Okayama, Osaka

Hiroaki Okayama, Osaka JP

Patent application number	Description	Published
20090120566	FORMING MEMBER FOR ANTIREFLECTION STRUCTURE, TRANSFER MATERIAL EMPLOYED IN THE SAME, OPTICAL APPARATUS EMPLOYING ANTIREFLECTION STRUCTURE, AND MANUFACTURING METHOD FOR THE SAME - A forming member for antireflection structure according to the present invention comprises a transfer material and a to-be-transferred material, wherein: the transfer material can be peeled off from the to-be-transferred material; the transfer material is constructed such that a structure having a reversal shape of an antireflection structure in which structural units are arranged in a shape of an array at a period smaller than a minimum wavelength of light whose reflection should be prevented and which has an aspect ratio of unity or greater is formed on a principal surface of a base substrate part having flexibility; the to-be-transferred material is a structure formed from a resin and having the same shape as the antireflection structure; and the transfer material and the to-be-transferred material are arranged such that the structure having the same shape as the antireflection structure fills up the structure having a reversal shape of the antireflection structure. Thus, even in the inside of an assembled optical apparatus, an antireflection structure can easily be formed at a predetermined position. Further, the optical characteristics of the optical apparatus itself is not affected.	05-14-2009
20090141361	Imaging Apparatus and Method for Manufacturing Microlens Array - An imaging device (	06-04-2009
20090257127	IMAGING OPTICAL SYSTEM - An imaging optical system according to the present invention is provided with at least one lens element and comprises: an optical surface through which incident light transmits; and an antireflection structure provided in at least part of a peripheral region located in the periphery of a center region containing the center of an optical surface in one or more optical surfaces, wherein the peripheral region is within an optical effective diameter, and wherein the antireflection structure is a structure in which structural units having a predetermined shape are arranged periodically in the form of an array at a period smaller than a minimum wavelength of light whose reflection should be prevented in the incident light.	10-15-2009

Motoyuki Okayama, Osaka JP

Patent application number	Description	Published
20080252534	Antenna Device and Mobile Radio Apparatus Using the Same - An antenna device and a mobile radio apparatus using the same antenna device are disclosed. The antenna device includes a ground plate of which short side has a length “a”, a first and a second antenna elements, and a switching circuit. The switching circuit selects whether the first and the second antenna elements are used as a balanced type of antenna or the first antenna is used as an unbalanced type of antenna and the second antenna element is left as a passive element. Assume that wavelength λ	10-16-2008
20090058755	ANTENNA DEVICE AND ELECTRONIC DEVICE USING THE SAME - The antenna device has an antenna element, a transistor circuit connected to the antenna element, and an inductance circuit earthed to a shunt between the antenna element and the transistor circuit. The electronic device has the antenna device and a radio circuit connected to the transistor circuit.	03-05-2009
20100066615	ANTENNA DEVICE AND ELECTRONIC APPARATUS USING THE SAME - The present invention improves reception quality in an electronic apparatus including plural antenna devices. For this purpose, first antenna device (	03-18-2010
20100194475	AMPLIFYING CIRCUIT WITH BYPASS CIRCUIT, AND ELECTRONIC DEVICE USING THE SAME - An amplifying circuit with a bypassing function includes an input terminal to which a signal is input from an antenna, an amplifier connected to the input terminal, a first inductor connected between the input port and a ground, and a bypass circuit connected between the input terminal and the output port of the amplifier. The bypass circuit includes a first port connected to the input terminal, a second port connected to the output port of the amplifier, a switch, a capacitor, and a second inductor. The switch is connected in series between the first and second ports. The capacitor is connected in series to the switch between the first and second ports. The second inductor is connected in series to the switch and the capacitor between the first and second ports. The amplifying circuit does not reduce power of a signal drastically even when the signal passes through the bypass circuit, as compared to passing through the amplifier, thus maintaining a profile of a propagation property unchanged and provide preferable transmission quality.	08-05-2010
20140152621	TOUCH-PANEL DEVICE - A touch panel device includes a touch panel including first and second electrodes, an alternating-current (AC) signal source operable to input an AC signal into the first electrode, an inductive element electrically connected in series between the AC signal source and the first electrode, and a detection circuit operable to detect a change of a capacitance between the first electrode and the second electrode upon a touch of an object on the touch panel, based on a change of a signal output from the second electrode. This touch panel device can enhance detection sensitivity with a simple configuration.	06-05-2014

Yoshio Okayama, Osaka JP

Patent application number	Description	Published
20100025842	SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE - A semiconductor module includes an insulating resin layer, a wiring layer provided on one main surface S	02-04-2010
20100078813	SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE - A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating layer, and a bump electrode which is electrically connected to the wiring layer and protruded from the wiring layer in an insulating layer side. The semiconductor device has device electrodes disposed counter to the semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode has a rugged shape, resulting in the improved adhesion between the metallic layer and the insulating resin layer.	04-01-2010
20100248429	METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES - In a method for making a semiconductor module, a bump electrode and a recess are formed by etching a copper sheet. An insulating resin layer is formed, in the recess, up to a position lower than the height of the bump electrode, and then a semiconductor device and the copper sheet, including a wiring layer formed integrally with the bump electrode, are press-bonded together. The wiring layer is warped to protrude toward the semiconductor device, which assures the electrical connection between the bump electrodes and device electrodes.	09-30-2010
20100276800	SEMICONDUCTOR MODULE - A first circuit element and a second element are mounted with their electrode forming surfaces facing a wiring layer. A first bump electrode formed integrally with the wiring layer on one face substantially penetrates a first insulating resin layer. A gold plating layer covering an element electrode of the first circuit element and a gold plating layer disposed on top of the first bump electrode are bonded together by Au—Au bonding. A second bump electrode formed integrally with the wiring layer on one face substantially penetrates the first and the second insulating resin layer. A gold plating layer covering an element electrode of the second circuit element and a gold plating layer disposed on top of the second bump electrode are bonded together by Au—Au bonding.	11-04-2010