Osamu Morita
Osamu Morita, Yokosuka-Shi JP
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20090262150 | INK JET PRINTING APPARATUS - An air pump is driven to supply air via an air supply tube to a sub tank, by which a predetermined quantity of the air is mixed inside the sub tank via a gas-liquid separation membrane. Next, a carriage is swayed to agitate the ink by using the air mixed inside the sub tank. Then, the air pump is driven to discharge the air inside the sub tank via the gas-liquid separation membrane. In the above-described agitating motions, since the air utilized for the agitation is discharged from an ink tank after agitation processing, it is possible to prevent the air from remaining inside the ink tank to inflate, thereby adversely influencing the pressure relationship with a printing head. | 10-22-2009 |
20100156996 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME - A liquid discharge head includes a liquid discharge substrate including a discharge port for discharging liquid, and a flow path member including a transparent member that is transparent to a laser beam, an absorption member capable of absorbing a laser beam, and a flow path for supplying liquid to the liquid discharge substrate, wherein the flow path is formed between the transparent member and the absorption member by emitting a laser beam toward a flow path portion of the absorption member constituting a portion of a wall of the flow path and toward a periphery of the flow path portion through the transparent member and thereby welding the transparent member and the absorption member at the periphery of the flow path portion, and wherein the flow path portion includes an inclined surface inclined with respect to a direction of the laser beam that has passed through the transparent member. | 06-24-2010 |
20100257736 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - There is provided a method for manufacturing a liquid discharge head that includes a discharge port, a supply path for supplying the liquid to the discharge port, a transparent member, and an absorptive member, wherein the transparent member and the absorptive member include supply path sections that become a part of a wall of the supply path. The method includes bringing the transparent and absorptive member into contact with each other in such a manner that surfaces of both members including the supply path sections are brought into contact with each other in the vicinity of the supply path sections, welding the both members by irradiating the contact portion where the both members are in contact with each other with the laser beam, and exhausting gas from an exhaust path formed on the liquid discharge head in the vicinity of the contact portion at least throughout the welding process. | 10-14-2010 |
20110069119 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME - A liquid discharge head includes a liquid discharge substrate including a discharge port; a flow path for supplying liquid to the liquid discharge substrate; an absorption member capable of absorbing a laser beam, wherein a first flow path portion constituting a portion of a wall of the flow path is formed on a surface thereof; and a transparent member transparent to a laser beam, wherein a second flow path portion constituting another portion of the wall of the flow path is formed on a surface thereof; wherein the flow path is formed by welding the surfaces of the absorption and transparent members with each other at a periphery of the first flow path portion using a laser beam, and wherein the second flow path portion is constituted by a depression including an inclined surface capable of reflecting a laser beam directed toward the first flow path portion. | 03-24-2011 |
20110083758 | LIQUID SUPPLY MEMBER, METHOD OF MAKING LIQUID SUPPLY MEMBER, AND METHOD OF MAKING LIQUID DISCHARGE HEAD - A method of making a liquid supply member includes a preparation step of preparing a transparent member including a first surface having a first opening portion and an absorption member including a second surface having a second opening portion, a contact step of making the transparent member and the absorption member contact each other at a contact portion so that the first opening portion and the second opening portion overlap, and a welding step of forming a first supply path by welding the transparent member and the absorption member to each other by irradiating the contact portion with a laser beam, the first supply path including the first opening portion and the second opening portion, wherein, after the contact step and before the welding step, a space is formed between the contact portion and the first supply path and between the first surface and the second surface. | 04-14-2011 |
