Okuhira
Hiroyuki Okuhira, Tsukubamirai-Shi JP
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20110311837 | COVERING MEMBER FOR PREVENTING EROSION - There is provided a covering member for preventing erosion that has a high erosion resistance, is resistant to repeated thermal shocks so as to have a long life, and has a particular color allowing visual inspection of the surface layer for degradation. | 12-22-2011 |
Hiroyuki Okuhira, Kariya-Shi JP
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20100245016 | REACTOR FOR ELECTRICAL DEVICES - A reactor includes a tubular coil and a core. The coil generates magnetic flux when a current is supplied thereto. The core is made of magnetic powder-containing resin, and is arranged to cover the coil. An entire surface of the coil is covered with an insulation coating. The insulation coating has corner portions that cover corner portions of the coil. The corner portions of the coil are formed between two opposing end surfaces (axial end surfaces) of the coil and an inner circumference surface of the coil, and between the two axial end surfaces of the coil and an outer circumference surface of the coil, when viewed in a cross section that is perpendicular to the direction the coil is wound. Each corner portion includes a curved surface portion formed with a circularly curved surface portion having a curvature radius of 0.2 mm or more. A minimum thickness of the corner portion is 0.2 mm or more. The elastic modulus of the core is 5 to 25 GPa. | 09-30-2010 |
20160001528 | ELECTRICAL COMPONENT - An electrical component has an electronic part, a primer layer covering at least partially the electronic part, and a sealing resin covering at least partially the electronic part and the primer layer. The primer layer contains a polyimide polymer having the structure represented by the following chemical formula (1), and the sealing resin contains an epoxy-based resin and/or maleimide-based resin. | 01-07-2016 |
Hiroyuki Okuhira, Kariya-City JP
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20100099805 | Polymerization-curable composition, method for polymerization curing thereof, and polymerization-cured resin composition - The present invention provides a polymerization-curable composition comprising at least one kind of a cationically polymerizable compound having in the molecule at least one cationically polymerizable functional group selected from the group consisting of an alicyclic epoxy group, a vinylether group and an oxetane group, and at least one kind of a thermally latent polymerization initiator, characterized in that the polymerization-curable composition is allowed to undergo an exothermic polymerization reaction by applying primary thermal energy to a portion of the polymerization-curable composition, and then the entire polymerization-curable composition is polymerization-cured by secondary thermal energy generated as a result of the exothermic polymerization reaction; a method for polymerization-curing thereof; and a polymerization-cured resin composition. | 04-22-2010 |
20140150973 | EPOXY RESIN COMPOSITION AND MANUFACTURING METHOD OF BONDING STRUCTURE - An epoxy resin composition includes: epoxy resin as a main component; and diamine having phenylene oxide skeleton indicated by an equation of: | 06-05-2014 |
20140262414 | RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTRONIC DEVICE - A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition. | 09-18-2014 |
20140264959 | HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVICE USING THE SEALING MATERIAL - A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. | 09-18-2014 |
20150158221 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method. | 06-11-2015 |
Hiroyuki Okuhira, Kanagawa JP
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20090143525 | MODIFIED CONJUGATED DIENE-BASED POLYMER RUBBER AND RUBBER COMPOSITION CONTAINING THE SAME - A modified conjugated diene-based polymer rubber obtained by reacting, a siloxane compound having at least one ketimine group or aldimine group and at least two alkoxysilyl groups in a molecule to polymerization active ends of a polymer or copolymer obtained by solution polymerization of a conjugated diene monomer or a conjugated diene monomer and an aromatic vinyl compound monomer in the presence of an organic active metal catalyst and a rubber composition containing the modified conjugated diene-based polymer rubber and having an improved processability, heat buildup and abrasion resistance. | 06-04-2009 |
20100062211 | EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL - The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a | 03-11-2010 |
Masatoshi Okuhira, Tokyo JP
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20150358547 | IMAGE PROCESSING APPARATUS - An image processing apparatus includes an imaging unit which outputs an imaging result as a time-series image and an image correction unit, to which the time-series image outputted from the imaging unit is inputted as an input image, for correcting image fluctuation in the input image. The image correction unit includes a temporally-smoothed image generation section which generates a temporally-smoothed image by smoothing time-series input images, a similarity determination section which sets a local area for the temporally-smoothed image and determines similarities between the local area and partial areas of the time-series input images; and a corrected image generation section which selects a partial area having the highest similarity to the local area, and generates a corrected image based on the selected partial area. | 12-10-2015 |
Tomohiro Okuhira, Aichi-Ken JP
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20110068614 | PRETENSIONER - In the present pretensioner, press contact portions are formed further to a side of an open end of a packing housing section than central portions of opposing faces along a depth direction of the packing housing section. Accordingly, when a packing is being fitted into the packing housing section, no great resistance is imparted to a curved face side of the packing from a press contact wall of a housing section body and the opposing face, and the packing is fitted comparatively smoothly therein. Consequently, even when fitting the packing into the packing housing section, a packing main body is largely resilient-deformed, such that a large collapse in a through hole can be prevented, and the sealing ability of the seal due to deformation of the packing main body can be effectively enhanced. | 03-24-2011 |
Yusuke Okuhira, Yokkaichi-City JP
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20100236825 | Assemble structure of connection device and electric device, connection device and electric device used for the same - An assemble structure includes: a connection device including a support element on one side of an attachment surface, a first connector on the attachment surface, and a key groove on a support surface of the support element; and the electric device including a casing to be attached to the attachment surface, a second connector on one surface of the casing electrically coupled with the first connector, and a key protruding from the one side of the casing. The electric device is rotatable via a hinge provided by the support element and the casing when one side of the casing faces a support surface of the support element. The key groove on the support surface corresponds to the key on the one side of the casing. | 09-23-2010 |
Yusuke Okuhira, Yokkaichi JP
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20160006142 | TERMINAL CONNECTION STRUCTURE - A terminal connection structure is proposed in which a bolt tightening terminal is set on a terminal mounting portion and is fastened with a connecting bolt that is tightened to a nut of the terminal mounting portion. The terminal mounting portion is provided with a displacement limiting portion. If the bolt tightening terminal, set on a terminal mounting portion, is disposed in a proper mounting position in which a bolt insertion hole and a threaded hole are aligned on the same center axis, the bolt tightening terminal is adapted not to interfere with the displacement limiting portion. If the bolt tightening terminal is displaced from the proper mounting position, the bolt tightening terminal is adapted to interfere with the displacement limiting portion to limit the displacement from the proper mounting position. | 01-07-2016 |