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| 20130183103 | BASE SEAL FOR A DUMP, IN PARTICULAR A RESIDUAL SALT DUMP - The invention relates to a base seal of a dump, in particular a residual salt dump, said seal comprising two layers disposed on top of one another. The upper layer has a mixture of gravel, sand and bentonite or powered clay with a permeability coefficient of k≦10 | 07-18-2013 |
| 20130207036 | ADDITIVE FOR BINDING THE RESIDUAL MOISTURE IN THE RESIDUE SALT OF A SALT DUMP - The invention provides an additive for binding the residual moisture in the residue salt of a salt heap to reduce the heap water content, wherein the additive has hydraulically and/or pozzolanically setting properties. | 08-15-2013 |
| 20130209176 | MIXTURE TO BE APPLIED ONTO A DUMP OF RESIDUE SALT - The invention relates to a mixture to be applied onto a dump of residue salt as an infiltration-inhibiting layer for reducing the occurrence of pile water caused by precipitation, wherein the mixture comprises residue salt and a mineral additive which is poorly soluble to insoluble and has hydraulically and/or pozzolanically setting properties. | 08-15-2013 |
| 20150273434 | METHOD FOR BINDING THE RESIDUAL MOISTURE IN THE RESIDUE SALT OF A SALT DUMP - The invention provides an additive for binding the residual moisture in the residue salt of a salt heap to reduce the heap water content, wherein the additive has hydraulically and/or pozzolanically setting properties. | 10-01-2015 |
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| 20090215675 | Means for the inhibition of anti-beta1-adrenergic receptor antibodies - The present invention is related to a peptide selected from the group comprising a) a cyclic peptide of formula (I): Cyclo(AIa-x-x-x-x-x-x-x-x-x-Cys-x-x-x-Pro-x-Cys-Cys-xk-GIn), (I) whereby k is any integer from 0 to 6, preferably any integer from 1 to 6, more preferably k=6; b) a cyclic peptide of formula (II): Cyclo(Ala-x-x-Trp-x-x-Gly-x-Phe-x-Cys-xh-Gln), (II) whereby h is any integer from 0 to 2, preferably 1 or 2; c) a cyclic peptide of formula (III): Cyclo(AIa-x-x-x-x-x-x-x-x-x-Cys-xj-Cys-x-x-x-Pro-x-Cys-Cys-xi-Gln); (HI) whereby j is any integer from 0 to 4, preferably j=4; whereby i is any integer from 0 to 6, preferably any integer from 1 to 6, more preferably i−6; and d) a peptide of formula (IV): Ala-x1-Cys-xm-Cys-x-x-x-Pro-x-Cys-Cys-xn-Gln, (IV) whereby 1 is any integer from 0 to 9, preferably any integer from 1 to 9, more preferably n=9; whereby m is any integer from 0 to 4, preferably any integer from 1 to 4, more preferably m=4; whereby n is any integer from O to 6, preferably any integer from 1 to 6, more preferably n=6; whereby x is any amino acid, preferably any naturally occurring amino acid, more preferably any naturally occurring L-amino acid. | 08-27-2009 |
| 20120288513 | Means for the inhibition of anti-beta1-adrenergic receptor antibodies - Embodiments of the present invention provide for novel peptides of use for detection and/or inhibition of anti-β1-adrenergic receptor antibodies. Certain embodiments concern uses of cyclic and/or linear peptides. In other embodiments, the present invention relates to novel peptides of use in diagnostic and/or pharmaceutical compositions. Some embodiments concern diagnosing and/or treating cardiac conditions. Cardiac conditions of the instant invention can concern infectious heart disease, non-infectious heart disease, ischemic heart disease, non-ischemic heart disease, inflammatory heart disease, myocarditis, cardiac dilatation, idiopathic cardiomyopathy, idiopathic dilated cardiomyopathy, immune-cardiomyopathy, heart failure, and any cardiac arrhythmia condition. | 11-15-2012 |
| 20120288870 | Means for the inhibition of anti-beta1-adrenergic receptor antibodies - Embodiments of the present invention provide for novel peptides of use for detection and/or inhibition of anti-β1-adrenergic receptor antibodies. Certain embodiments concern uses of cyclic and/or linear peptides. In other embodiments, the present invention relates to novel peptides of use in diagnostic and/or pharmaceutical compositions. Some embodiments concern diagnosing and/or treating cardiac conditions. Cardiac conditions of the instant invention can concern infectious heart disease, non-infectious heart disease, ischemic heart disease, non-ischemic heart disease, inflammatory heart disease, myocarditis, cardiac dilatation, idiopathic cardiomyopathy, idiopathic dilated cardiomyopathy, immune-cardiomyopathy, heart failure, and any cardiac arrhythmia condition. | 11-15-2012 |
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| 20100039003 | ELECTROMOTIVE ACTUATING DRIVE - An electric motor actuating drive for actuating elements designed such that the drive train, which is formed from spur gears, is not self-locking, and such that a braking spring is operatively connected to a gearbox stage upstream of the output-drive element of the drive train, such that, when the drive motor is disconnected, the actuating element is effectively prevented from being moved even when attempts are made to move it by external force or by extreme force. Furthermore, the actuating drive is in the form of a spring return and is equipped with a drive spring which is arranged such that the load on it is removed in the event of electrical power failure, and it therefore acts as a drive element. Furthermore, the electrical components are arranged in an end-face housing wall for a compact design. | 02-18-2010 |