20110114207 | LIQUID SUPPLY MEMBER, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A method is provided for manufacturing a liquid supply member including a transmissive member and a transmissive member, one of which having a groove, and configured to supply liquid to a liquid ejection port. The method includes bringing the transmissive member and the absorptive member into contact, with the groove inside; forming a supply passage by radiating laser light, via the transmissive member, from a plurality of first laser light sources disposed along a longitudinal direction of the groove toward a first contact portion at a periphery of the groove to weld the transmissive member and the absorptive member; and radiating laser light, via the transmissive member, from a second laser light source provided in a vicinity of a laser light source at an end of the groove in the longitudinal direction toward a vicinity portion of the absorptive member. | 05-19-2011 |
20110115850 | LIQUID SUPPLY MEMBER, MANUFACTURING METHOD OF LIQUID SUPPLY MEMBER, LIQUID DISCHARGE HEAD, AND MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD - A liquid supply member for supplying a liquid to a liquid discharge head having a discharge port which discharges a liquid, includes: a first member consisting of a resin material; a second member consisting of a resin material; and a supply path formed by joining the first member and the second member to each other, the supplying path supplying a liquid to the liquid discharge head, wherein at least a part of an internal surface of the supply path is a smooth surface smoothed by melting the resin after being molded. | 05-19-2011 |
20120222309 | METHOD FOR MANUFACTURING LIQUID SUPPLY MEMBER AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid supply member that supplies a discharge port with liquid includes preparing a transparent member and an absorption member, at least one of both members having a groove for a supply path; bringing both members into contact; and forming the supply path by emitting laser beams simultaneously from a plurality of laser beam sources, toward a contact portion, which is provided in a vicinity of the groove and at which both members are in contact, to weld both members. Laser beams are emitted during the forming such that a total laser-beam irradiation amount per unit area for a first portion included in the contact portion and located in a vicinity of an end in a longitudinal direction of the groove is larger than that for part with a smallest irradiation amount of a second portion other than the first portion of the contact portion. | 09-06-2012 |
Osamu Morita, Toyokawa-Shi JP
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20090314478 | MANUFACTURING METHOD OF HEAT EQUALIZING MEMBER FOR FIXING DEVICE AND HEAT EQUALIZING MEMBER FOR FIXING DEVICE - In a manufacturing method of a heat equalizing member for a fixing device of the invention, first, an elongated cylindrical pipe is prepared which is made of a metallic material and which has one end sealed while the other end opened. Next, a heat-resistant releasing layer is formed on the outer face of the pipe in close contact therewith. Then, operating fluid is injected into the pipe from an outside through the other end of the pipe, while the other end is sealed by welding. | 12-24-2009 |
20110033197 | FIXING DEVICE AND IMAGE FORMING DEVICE - A fixing device including a heating roller; a pressure roller forming a nip section by making contact with the heating roller; a controller for controlling the surface temperature of the heating roller so that it becomes a predetermined set temperature; an amount of decrease detector for detecting an amount of decrease in the surface temperature of the pressure roller between before and after the passing of the paper sheet through the nip section; a determiner for specifying a required temperature required to perform the fixing for the paper sheet on the basis of the amount of decrease and for determining whether the set temperature is acceptable as the required temperature; and a temperature compensator for correcting the set temperature so that the set temperature is acceptable as the required temperature in the case that the determiner has determined that the set temperature is not acceptable as the required temperature. | 02-10-2011 |
20130243453 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING THE SAME - An image forming apparatus has an outline surrounded by a casing. The casing has an opening. The image forming apparatus includes a fixing unit configured to fix an image formed on a recording medium, and a control unit. The fixing unit includes a heating fixing member. The control unit is configured to control an opening degree of the opening based on temperature of a surface of or in the vicinity of the heating fixing member, so as to prevent emission of a substance by an air current to outside of the casing through the opening, during an image forming operation. | 09-19-2013 |
Osamu Morita, Toyama-Shi JP
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20140074277 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF GENERATING RECIPE - Provided is a method of automatically setting, in a recipe, a process parameter (PP) according to the number of substrates to be processed. The method includes (a) displaying a process parameter of a process recipe on a display unit; (b) displaying a parameter name in a process parameter file on the display unit; (c) generating a first recipe by substituting the process parameter with the parameter name; (d) downloading the first recipe and one of a plurality of condition tables corresponding to the selected number of substrates when the number of substrates to be processed in a processing chamber is selected; and (e) generating a second recipe by substituting the process parameter of the downloaded one of the condition tables for the parameter name in the downloaded first recipe. | 03-13-2014 |
