Patent application number | Description | Published |
20080265386 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 10-30-2008 |
20100009853 | PARASITIC PLANT CONTROL AGENT AND USE THEREOF - Parasitic plants parasitizing on crops can be controlled effectively, by providing an agent for controlling parasitic plants, which comprises tiadinil or the like as the active ingredient and a method for using an agent for controlling parasitic plants, which comprises treating a parasitized plant or soil with an effective amount of agent for controlling parasitic plants. As a result, the yield of crops can be recovered to the level of parasitism-free crops. Additionally, by inhibiting parasitism of parasitic plants strongly, development of the next generation can be inhibited so that the level of pollution with parasitic plants on agricultural land can be lowered with cultivating sensitive crops. | 01-14-2010 |
20100105174 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 04-29-2010 |
20110137746 | CONTENT DISTRIBUTION SYSTEM AND CONTENT DISTRIBUTION METHOD - A content distribution system which assures reliability of content is provided. Permitted-user information corresponding to a user who is permitted to use content to be distributed is associated with the content. In the case where user specific information which specifies a user and the permitted-user information do not have a predetermined relation, a user terminal transmits the user specific information and the permitted-user information to a server. The server generates user-related information in which the received user specific information is set as a distribution destination and the permitted-user information is set as a distributor, generates new permitted-user information so as to have the predetermined relation with the user specific information, and provides the new permitted-user information to the user terminal. The user terminal which obtains the new permitted-user information changes the permitted-user information to the new permitted-user information. | 06-09-2011 |
20120034742 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 02-09-2012 |
20130207252 | Semiconductor Device - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 08-15-2013 |
20130274002 | GAME SYSTEM - One object is to provide a game system that can technically restrain real money trade. In accordance with one aspect, a game system according to an embodiment of the present invention includes: a bid data generating unit configured to generate bid data including game medium information related to a bid game medium and not including player specifying information that specifies a bidder player; and a second display control unit configured to allow a bid screen generated based on bid data to be displayed in the game being played by an exhibitor player. | 10-17-2013 |
20130337906 | GAME SYSTEM - One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device | 12-19-2013 |
20140327121 | Semiconductor Device and Method for Manufacturing Same - The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. | 11-06-2014 |