| 20100263472 | LINEAR AXLE - A linear axle includes at least one vertical guide rail, a guide block having a housing and being movable along the at least one guide rail, at least one brake wedge associated with each guide rail and being movable in a longitudinal direction of the respective guide rail, a linear drive moving the at least one brake wedge into an out-of-operation position during normal operation, and a mechanical energy storing device configured to move the at least one brake wedge into an effective position, if the linear drive becomes ineffective during a service interruption. In an alternative embodiment, the guide block associated with a linear axle of the aforedescribed type may be stationary, whereas the respective guide rail may be movable along its longitudinal direction. | 10-21-2010 |
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| 20130143070 | Aluminium Material Which Can Be Exposed To High Temperatures, Is Alloyed With Scandium And Has Improved Extrudability - The present invention relates to the use of a process for producing an aluminium material which can be exposed to high temperatures and is alloyed with scandium. In this process, a precursor material made of an alloy comprising the metals aluminium and scandium is introduced into a vacuum chamber, the precursor material is subjected to vacuum degassing and the precursor material is treated with nitrogen gas. This is followed by final vacuum degassing of the precursor material. | 06-06-2013 |
| 20130312876 | Process for Producing an ALSCCA Alloy and also an AISCCA Alloy - A method for adding calcium to an aluminum-scandium alloy to produce an aluminum-scandium-calcium alloy involves combining aluminum, scandium, and calcium in a melt and the common melt is quenched at a high velocity. | 11-28-2013 |
| 20150027595 | Aluminum Material Having Improved Precipitation Hardening - An aluminum material for producing light-weight components includes aluminum (Al), scandium (Sc), zirconium (Zr) and ytterbium (Yb), where a weight ratio of scandium (Sc) to zirconium (Zr) to ytterbium (Yb) [Sc/Zr/Yb] is in a range from 10/5/2.5 to 10/2.5/1.25. | 01-29-2015 |
| 20150122378 | SOLAR CELL INTERCONNECTOR AND MANUFACTURING METHOD THEREOF - A high electrical conductive, high temperature stable foil material, a process for the preparation of such a high electrical conductive, high temperature stable foil material, a solar cell interconnector including the high electrical conductive, high temperature stable foil material as well as the use of the high electrical conductive, high temperature stable foil material and/or the solar cell interconnector in solar power, aircraft or space applications. The high electrical conductive, high temperature stable foil material includes an aluminium alloy that has at least two elements selected from the group of scandium (Sc), magnesium (Mg), zirconium (Zr), ytterbium (Yb) and manganese (Mn). | 05-07-2015 |
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| 20120028512 | Electrode Connection, in Particular for an Electrode Catheter - An electrode connection for an electrode catheter including an electrode, a line for electrical signals configured as a coil having an electrode end connected to the electrode, and a fixation device for the electrode end of the coil on the electrode, wherein the fixation device includes an inner sleeve, on which the electrode end of the coil sits, and a squeeze ring, which acts upon the electrode end of the coil, establishing an electrical contact with the electrode and mechanical clamping on the inner sleeve. | 02-02-2012 |
| 20120184836 | Implantable Electrode Lead - An implantable electrode lead for transmitting electrical impulses to excitable bodily tissue and/or for transmitting electrical signals tapped at bodily tissue to a detection unit. The electrode lead including a distal electrode, a proximal electrode connector, and an electrode supply lead which connects the electrode, or each electrode, to the electrode connector, or each electrode connector, and extends in a lead body, wherein the lead body includes a hinged alignment of hard elements. | 07-19-2012 |
| 20120290056 | Implantable Medical Lead - An implantable medical lead for transmitting electrical pulses to excitable bodily tissue and/or signals detected at bodily tissue to a detection and evaluation unit, including a distal electrode or a distal sensor, or actuator; a proximal electrode connector or sensor/actuator connector; and a lead pole which connects the electrode or the sensor or actuator to the electrode connector or sensor/actuator connector and extends in the lead body, wherein the lead pole comprises at least two separate and individually insulated conductors which are electrically interconnected at least at one point which functions as an interchange point, or reversal point, in the lead extension from the proximal electrode or sensor connector to the distal electrode or the distal sensor, and wherein at least one of the separate conductors, in particular close to the reversal point, is interrupted at least once and/or is not connected at one end. | 11-15-2012 |
| 20130150941 | Conductive Coil Arrangement and Electrode Catheter Arrangement, in Particular for Cardiac Therapy - A conductive coil arrangement, in particular for electrode catheters for cardiac therapy, including a multipolar conductive coil having a plurality of coradially interwoven individual coil wires and a contact zone in which at least one individual coil wire from the conductive coil can be connected to a contact element for electrical contacting. The at least one individual coil wire to be contacted is routed outwardly out of the wire interconnection of the conductive coil with a radial direction component. The remainder of the conductive coil is routed further centrally axially through the contact zone. | 06-13-2013 |