20150368794 | CLEANING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, RECORDING MEDIUM, AND CLEANING COMPLETION DETERMINING METHOD - According to one aspect of the present disclosure, there is provided a cleaning method including: cleaning a component in which a deposit adhering to the component constituting an apparatus is removed by supplying and discharging a cleaning gas, wherein the act of cleaning includes controlling the apparatus so that a signal, which indicates a concentration of a predetermined gas generated by a reaction of the deposit and the cleaning gas, reaches a predetermined upper limit value or less and then stays within a range between the predetermined upper limit value and a predetermined lower limit value for a predetermined time period. | 12-24-2015 |
Osamu Morita, Osaka JP
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20090263648 | METHOD OF FORMING METAL OXIDE FILM, METAL OXIDE FILM AND OPTICAL ELECTRONIC DEVICE - A metal oxide film forming method includes mixing an organic metal compound that is a liquid at room temperature and an organic solvent to form a paste, applying the paste onto a substrate, and oxidizing a metal element in the paste while vaporizing organic substances in the paste by irradiating atmospheric pressure plasma to the paste applied onto the substrate to form a metal oxide film. A metal oxide film composed of three layers is formed on a substrate such as a glass substrate. Such a structure can be obtained by repeating the steps of mixing the organic metal compound that is a liquid at room temperature and the organic solvent to form the paste, applying the paste onto the substrate, and oxidizing the metal element while vaporizing the organic substances in the paste. Also contemplated is an optical electronic device using the metal oxide film. | 10-22-2009 |
20130078457 | METHOD OF FORMING METAL OXIDE FILM, METAL OXIDE FILM AND OPTICAL ELECTRONIC DEVICE - A metal oxide film forming method includes mixing an organic metal compound that is a liquid at room temperature and an organic solvent to form a paste, applying the paste onto a substrate, and oxidizing a metal element in the paste while vaporizing organic substances in the paste by irradiating atmospheric pressure plasma to the paste applied onto the substrate to form a metal oxide film. A metal oxide film composed of three layers is formed on a substrate such as a glass substrate. Such a structure can be obtained by repeating the steps of mixing the organic metal compound that is a liquid at room temperature and the organic solvent to form the paste, applying the paste onto the substrate, and oxidizing the metal element while vaporizing the organic substances in the paste. Also contemplated is an optical electronic device using the metal oxide film. | 03-28-2013 |
Osamu Morita, Fuchu-Shi JP
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20090173444 | SURFACE PROCESSING APPARATUS - The invention is to realize a gas ejection mechanism, which makes it possible to form a uniform gas flow and to control the temperature and its distribution over a gas plate, and thereby to provide a surface processing apparatus which can continuously carry out uniform processing. A surface processing apparatus of this invention comprises: a process chamber in which a substrate holding mechanism and a gas ejection mechanism are arranged to face each other; an exhaust means; and a gas supply means; wherein a gas distribution mechanism, a cooling or the heating mechanism provided with a coolant channel or a heater to cool or heat a gas plate and a number of gas passages, and the gas plate having a number of gas outlets communicated with the gas passages are arranged in that order from the upper stream to construct the gas ejection mechanism, and wherein the gas plate is fixed to the cooling or heating mechanism with a clamping member or with an electrostatic chucking mechanism. A second gas distribution mechanism may be installed between the gas plate and the cooling or heating mechanism so as to form gas outlets under the coolant channel. | 07-09-2009 |
Osamu Morita, Hyogo-Ken JP
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20090065147 | Plasma processing apparatus - This invention is a plasma processing apparatus including: a processing vessel having: a plasma generating space in which a plasma is generated, and a processing space in which a substrate is placed and is subjected to a plasma process; a gas supplying plate arranged in the processing vessel so as to separate the plasma generating space and the processing space in the processing vessel; a process-gas supplying hole provided in the gas supplying plate for supplying a process gas into the processing vessel; a plurality of openings provided in the gas supplying plate for communicating the plasma generating space with the processing space; and a heat transfer member extending from a central region of the gas supplying plate to a peripheral region of the gas supplying plate, the heat transfer member having heat transfer rate higher than that of a material forming the gas supplying plate. | 03-12-2009 |
