Patent application number | Description | Published |
20090152656 | SENSOR DEVICE AND PRODUCTION METHOD THEREFOR - A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion. | 06-18-2009 |
20090159997 | WAFER LEVEL PACKAGE STRUCTURE AND PRODUCTION METHOD THEREFOR - A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion. | 06-25-2009 |
20090236678 | SENSOR DEVICE AND PRODUCTION METHOD THEREFOR - A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature. | 09-24-2009 |
20090267165 | WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE SAME PACKAGE STRUCTURE - A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface. | 10-29-2009 |
Patent application number | Description | Published |
20100053034 | FACE PANEL FOR COLOR IMAGE DISPLAY APPARATUS, PANEL FOR COLOR IMAGE DISPLAY APPARATUS, AND COLOR IMAGE DISPLAY APPARATUS - There is provided a face panel for a color image display apparatus according to the present invention, comprising a transparent substrate, a plurality of phosphor layers disposed on the transparent substrate for emitting different color lights, and a plurality of transmittance adjustment layers interposed between the transparent substrate and the plurality of phosphor layers in correspondence to the plurality of phosphor layers, respectively, for adjusting the transmittances of the lights emitted from the plurality of phosphor layers, wherein,
| 03-04-2010 |
20120139818 | FACE PANEL FOR COLOR IMAGE DISPLAY APPARATUS, PANEL FOR COLOR IMAGE DISPLAY APPARATUS, AND COLOR IMAGE DISPLAY APPARATUS - A display panel includes a face plate having a transparent substrate, a plurality of phosphor layers disposed on the transparent substrate for emitting different color lights, and a plurality of transmittance adjustment layers interposed between the transparent substrate and the plurality of phosphor layers. Each transmittance adjustment layer corresponds to each phosphor layer for adjusting the transmittances of the lights emitted from the plurality of phosphor layers, and the transmittance adjustment layers have a filtering function with an approximately constant transmittance in the visible light wavelength region. In addition, a rear plate has a plurality of display elements each corresponding to each phosphor layer, wherein the face plate and the rear plate are disposed so that the phosphor layers formed on the face plate are opposite to the display elements formed on the rear plate. | 06-07-2012 |