Patent application number | Description | Published |
20140373023 | EXCLUSIVE CONTROL REQUEST ALLOCATION METHOD AND SYSTEM - A management server specifies processes that make exclusive control requests of files in a predetermined time slot, based on an execution schedule of a plurality of processes. Then, the management server specifies files that are the subjects of exclusive control in the predetermined time slot, based on utilization file information indicating files that are used by the respective processes. Then, the management server determines a plurality of file management servers as destinations of exclusive control requests of the respective specified files such that the number of exclusive control requests to be transmitted in the predetermined time slot to each of the file management servers, which is configured to perform exclusive control of a file, is not greater than a predetermined number of exclusive control requests. | 12-18-2014 |
20150081874 | OPERATION PROCESS CREATION PROGRAM, OPERATION PROCESS CREATION METHOD, AND INFORMATION PROCESSING DEVICE - A non-transitory computer-readable recording medium stores an operation process creation program that causes a computer to execute a process, the process including extracting a candidate operation manipulation component to be combined with an operation process following an operation manipulation component that has been determined to be arranged, when creating the operation process by arranging a plurality of the operation manipulation components on a screen, the candidate being extracted based on previously set relevance information indicating relevance between operation manipulation components and usage frequency information indicating usage frequencies of operation manipulation components in past instances of creating the operation processes; and displaying the extracted candidate operation manipulation component on the screen, by combining the extracted candidate operation manipulation component with the operation manipulation component that has been determined to be arranged. | 03-19-2015 |
20150186451 | CONTROLLER, AND ACCESS CONTROL METHOD - A controller accumulates, for each of a plurality of applications executed by batch processing, exclusive information of an area corresponding to an access position and a size of an access area when the application accesses a storage area of a processing target file. The controller executes exclusive control for an area that is specified by the exclusive information of the area in the storage area when any of the applications accesses the storage area on the basis of the exclusive information of the area accumulated by the accumulation processing. | 07-02-2015 |
Patent application number | Description | Published |
20110300778 | ABRADING AGENT AND ABRADING METHOD - A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1 kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3. | 12-08-2011 |
20120024818 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME - A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied.
| 02-02-2012 |
20120100718 | CMP Fluid and Method for Polishing Palladium - The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. | 04-26-2012 |