Patent application number | Description | Published |
20080213517 | PROCESSING METHOD FOR THE PRODUCTION OF AMORPHOUS/NANOSCALE/NEAR NANOSCALE STEEL SHEET - The present disclosure relates to an iron alloy sheet comprising α-Fe, and/or γ-Fe phases wherein the alloy has a melting point in the range of 800 to 1500° C., a critical cooling rate of less than 10 | 09-04-2008 |
20100197202 | Method and Product for Cutting Materials - The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 μm or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate. | 08-05-2010 |
20110031222 | FEEDSTOCK POWDER FOR PRODUCTION OF HIGH HARDNESS OVERLAYS - A method of applying a metallic alloy overlay including providing an iron based feedstock powder including 10 to 75 weight percent iron and manganese, 10 to 60 weight percent of chromium, 1 to 30 weight percent of an interstitial element selected from boron, carbon, silicon or combinations thereof, 0 to 40 weight percent of a transition metal selected from molybdenum, tungsten or combinations thereof and 1 to 25 weight percent niobium. The method also includes providing an electrode including at least 50 weight percent iron and depositing a weld overlay with the feedstock powder and the electrode to create a metallic alloy exhibiting a grain size in the range of 1,000 μm or less. | 02-10-2011 |
20110100347 | Wire and Methodology for Cutting Materials With Wire - Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size. | 05-05-2011 |
Patent application number | Description | Published |
20090131077 | MULTIMODAL DATA COLLECTION DEVICE - A multimodal data collection device uses a digital pen as a primary input mechanism for data and for controlling the device. The digital pen may be connected to the multimodal data collection device through a wired connection, a wireless host connection, or a slave connection. The multimodal data collection device receives data from a number of input/output devices, captures the data, and then synchronizes selected written, voice and image data with time stamp information and geospatial location information to re-create one or more pre-existing events. In addition, the multimodal data collection device operates to arrange externally and internally received data by synchronizing the data with time and location information. | 05-21-2009 |
20100232116 | CARRIER FOR A DIGITAL PEN - A carrier for a digital pen includes a main case with an internal channel to closely receive and align the digital pen with an electronic package contained within the main case. In addition, the carrier includes an upper lid rotationally coupled to the main case. In one embodiment, the upper lid may be both partially and fully opened with a dual-action latch mechanism. In addition, the carrier may include a lower lid that may be opened to provide access to an electronic package. In one embodiment, an extendable serial communication device may be extended from the electronic package when the lower lid is open. Further, the carrier is configured to sufficiently protect the digital pen from harsh environmental conditions and even from harsh user-induced conditions, such as drops onto a hard surface, exposure of the carrier to rain, dust, and sand particulate, brief water submersion, and even temperature extremes. | 09-16-2010 |