Patent application number | Description | Published |
20100187672 | ELECTRONIC APPARATUS AND CIRCUIT BOARD - According to an aspect of the present invention, there is provided an electronic apparatus including: a housing; a circuit board that is housed in the housing; a semiconductor package that includes a first surface on which solder balls are provided and a second surface opposite to the first surface and that is mounted on the circuit board so as to be electrically connected to the circuit board through the solder balls; a protective film that has a water repellency and that is applied on the circuit board so as to expose around the semiconductor package mounted on the circuit board; and a joint member that joins at least a part of a side surface of the semiconductor package and the circuit board. | 07-29-2010 |
20100290200 | ELECTRONIC DEVICE - According to one embodiment, an electronic device is provided with a conductive member, a printed wiring board including an insulating base member, and a metal foil member provided on one surface of the base member, a fixing member which fixes the printed wiring board to the conductive member, and a conductive adhesive member which covers a surface of the metal foil member and electrically connects the metal foil member to the fixing member. | 11-18-2010 |
20110235288 | ELECTRONIC APPARATUS AND HARD DISK DRIVE - According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other. | 09-29-2011 |
20110242781 | Module and Electronic Device - According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors. | 10-06-2011 |
20120085575 | Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus - According to one embodiment, a manufacturing method for an electronic apparatus, which includes a housing, a substrate, pads on the substrate, and an electronic component, which includes a component body including a bottom surface, terminals arranged on the bottom surface of the component body, and a thermosetting resin disposed on the bottom surface of the component body and configured to remove an oxide film when heated, and is mounted on the substrate, the method includes putting the electronic component on the substrate, heating the electronic component, thereby softening the resin, causing the softened resin to flow, thereby forcing out a gas between the electronic component and the substrate and filling the resin between the electronic component and the substrate, and further heating the electronic component, thereby solder-bonding the terminals and the pads to one another and curing the resin between the electronic component and the substrate. | 04-12-2012 |
20120120591 | ELECTRONIC APPARATUS AND HARD DISK DRIVE - According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other. | 05-17-2012 |
20120249893 | TELEVISION APPARATUS AND ELECTRONIC APPARATUS - According to one exemplary embodiment, a television apparatus includes: a housing; a circuit board housed in the housing; and an electronic component including a first face placed to a side of the circuit board and a second face placed opposite to the first face, and incorporating a silicon member. The electronic component comprises: an electrode provided at the first face and configured to be electrically connected to the circuit board; and a protrusion provided at the first face, placed between the silicon member and the circuit board, and separated from a surface of the circuit board. | 10-04-2012 |