| 20130226274 | Electrode Catheter, in Particular for Cardiac Therapy - An electrode catheter, in particular for cardiac therapy, includes an elongated, tube-type catheter body, a ring electrode before the distal end of the electrode catheter for delivery and/or measurement of an electrical signal, in particular an electrocardio signal, by way of the outer electrode contact surface thereof, and a supply lead for the electrical connection of the ring electrode. The ring electrode is mounted on the catheter body such that it can be displaced relative thereto in the longitudinal axial direction. | 08-29-2013 |
| 20140303702 | Contacting Device for Electrical Connections to Flexible Electrode Lines - A contacting device for electrical connections to flexible electrode lines insertable or implantable into a patient body, includes a line coil with a plurality of coradially bundled coil wires, an inner fixing sleeve for a partial bundle of the coil wires, the fixing sleeve has a through-slit running in the axial direction for the partial bundle of the coil wires, and a winding groove running in the peripheral direction for the partial bundle led through, an outer electrode sleeve sitting on the inner fixing sleeve and electrically contacted with the partial bundle, and a strain-resistant fixing between the fixing sleeve and the partial bundle guided through the through-slit via an application of force on the partial bundle by pressing the fixing sleeve onto the line coil to produce plastic deformation and by looping the led-out partial bundle around the fixing sleeve in the winding groove by a minimum looping angle. | 10-09-2014 |
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| 20130029479 | ARRANGEMENT, SYSTEM, AND METHOD FOR PROCESSING MULTILAYER BODIES - The invention relates to a multilayer body arrangement, which comprises at least two multilayer bodies each having at least one surface to be processed as well as at least one device for positioning the multilayer bodies, wherein the device is configured such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. It further relates to a system for processing multilayer bodies with such a multilayer body arrangement, as well as a method for processing multilayer bodies, wherein the multilayer bodies are disposed such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. | 01-31-2013 |
| 20130045558 | DEVICE AND METHOD FOR PRECIPITATING A LAYER ON A SUBSTRATE - A device for depositing a layer containing at least two components on an object, including: a deposition chamber; a source containing a material to be deposited; and a control device, which controls the deposition process, implemented such that a concentration of the component of the material can be modified in its gas phase prior to deposition on the object by selective binding a specified quantity of the component, wherein the selectively bound quantity of the component is controlled by modifying a control parameter that is actively coupled to a binding rate or the component, and wherein the control device contains a gettering element containing a reactive material containing copper and/or molybdenum. Also, a method for depositing a layer containing at least two components on an object, wherein a selectively bound quantity of a component is controlled by modifying a binding rate of the component of the control device. | 02-21-2013 |
| 20130067723 | DEVICE FOR FORMING A REDUCED CHAMBER SPACE, AND METHOD FOR POSITIONING MULTILAYER BODIES - A device for forming a reduced chamber space, which is a process box or a process hood, containing an apparatus, which positions at least two multilayer bodies each including a surface to be processed, wherein the apparatus is designed such that the multilayer bodies are opposite to each other, wherein the surfaces to be processed are facing away from each other such that the multilayer bodies can be processed as a multilayer body arrangement in a processing system. In addition, a method for positioning the two multilayer bodies comprising a surface to be processed, with the two multilayer bodies disposed in such a device such that multilayer bodies are opposite each other, wherein the surfaces to be processed are facing away from each other, such that the multilayer bodies are processable as a multilayer body arrangement in a processing system. | 03-21-2013 |
| 20150072460 | DEVICE AND METHOD FOR PRECIPITATING A LAYER ON A SUBSTRATE - The invention relates to a device for depositing a layer made of at least two components on an object, with a deposition chamber for disposing the object, at least one source with material to be deposited, as well as at least one device for controlling the deposition process, implemented such that the concentration of at least one component of the material to be deposited can be modified in its gas phase prior to deposition on the substrate by selective binding of a specified quantity of the at least one component, wherein the selectively bound quantity of the at least one component can be controlled by modifying at least one control parameter that is actively coupled to a binding rate or the component. It further relates to a device for depositing a layer made of at least two components on an object, wherein a device for controlling the deposition process has at least one gettering element made of a reactive material, wherein the reactive material includes copper and/or molybdenum. It further relates to a method for depositing a layer made of at least two components on an object, wherein a selectively bound quantity of at least one component is controlled by modifying a binding rate of a device for controlling the deposition process. | 03-12-2015 |
