| Patent application number | Description | Published |
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| 20080214031 | ELECTRICAL CONNECTOR - An electrical connector includes a plurality of contacts to be connected to a cable, a housing for arranging and holding the contacts, a shell dividable into two shells covering the housing and having a holding device for holding the cable, and an insulating member covering the shell. One of the shells is provided with anchoring portions and the other shell is provided with engaging portions so that when both the shells are fitted with each other, the anchoring portions and the engaging portions are engaged with each other to bring both the shells into electrical continuity with each other. Therefore, the shells can be securely held together to achieve reliable electrical continuity between the shells, and at the same time grounding between the cable and the shell and between the shells themselves can be achieved. | 09-04-2008 |
| 20080214050 | ELECTRICAL CONNECTOR - An electrical connector to be detachably fitted with a mating connector, including a plurality of contacts, a housing for arranging and holding the contacts, and a shell covering the housing and forming with the housing a fitting opening for the mating connector. The shell has at least one engaging piece, and the housing has an anchoring portion at a location corresponding to the engaging piece to cause the anchoring portion to engage the engaging piece, thereby restraining the housing from being displaced in the direction opposite to the fitting direction upon fitting with the mating connector. Even being miniaturized, the electrical connector is securely positioned relative to the mating connector when fitting with it, and the housing is securely prevented from being displaced upon the mating connector abutting against the housing, thereby completely preventing any defective connection. | 09-04-2008 |
| Patent application number | Description | Published |
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| 20090258216 | SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT - A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability. | 10-15-2009 |
| 20130146939 | SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT - A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability. | 06-13-2013 |
| Patent application number | Description | Published |
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| 20130197139 | CURABLE ORGANOPOLYSIOLXANE COMPOSITION, OPTICAL DEVICE SEALING MATERIAL, AND OPTICAL DEVICE - The present invention is a curable organopolysiloxane composition containing (A) a compound shown by the following average composition formula (1), wherein R | 08-01-2013 |
| 20140171599 | ADDITION-CURABLE SILICONE COMPOSITION AND OPTICAL ELEMENT - An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least:
| 06-19-2014 |
| 20140203323 | PRIMER COMPOSITION AND OPTICAL SEMICONDUCTOR APPARATUS USING SAME - The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, includes (A) silazane compound or polysilazane compounds that has one or more silazane bonds in the molecule, (B) acrylic resin containing either one or both of acrylate ester and methacrylate ester that contains one or more SiH groups in the molecule, and (C) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode on the substrate can be prevented, and the heat resistance and flexibility of a primer can be improved. | 07-24-2014 |
| 20140209968 | PRIMER COMPOSITION AND OPTICAL SEMICONDUCTOR APPARATUS USING SAME - The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH | 07-31-2014 |
