Patent application number | Description | Published |
20080239333 | PRINTING SYSTEM - A printing system is provided that allows coordinates of pen strokes written or drawn with a digital pen to be correctly related to coordinates of application data even when the application data is printed in reduced size. The printing system includes an application data generating unit generating an application data, an area table storing a boundary coordinate and an application data reduction rate of one of a plurality of areas of a position identification pattern, an application data reduction rate selection unit allowing selection of the application data reduction rate, an application data reduction unit reducing the application data by the application data reduction rate selected by the application data reduction selection unit, a print data generating unit generating a print data by combining the reduced application data and one of the plurality of areas of the position identification pattern having in the area table the application data reduction rate selected by the application data reduction rate selection unit; a print unit printing the print data on a recording medium; a digital pen reading the position identification pattern printed on the recording medium to recognize a first coordinate of the digital pen relative to the position identification pattern and transmitting the first coordinate to a coordinate recognition unit, and the coordinate recognition unit receiving the first coordinate from the digital pen and looking up the first coordinate in the area table to find the corresponding application data reduction rate, the coordinate recognition unit thereafter converting the first coordinate into a second coordinate relative to the application data in the original size based on the application data reduction rate. | 10-02-2008 |
20100134830 | PRINTING APPARATUS AND PRINT DATA PROCESSING SYSTEM - A printing apparatus includes a print drawing data storage storing first print drawing data from a print data generation apparatus, an administration information unit storing administration information of the first print drawing data, and an image processing unit. The print data generation apparatus includes a pattern data register registering pattern data corresponding to first image information, a pattern data converter, a first image converter converting the pattern data into the first print drawing data, a second image converter converting second image information into second print drawing data, and an image composition unit combining the first and second print drawing data. The image processing unit determines whether administration information of first print drawing data newly received and already stored in the administration information unit are the same. If so, the image processing unit combines the first print drawing data already stored and the second print drawing data. | 06-03-2010 |
20110131436 | IMAGE FORMING DEVICE AND METHOD THEREFOR - An image forming device that forms an image on a print medium includes a power saving mode shifting part that shifts a mode of the image forming device to a power saving mode, in which power consumption is decreased, when a set power saving mode shifting time has elapsed during a standby mode, an idle time watching part that measures an idle time in the standby mode from a time of a completion of a previous printing to a time of starting a subsequent printing, a counting part that counts a number of times that the idle time has been equal to or longer than a preset idle reference time, wherein the number of times is a count value, and a shifting time setting part that sets the power saving mode shifting time in response to the count value. | 06-02-2011 |
Patent application number | Description | Published |
20130045650 | RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET - There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I): | 02-21-2013 |
20130136930 | RESIN COMPOSITION, PREPREG, AND LAMINATE - There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): | 05-30-2013 |
Patent application number | Description | Published |
20140017502 | RESIN COMPOSITION, PREPREG AND LAMINATE - It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components. | 01-16-2014 |
20140308489 | MOLYBDENUM COMPOUND POWDER, PREPREG, AND LAMINATE - The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler. | 10-16-2014 |
Patent application number | Description | Published |
20090230172 | METHOD OF BONDING - The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste | 09-17-2009 |
20120212106 | METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE - The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body. | 08-23-2012 |
20120248943 | Oscillator Electrode Material Having Excellent Aging Characteristics, Piezoelectric Oscillator Using The Material And Sputtering Target Comprising The Material - An electrode material capable of making more satisfactory the dispersion at the time of production and the aging property of a resonator than Au and capable of reducing the price as compared to Au. An resonator electrode material including a ternary alloy composed of Au and two metals M | 10-04-2012 |
20130168437 | NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT - A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass % or more and an average particle diameter of 0.1 to 0.5 μm, the organic solvent has a boiling point of 200 to 350° C., and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23° C. by means of a rotational viscometer is 6.0 or more. | 07-04-2013 |
Patent application number | Description | Published |
20090309459 | METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC ELEMENT, AND PIEZOELECTRIC DEVICE - The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 μm to 1.0 μm and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body. | 12-17-2009 |
20110272802 | BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP THEREON - A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a sintered body of a powder of a second conductive metal, which is any of gold and silver, formed on the first bump layer. The bulk body composing the first bump layer is formed through any of plating, sputtering, or CVD. The sintered body composing the second bump layer is formed by sintering the powder of the second conductive metal having a purity of not lower than 99.9 wt % and an average particle diameter of 0.005 μm to 1.0 μm. The second bump layer has a Young's modulus 0.1 to 0.4 times that of the first bump layer. | 11-10-2011 |
20130196504 | TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING METAL WIRING USING SAID TRANSFER SUBSTRATE - The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 μm to 1.0 μm and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300° C. | 08-01-2013 |
20140262003 | TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FORMING METAL WIRING LINE BY MEANS OF SAID TRANSFER SUBSTRATE - A transfer substrate for transferring a metal wiring material to a transfer target including a substrate, at least one metal wiring material formed on the substrate, at least one coating layer formed on a surface of the metal wiring material, and an underlying metal film formed between the substrate and the metal wiring material, in which the metal wiring material is a compact formed by sintering metal powder such as gold powder having a purity of 99.9 wt % or more and an average particle size of 0.01 μm to 1.0 μm, and the coating layer is a predetermined metal such as gold or an alloy having a different composition from that of the metal wiring material and has a total thickness of 1 μm or less, and the metal underlying film is made of a predetermined metal such as gold or an alloy. The transfer substrate can lower heating temperature on the transfer target side. | 09-18-2014 |
20140295619 | BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP THEREON - A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a sintered body of a powder of a second conductive metal, which is any of gold and silver, formed on the first bump layer. The bulk body composing the first bump layer is formed through any of plating, sputtering, or CVD. The sintered body composing the second bump layer is formed by sintering the powder of the second conductive metal having a purity of not lower than 99.9 wt % and an average particle diameter of 0.005 μm to 1.0 μm. The second bump layer has a Young's modulus 0.1 to 0.4 times that of the first bump layer. | 10-02-2014 |
20150014399 | CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE CONDUCTIVE PASTE - The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 μm to 1.0 μm; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate. | 01-15-2015 |