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| 20100147384 | METHOD OF MANUFACTURING A PHOTOVOLTAIC DEVICE AND SYSTEM FOR PATTERNING AN OBJECT - A method of manufacturing a photovoltaic device, which method comprises the steps of providing a first layer structure on an second layer structure so that the first layer structure has an external surface, and an interface with the second layer structure, the first layer structure comprising a thin-film photovoltaic absorber layer; patterning through the first layer structure from the external surface to or into the second layer structure by first mechanically removing material from the first layer structure in a predetermined patterning area, and subsequently removing, by means of laser cleaning, residual material from the mechanical removal in the patterning area; and a system for patterning an object having a first layer structure on an second layer structure, the system comprising a mechanical patterning device and a laser cleaning device, and means for relative movement between the object, and the mechanical patterning device and the laser cleaning device. | 06-17-2010 |
| 20110117693 | DEVICE AND METHOD FOR TEMPERING OBJECTS IN A TREATMENT CHAMBER - The invention relates to a device ( | 05-19-2011 |
| 20110168258 | LAYER SYSTEM FOR SOLAR CELLS - The present invention relates to a layer system ( | 07-14-2011 |
| 20150197850 | SYSTEM AND METHOD FOR PROCESSING SUBSTRATES - The present invention relates to a system for processing coated substrates, having the following features: at least one evacuable process box for accommodating at least one substrate with a gas-tightly sealable housing, which forms a hollow space, wherein the housing comprises at least one housing section, which is implemented such that the substrate is thermally treatable by incident electromagnetic thermal radiation, wherein the housing has at least one housing section coupleable to a cooling device for its cooling and at least one housing section not coupled to the cooling device, wherein the hollow space is divided by at least one separating wall into a process space for accommodating the substrate and an intermediate space, wherein the separating wall has one or a plurality of openings and is arranged between the substrate and the housing section coupled to the cooling device, and wherein the housing is provided with at least one sealable gas passage that opens into the hollow space, for evacuating and introducing gas into the hollow space; a cooling device for cooling the process box housing section coupleable to the cooling device; at least one loading/unloading unit for loading and/or unloading the process box; at least one heating unit for heating the substrate in the process box; at least one cooling unit for cooling the substrate in the process box; at least one pumping-out device for draining the hollow space of the process box; at least one gas supply device for supplying the hollow space of the process box with at least one gas; at least one transport mechanism, which is implemented for the purpose of executing a relative movement between, on the one hand, the process box and, on the other, the heating, cooling, and loading/unloading unit. | 07-16-2015 |
| 20150206781 | DEVICE AND METHOD FOR HEAT TREATING AN OBJECT - The present invention relates to a device for heat treating an object, in particular a coated substrate, with an in particular gas-tightly sealable housing that encloses a hollow space, wherein the hollow space has a separating wall, by which the hollow space is divided into a process space for accommodating the object and an intermediate space, wherein the separating wall has one or a plurality of openings, which are implemented such that the separating wall acts as a barrier for the diffusion out of the process space into the intermediate space of a gaseous substance generated in the process space by the heat treatment of the object. The housing has at least one housing section coupled to a cooling device for its active cooling, wherein the separating wall is arranged between the object and the coolable housing section. The invention further relates to the use of a separating wall as a diffusion barrier in a device for heat treating an object as well as a corresponding method for heat treating an object. | 07-23-2015 |
| 20150295105 | LAYER SYSTEM FOR THIN-FILM SOLAR CELLS HAVING AN NaxIn1SyClz BUFFER LAYER - The present invention relates to a layer system ( | 10-15-2015 |
| 20150325722 | LAYER SYSTEM FOR THIN-FILM SOLAR CELLS - The present invention relates to a layer system ( | 11-12-2015 |
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| 20090200911 | ELECTRODE ARRANGEMENT - Disclosure of an electrode arrangement ( | 08-13-2009 |
