein, the hole for both set assembling and grounding corresponding to the hole for both set assembling and grounding of the printed circuit board, and the hole for both set assembling and grounding of the printed circuit board and the hole for both set assembling and grounding of the base plate are fixed and grounded to a set. | 07-19-2012 |
20120182856 | SPINDLE MOTOR - A spindle motor includes a rotor including a rotary shaft and magnets, a stator including a bearing, which supports the rotary shaft, and an armature corresponding to the magnets. The rotor is caused to rotate by an electromagnetic force generated by the magnets and the armature. The stator includes a plate having a stepped portion in a portion thereof, which faces the rotary shaft. | 07-19-2012 |
20120262034 | SPINDLE MOTOR - Disclosed herein is spindle motor including a rotating part, including: a rotating shaft and a magnet; a fixing part including a bearing supporting the rotating shaft, an armature opposite to the magnet, a printed circuit board applying power to the armature, and a base plate coupled with the rotating part, wherein the rotating part rotates by electromagnetic force of the magnet and the armature, and an end of the base plate contacting the printed circuit board is provided with a downward inclined part having a round shape so as to be coupled with the printed circuit board. | 10-18-2012 |
20130049546 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft insertedly mounted so as to be perpendicular to an upper side portion; a sleeve receiving the shaft therein to thereby rotatably support the shaft and forming a space between the sleeve and the shaft to thereby be spaced apart from the shaft so as not to contact the shaft; a holder having the sleeve mounted in an inner portion thereof and having a lower portion mounted on an upper portion of a plate; and the plate integrally supporting lower portions of the shaft and the sleeve and including connecting parts connecting the holder and the plate to each other and fixing parts fixing positions of the holder and the plate so that a lower surface of the holder is coupled thereto. | 02-28-2013 |
20130119797 | SPINDLE MOTOR - Disclosed herein is a spindle motor in which a space part is formed between a shaft and a rotor case and a hooker part and a fixing part coupled to each other are formed at a bearing holder and a rotor case, respectively, thereby making it possible to easily prevent floating of a rotor without using a separate component. | 05-16-2013 |
20130147300 | SPINDLE MOTOR - Disclosed herein is a spindle motor. The spindle motor includes a main magnet formed to have an asymmetrical cross section without a pulling magnet according to the prior art that has been installed on an upper end of a core in order to prevent floating of a rotor, such that the main magnet may prevent the floating of the rotor instead of the pulling magnet. | 06-13-2013 |
20130162079 | SPINDLE MOTOR - Disclosed herein is a spindle motor. In the spindle motor according to the present invention, a thrust part is disposed at a lower portion of a shaft, and a support part surface-contacting a lower end of the shaft is formed at the thrust part so as to have a round shape, thereby making it possible to easily prevent a wobble phenomenon of a rotor due to a gap in a shaft system. In addition, a guide part is formed to be protruded at the thrust part to lock the shaft including a narrow part formed therein, thereby making it possible to easily prevent floating of the rotor. | 06-27-2013 |