Patent application number | Description | Published |
20110186868 | LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
20110186875 | LED PACKAGE - According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips. | 08-04-2011 |
20110186886 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package. | 08-04-2011 |
20110186900 | LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface. | 08-04-2011 |
20110186901 | LED PACKAGE - According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame. | 08-04-2011 |
20110186902 | LED PACKAGE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
20110193112 | LED MODULE - According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package. | 08-11-2011 |
20120080674 | LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other. | 04-05-2012 |
20120161180 | LED PACKAGE - According to one embodiment, an LED package includes a first lead frame and a second lead frame, an LED chip and a resin body. The resin body covers the LED chip and the top face, a part of the bottom face and a part of the end face, of each of the first and the second lead frames, and exposes the remaining part of the bottom face and the remaining part of the end face. The resin body includes a first part and a second part. The first part is disposed between the top face of the LED chip and a region immediately above the LED chip of the top face of the resin body and transmits light emitted by the LED chip. The second part surrounds the first part and has a transmittance of the light lower than a transmittance in the first part. | 06-28-2012 |
Patent application number | Description | Published |
20120149260 | LIFE PRESERVER - The present invention utilizes the resilient force (i.e. the force to deform when pressure is added and to return to the original shape when the pressure is removed) of an elastic member or bias member. A large pressure if added in advance to the elastic member or bias member disposed in a preserver body to set the preserver body in a thin and flat state. In an emergency, the resilient force of the elastic member or bias member causes water or air to be sucked into the preserver body. The volume of the preserver body is expanded by the air sucked in due to the resilient force of the elastic member or bias member or by gas generated by a chemical reaction between the sucked-in water and a foaming agent. The increased volume causes the preserver body to float, thereby enabling a wearer to breathe. | 06-14-2012 |
20130028368 | PEDOMETER FOR SHOE - An electromotive unit that produces an electric current in response to a pressure applied thereto when a user lands the ground on his/her foot while walking or running, or a pressure detector that detects variation in the applied pressure is formed like a flat plate and arranged within a small space in a shoe. A wire material is provided to deliver, outside the shoe, the electric current produced in response to the pressure applied when the user lands the ground on his/her foot or a signal indicative of the variation in the applied pressure. The wire material is connected to a pedometer unit outside the shoe to perform counting. The wire material can be fixed and mounted onto a desired portion in the opening of the shoe by using a fastener or by being formed as a fixable wire material. | 01-31-2013 |
20140315456 | LIFE PRESERVER - The present invention utilizes the resilient force (i.e. the force to deform when pressure is added and to return to the original shape when the pressure is removed) of an elastic member or bias member. A large pressure if added in advance to the elastic member or bias member disposed in a preserver body to set the preserver body in a thin and flat state. In an emergency, the resilient force of the elastic member or bias member causes water or air to be sucked into the preserver body. The volume of the preserver body is expanded by the air sucked in due to the resilient force of the elastic member or bias member or by gas generated by a chemical reaction between the sucked-in water and a foaming agent. The increased volume causes the preserver body to float, thereby enabling a wearer to breathe. | 10-23-2014 |
Patent application number | Description | Published |
20090058226 | TUNING FORK OSCILLATING PIECE, TUNING FORK OSCILLATOR, AND ACCELERATION SENSOR - A tuning fork oscillating piece includes: a base; a pair of oscillating arms extending from the base in directions substantially parallel with each other; a drive piezoelectric element provided at least on one main surface or side surface of each of the oscillating arms to allow bending oscillation of the oscillating arms by piezoelectric distortion caused by applied charge; a detection piezoelectric element provided on the surface opposed to the surface of each of the oscillating arms on which the drive piezoelectric element is provided to convert the piezoelectric distortion caused by the bending oscillation of the oscillating arms into charge and output the charge. The drive piezoelectric element has a drive piezoelectric section. The detection piezoelectric element has a detection piezoelectric section. The absolute value of the piezoelectric d constant of the drive piezoelectric section is larger than the absolute value of the piezoelectric d constant of the detection piezoelectric section. The absolute value of the piezoelectric g constant of the detection piezoelectric section is larger than the absolute value of the piezoelectric g constant of the drive piezoelectric section. | 03-05-2009 |
20130055810 | DETECTION CIRCUIT, PHYSICAL QUANTITY DETECTION APPARATUS, ANGULAR VELOCITY DETECTION APPARATUS, INTEGRATED CIRCUIT DEVICE, AND ELECTRONIC INSTRUMENT - A detection circuit includes a synchronous detection circuit (synchronous detection section) that synchronously detects a signal that includes a detection signal of a vibrator (an output signal of an amplifier), a switched capacitor filter (SCF) circuit that filters a signal that has been synchronously detected by the synchronous detection circuit (an output signal of a programmable gain amplifier), and an output buffer that buffers and outputs a signal that has been filtered by the SCF circuit, the gain of the SCF circuit being larger than 1. | 03-07-2013 |
