Patent application number | Description | Published |
20080246163 | Semiconductor Device - A semiconductor device ( | 10-09-2008 |
20080272488 | Semiconductor Device - A semiconductor device according to the present invention includes a semiconductor chip having a functional surface formed with a functional element, an electrode pad provided directly on the functional element on the functional surface of the semiconductor chip, a protective resin layer laminated on the functional surface of the semiconductor chip, an external connection terminal provided on the protective resin layer in opposed relation to the electrode pad, and a post extending through the protective resin layer in a direction in which the electrode pad and the external connection terminal are opposed to each other for connection between the electrode pad and the external connection terminal. | 11-06-2008 |
20090121347 | Semiconductor Device and Semiconductor Device Assembly - Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer. | 05-14-2009 |
20090127705 | Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device - There are provided a semiconductor device capable of accurately determining whether a semiconductor chip is bonded to a solid-state device such as the other semiconductor chip parallelly with each other, a semiconductor chip used for the semiconductor device, and a method of manufacturing the semiconductor chip. The semiconductor chip includes a functional bump projected with a first projection amount from the surface of the semiconductor chip and electrically connecting the semiconductor chip to the solid-state device, and a connection confirmation bump projected with a second projection amount, which is smaller than the first projection amount, from the surface of the semiconductor chip and used for confirming the state of the electrical connection by the functional bump. | 05-21-2009 |
20100187659 | Semiconductor device and method for manufacturing semiconductor device - An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface. | 07-29-2010 |
20120032325 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction. | 02-09-2012 |
20120193766 | SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING DIFFERENT THERMAL EXPANSION COEFFICIENT AND ELASTICITY MODULUS - Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer. | 08-02-2012 |
20130175708 | SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER - A semiconductor device ( | 07-11-2013 |
20130221530 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device with which stress can be prevented from locally concentrating on an external connecting terminal on a post and thus damages of the external connecting terminal can be prevented. The semiconductor device includes a semiconductor chip, a sealing resin layer stacked on a surface of the semiconductor chip, and the post which penetrates the sealing resin layer in a stacking direction of the semiconductor chip and the sealing resin layer, protrudes from the sealing resin layer, and has a periphery of the protruding portion opposedly in contact with a surface of the sealing resin layer in the stacking direction. | 08-29-2013 |
20140070413 | SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING DIFFERENT THERMAL EXPANSION COEFFICIENT AND ELASTICITY MODULUS - Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer. | 03-13-2014 |
20140077373 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface. | 03-20-2014 |
20140246789 | SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER - A semiconductor device ( | 09-04-2014 |
20140291845 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface. | 10-02-2014 |