Osamu Morita, Toyama JP
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20110160900 | SUBSTRATE PROCESSING APPARATUS, METHOD OF DISPLAYING ERROR OF SUBSTRATE PROCESSING APPARATUS AND TRANSFER CONTROL METHOD - A substrate processing apparatus capable of easily checking a state of a transfer mechanism when an error occurs and readily determining a cause of the error is provided. The substrate processing apparatus includes at least one sensor provided in a transfer mechanism for transferring a substrate, a transfer control module for receiving sensing data transmitted by the at least one sensor, a transfer system controller for controlling the transfer control module, and a manipulation unit at least including a display unit for displaying a state of the transfer mechanism based on the sensed data. Therefore, when an error occurs, at least the sensed data transmitted by the at least one sensor is displayed on the display unit. | 06-30-2011 |
20110170989 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a substrate processing apparatus suppressing the vibration of a cover in an initial stage of unloading a boat from a process pipe. The substrate processing apparatus comprises: a boat for placing a substrate; a process pipe receiving the boat; a cover on which the boat is placed, the cover opening and closing a furnace port installed on a lower end of the process pipe; an elevation mechanism moving the cover upward and downward; a motor driving the elevation mechanism; a sealing member sealing a space between the cover and a lower end surface of the process pipe; and a controller controlling torque of the motor such that the substrate is maintained a rest position within the boat in a deformation recovery period of the cover occurring when the sealing member is removed from a surface of the cover or the lower end surface of the process pipe. | 07-14-2011 |
Osamu Morita, Amagasaki JP
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20120160809 | PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A microwave supply unit | 06-28-2012 |
Osamu Morita, Sendai JP
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20120267048 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus includes a processing chamber, a stage, a dielectric member, a microwave introduction device, an injector, and an electric field shield. The processing chamber has a processing space therein. The stage is provided within the processing chamber. The dielectric member has a through hole and is provided to face the stage. The microwave introduction device is configured to introduce microwave into the processing space via the dielectric member. The injector has at least one through hole and is made of a dielectric material, e.g., a bulk dielectric material. The injector is provided within the dielectric member. The injector and the through hole of the dielectric member form a path for supplying a processing gas into the processing space. The electric field shield encloses the injector. | 10-25-2012 |
20130008607 | ANTENNA, DIELECTRIC WINDOW, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - An antenna, a dielectric window, a plasma processing apparatus and a plasma processing method are capable of improving uniformity of a substrate surface processing amount in the surface of the substrate. The antenna includes the dielectric window | 01-10-2013 |
Osamu Morita, Miyagi JP
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20140262034 | PLASMA PROCESSING APPARATUS - This microwave plasma processing apparatus has, as a gas introduction mechanism for introducing a working gas inside a chamber ( | 09-18-2014 |
Osamu Morita, Kurokawa-Gun JP
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20160093474 | SUBSTRATE PROCESSING METHOD - A substrate processing method for performing a plasma process on a processing target substrate by a plasma processing apparatus is provided. The plasma processing apparatus comprises: a processing chamber; a gas supply unit; a mounting table; a microwave generator; a dielectric plate; a slot antenna plate; a wavelength shortening plate; and a microwave supply unit, and the microwave supply unit comprises a coaxial waveguide and a distance varying device. The substrate processing method comprises: mounting the processing target substrate on the mounting table; generating microwave by the microwave generator; and varying, by the distance varying device, a distance in a radial direction between a part of an outer surface of an inner conductor and a facing member facing a part of an outer surface of the inner conductor in order to uniformly generate plasma under a lower surface of the dielectric plate in the processing chamber. | 03-31-2016 |