20130055815 | SIGNAL PROCESSING CIRCUIT, PHYSICAL QUANTITY DETECTION APPARATUS, ANGULAR VELOCITY DETECTION APPARATUS, INTEGRATED CIRCUIT DEVICE, AND ELECTRONIC INSTRUMENT - A signal processing circuit includes an I/V conversion circuit (current/voltage conversion section) that converts an oscillation current of a vibrator into a voltage, an RC filter (phase shift section) that shifts a phase of the output signal of the I/V conversion circuit, a full-wave rectifier (part of a drive amplitude control section) that binarizes a signal that has been shifted in phase to generate a switch control signal, a comparator (reference signal generation section) that generates a reference signal for synchronous detection based on the output signal of the I/V conversion circuit, and an EXOR circuit (clock signal generation section) that generates a clock signal for a switched capacitor filter (SCF) that has a frequency twice a frequency of a drive signal based on a phase difference between the reference signal and the switch control signal. | 03-07-2013 |
20130057354 | DRIVER CIRCUIT, PHYSICAL QUANTITY DETECTION APPARATUS, ANGULAR VELOCITY DETECTION APPARATUS, INTEGRATED CIRCUIT DEVICE, AND ELECTRONIC INSTRUMENT - A driver circuit includes a comparator (drive signal generation section) that generates a drive signal based on a signal obtained by converting an oscillation current of a vibrator that has been input via a first signal line into a voltage using an I/V conversion circuit (current/voltage conversion section), and supplies the drive signal to the vibrator via a second signal line, an oscillation detection circuit (oscillation detection section) that detects whether or not the oscillation current has reached a predetermined value after the vibrator has started to oscillate, a startup oscillation circuit (startup oscillation section) that assists an oscillation operation of the vibrator until the oscillation current reaches the predetermined value, and a switch that separates a capacitor from the second signal line until the oscillation current reaches the predetermined value, and connects the capacitor to the second signal line when the oscillation current has reached the predetermined value. | 03-07-2013 |
Patent application number | Description | Published |
20100206075 | COMPOSITE SENSOR AND ELECTRONIC DEVICE - A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space. | 08-19-2010 |
20100212426 | ACCELERATION SENSOR AND ELECTRONIC DEVICE - An acceleration sensor includes: a support member; a fixed electrode provided on the support member; a movable unit; a movable electrode provided on the movable unit and disposed opposed to the fixed electrode to generate capacity; and a projection extending from the opposed surface of at least either the fixed electrode or the movable electrode in one direction within the surface. | 08-26-2010 |
20110138911 | VIBRATING REED, VIBRATOR, PHYSICAL QUANTITY SENSOR, AND ELECTRONIC APPARATUS - A resonator element includes: drive beams including a first beam and a second beam that vibrate in torsional vibration modes and are elongated side by side in a first direction; support parts that couple one ends and the other ends of the first beam and the second beam; and detection arms elongated from the respective first beam and second beam in a second direction orthogonal to the first direction in a plan view, wherein, in a drive mode, the first beam and the second beam torsionally vibrate in opposite directions to each other, the respective detection arms vibrate in a normal direction of a plane containing the first direction and the second direction, and the detection arm elongated from the first beam and the detection arm elongated from the second beam vibrate in the same direction as each other. | 06-16-2011 |
20110162450 | VIBRATING ELEMENT, VIBRATOR, AND ELECTRONIC APPARATUS - A vibrating element includes: a first support portion and a second support portion; a first vibrating arm which extends along a first axis, one end of the first vibrating arm being connected to the first support portion; a second vibrating arm which extends along the first axis, one end of the second vibrating arm being connected to the second support portion; an oscillating member which is sandwiched between the other ends of the first vibrating arm and the second vibrating arm, and has openings; and detection arms which extend along a second axis perpendicular to the first axis from the inner walls of the openings of the oscillating member in plan view. | 07-07-2011 |
20130081462 | COMPOSITE SENSOR AND ELECTRONIC DEVICE - A composite sensor includes: a package including a container and a lid; a plurality of spaces that is partitioned by at least the container and the lid, and has different pressures, the plurality of the spaces including a first space sealed at around an atmospheric pressure and a second space sealed at a depressurized state; an acceleration sensor element disposed in the first space; and a vibration type angular velocity sensor element disposed in the second space. In the sensor, the first space has a volume smaller than a volume of the second space. | 04-04-2013 |
20140290363 | PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND MOVING OBJECT - A physical quantity sensor includes: a sensor element which detects predetermined physical quantity; a driving circuit which generates a driving signal of the sensor element; and an AGC circuit which controls the driving signal at a constant level according to a reference voltage, based on an output signal of the sensor element, in which the reference voltage is variable. | 10-02-2014 |
Patent application number | Description | Published |
20080273055 | PRINTING APPARATUS - For a serial color ink jet printing apparatus that forms an image using a symmetric printing head that ejects large dots and small dots, the configuration of a printing head is provided for suppressing, to the extent possible, a cyclic fluctuation in the main scanning direction. According to the present invention, individual nozzle arrays are arranged so that two nozzle arrays, i.e., a cyan nozzle array c | 11-06-2008 |