| 20100112235 | METHOD FOR TREATING PLASMA UNDER CONTINUOUS ATMOSPHERIC PRESSURE OF WORK PIECES, IN PARTICULAR, MATERIAL PLATES OR STRIPS - The invention relates to a method for treating plasma under continuous atmospheric pressure of, in particular, electrically insulating workpieces, in particular material plates or strips. According to said method, the workpiece which is to be machined, is arranged at a distance below at least one electrode which is made of two barrier electrodes, which are arranged in a successive manner in the direction of displacement with a gap, and which extends in a manner which is transversal to the direction of displacement at least over the width of the surface of the workpiece which is to be machined. The electrode and the workpiece are mutually offset in the direction of displacement. High voltage, which is in the form of an alternating voltage, is applied to the barrier electrodes, in order to provoke at least plasma discharge in the gap. The plasma discharge is driven by the gas flow from the gap in the direction of the surface of the workpiece which is to be machined. The invention is characterised in that the surfaces of the barrier electrodes which are oriented towards the surface of the workpiece which is to be machined are impinged upon with high pressure. | 05-06-2010 |
| 20100221451 | METHOD FOR TREATING PLASMA AND/OR COVERING PLASMA OF WORKPIECES UNDER CONTINUOUS ATMOSPHERIC PRESSURE, IN PARTICULAR MATERIAL PLATES OR STRIPS - The present invention provides a method with which a workpiece can be subjected to an atmospheric-pressure plasma treatment and/or plasma discharge on a side facing away from the high-voltage electrodes inducing the plasma discharge. | 09-02-2010 |
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| 20140175624 | METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT - A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier; fixing the chip to the metal structure; removing the carrier to thereby expose at least one contact of the chip; and forming an electrically conductive connection between the at least one contact of the chip and the metal structure. | 06-26-2014 |
| 20150041993 | METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND A CHIP ARRANGEMENT - A method for manufacturing a chip arrangement may include: disposing a stabilizing structure and a chip including at least one contact next to each other and over a carrier; encapsulating the chip and the stabilizing structure by means of an encapsulating structure; and forming an electrically conductive connection to the at least one contact of the chip. | 02-12-2015 |
| 20150115458 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip. | 04-30-2015 |
| 20150115475 | DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH DEVICE - A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip. | 04-30-2015 |
| 20150123255 | METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT - A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier; fixing the chip to the metal structure; removing the carrier to thereby expose at least one contact of the chip; and forming an electrically conductive connection between the at least one contact of the chip and the metal structure. | 05-07-2015 |
| 20150131247 | Electrically conductive frame on substrate for accommodating electronic chips - A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips. | 05-14-2015 |
| 20150162319 | Semiconductor Device Including Multiple Semiconductor Chips and a Laminate - A semiconductor device includes a laminate, a first semiconductor chip at least partly embedded in the laminate, a second semiconductor chip mounted on a first main surface of the laminate, and a first electrical contact arranged on the first main surface of the laminate. The second semiconductor chip is electrically coupled to the first electrical contact. | 06-11-2015 |
| 20150163920 | Method for manufacturing an electronic module and an electronic module - This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued. | 06-11-2015 |
| 20150221569 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate - Electronic module ( | 08-06-2015 |
| 20150228616 | Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil - A method of manufacturing semiconductor modules includes providing a metal composite substrate including a metal foil attached to a metal layer, the metal foil being thinner than and comprising a different material than the metal layer, attaching a first surface of a plurality of semiconductor dies to the metal foil prior to structuring the metal foil, and encasing the semiconductor dies attached to the metal foil in an electrically insulating material. The metal layer and the metal foil are structured after the semiconductor dies are encased with the electrically insulating material so that surface regions of the electrically insulating material are devoid of the metal foil and the metal layer. The electrically insulating material is divided along the surface regions devoid of the metal foil and the metal layer to form individual modules. | 08-13-2015 |
| 20150289379 | Manufacture of a circuit board and circuit board containing a component - Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing ( | 10-08-2015 |
| 20150332938 | Electronic Device Package Including Metal Blocks - A method of manufacturing an electronic device package includes structuring a metal layer to generate a structured metal layer having a plurality of openings. Semiconductor chips are placed into at least some of the openings. An encapsulating material is applied over the structured metal layer and the semiconductor chips to form an encapsulation body. The encapsulation body is separated into a plurality of electronic device packages. | 11-19-2015 |
