| Patent application number | Description | Published |
|---|
| 20090315193 | SEMICONDUCTOR CHIP INCLUDING IDENTIFYING MARKS - A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a first layer of the chip and a second mark within the first matrix identifying a position of the exposure field on a wafer. | 12-24-2009 |
| 20100078716 | Semiconductor component and method for producing a semiconductor component - A semiconductor component comprises a semiconductor body with at least one protective trench in the semiconductor body. An insulation layer is situated at least at the bottom of the protective trench. An electrically conductive layer having a thickness D is formed on the insulation layer in the protective trench, wherein the electrically conductive layer only partly fills the protective trench. | 04-01-2010 |
| 20120133084 | Method of processing a substrate - In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench. | 05-31-2012 |
| 20130323905 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT - A semiconductor component comprises a semiconductor body with at least one protective trench in the semiconductor body. An insulation layer is situated at least at the bottom of the protective trench. An electrically conductive layer having a thickness D is formed on the insulation layer in the protective trench, wherein the electrically conductive layer only partly fills the protective trench. | 12-05-2013 |
| 20140216677 | METHOD OF PROCESSING A SUBSTRATE - In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, a stamp device may be disposed at least in the trench; at least one part of the trench that is free from the stamp device may be at least partially filled with trench filling material; and the stamp device may be removed from the trench. | 08-07-2014 |
| 20140220257 | METHOD OF PROCESSING A SUBSTRATE - In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench. | 08-07-2014 |
| Patent application number | Description | Published |
|---|
| 20100275795 | Stamp Insert - The invention describes an insert element ( | 11-04-2010 |
| 20130305940 | Round Stamp - The invention relates to a stamp comprising a printing unit, an actuator unit and a connecting element, wherein the printing unit is connected to the actuator unit by means of connecting element, wherein the printing unit further features a support element and a printing plate the cross section of which is round and the printing plate is stabilized by support element and wherein the printing unit is moveable from a neutral setting into a print setting through axial displacement by means of the actuator unit Printing plate can be moved further by axial displacement into positioning setting wherein printing plate can be rotated in its angular position relative to actuator unit. | 11-21-2013 |
| 20130312627 | Hand Stamp - The invention describes a stamp, a printing unit, a semi-finished product, a stamp cartridge and a process for saturating an ink storage body with stamp ink. The stamp includes a printing unit and an actuator unit. A printing plate arranged in or on the printing unit can be moved from a neutral position into a printing position against a resetting force. The printing unit is arranged with a housing, including an element featuring a pan bottom and at least one contiguous lateral wall stabilizing an ink storage body for receiving stamp ink, with a printing plate abutting against ink storage body for accepting stamp ink, and with at least the pan bottom formed to be liquid-tight. The support element features at least one sealable opening to connect with an actuator unit and/or which serves as a refill opening for stamp ink. | 11-28-2013 |
| Patent application number | Description | Published |
|---|
| 20090207550 | ELECTRICAL FEEDTHROUGH COMPONENT AND METHOD FOR ITS PRODUCTION - An electrical component that is surface mountable includes a base body having first inner electrodes and second inner electrodes. A first outer electrode extends along the base body in a first direction, and a through connection extends along the base body in a second direction that is different from the first direction. The first inner electrodes are electrically connected to the first outer electrode. The second inner electrodes are electrically interconnected via the through connection. | 08-20-2009 |
| 20090212883 | FEEDTHROUGH FILTER AND ELECTRICAL MULTI-LAYER COMPONENT - A feedthrough filter includes a base plate having a first contact surface and a second contact surface. The first contact surface and the second contact surface are galvanically connected. The first contact surface is on an upper side of the base plate and the second contact surface is on an underside of the base plate. The base plate has an opening. An electrical feedthrough passes through the opening, is soldered to the second contact surface, and is not soldered to the first contact surface. A least one electrical component includes an external contact that is soldered to first contact surface. | 08-27-2009 |
| 20140204503 | ELECTRICAL DEVICE - An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip. | 07-24-2014 |