20100013876 | LIQUID APPLICATION DEVICE AND INK JET RECORDING APPARATUS - The present invention provides an inkjet recording apparatus and a recording apparatus capable of reducing wear of a roller for application, even if liquid (for example, application liquid) is insufficient in a case where liquid is applied to recording media. In an embodiment of the present invention, in a case where it is determined that the application liquid is sufficient in a storage tank, the application liquid is filled in a liquid retention space, the application liquid is applied to the recording medium, and thus recording is performed. In a case where it is determined that the liquid application is insufficient in the storage tank, recording with application is prohibited. | 01-21-2010 |
20100328393 | LIQUID APPLICATION DEVICE, INKJET RECORDING APPARATUS, AND METHOD OF CONTROLLING LIQUID APPLICATION DEVICE - The present invention provides a liquid application device, an inkjet recording apparatus and a recording apparatus, which are capable of performing an adequate application initial operation according to the length of waiting time and power-off time, as well as a method of controlling the liquid application device. In the present invention, information on an end time of the previous processing for collecting liquid is read from a nonvolatile memory, current time information indicating the current time is obtained, and information on a lapse of time from the end time of the previous collection to a start time of the current application. Thereafter, the number of preliminary rotations R of an application roller is decided based on the information on the lapse of time with reference to a look-up table. Sequentially, the application roller is rotated by the decided number of preliminary rotations R to perform preprocessing operation. | 12-30-2010 |
20110216142 | LIQUID APPLICATION DEVICE AND INK JET RECORDING APPARATUS - The present invention provides a liquid application device and an ink jet recording apparatus each capable of reducing deterioration in application quality due to an increase in the number of times of use of a roller, thereby improving durability. The present invention includes an application roller which applies liquid to an application medium, and a liquid retention member which retains the liquid in a liquid retention space formed by making the application roller be in contact with the retention member. With this structure, a pool of the liquid is formed, with rotation of the application roller, in an area upstream of a contact area, in a rotational direction, between the application member and the retention member at a side where a surface of the application member enters the contact area therebetween. | 09-08-2011 |
20120062651 | PRINTING APPARATUS - For a serial color ink jet printing apparatus that forms an image using a symmetric printing head that ejects large dots and small dots, the configuration of a printing head is provided for suppressing, to the extent possible, a cyclic fluctuation in the main scanning direction. According to the present invention, individual nozzle arrays are arranged so that two nozzle arrays, i.e., a cyan nozzle array c | 03-15-2012 |
Patent application number | Description | Published |
20130256743 | PRODUCTION METHOD FOR GROUP III NITRIDE SEMICONDUCTOR AND GROUP III NITRIDE SEMICONDUCTOR - A method for producing a Group III nitride semiconductor comprising forming mesas on a main surface of a substrate, and growing Group III nitride semiconductor in a c-axis direction thereof, wherein the plane most parallel to the side surfaces of the mesas or the dents among the low-index planes of growing Group III nitride semiconductor is a m-plane (1-100), and when a projected vector obtained by orthogonally projecting a normal vector of the processed side surface to the main surface is defined as a lateral vector, an angle between the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5° or more and 6° or less. | 10-03-2013 |
20130260541 | METHOD FOR PRODUCING Ga-CONTAINING GROUP III NITRIDE SEMICONDUCTOR - A method for producing a Ga-containing group III nitride semiconductor having reduced threading dislocation is disclosed. A buffer layer in a polycrystal, amorphous or polycrystal/amorphous mixed state, comprising AlGaN is formed on a substrate. The substrate having the buffer layer formed thereon is heat-treated at a temperature higher than a temperature at which a single crystal of a Ga-containing group III nitride semiconductor grows on the buffer layer and at a temperature that the Ga-containing group III nitride semiconductor does not grow, to reduce crystal nucleus density of the buffer layer as compared with the density before the heat treatment. After the heat treatment, the temperature of the substrate is decreased to a temperature that the Ga-containing group III nitride semiconductor grows, the temperature is maintained, and the Ga-containing group III nitride semiconductor is grown on the buffer layer. | 10-03-2013 |
20140353804 | Method for Producing Group III Nitride Semiconductor and Group III Nitride Semiconductor - A first side surface of post of the first stripe is formed so that a plane which is most parallel to the first side surface among low-index planes of the growing Group III nitride semiconductor is a m-plane (10-10), and a first angle between the first lateral vector obtained by orthogonally projecting a normal vector of the first side surfaces to the main surface and a m-axis projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing semiconductor to the main surface is from 0.5° to 6°. A second side surface of post of the second stripe is formed so that a plane which is most parallel to the second side surface among low-index planes of the growing semiconductor is an a-plane (11-20), and a second angle between the second lateral vector and an a-axis projected vector of the a-plane is from 0° to 10°. | 12-04-2014 |