Patent application number | Description | Published |
20090296412 | LIGHTING SYSTEM - A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing. | 12-03-2009 |
20110089805 | LIGHT-EMITTING APPARATUS AND LUMINAIRE - According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component. | 04-21-2011 |
20110101384 | LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected. | 05-05-2011 |
20110199766 | LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting device comprises a substrate on which a plurality of light-emitting elements are arranged and mounted in two lines; and sealing members of two lines each sealing the plurality of light-emitting elements of each line. A distance between the lines of the sealing members is equal to 0.5 times or more but 2 times or less a width of the sealing member of each line. | 08-18-2011 |
20110199772 | LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member. | 08-18-2011 |
20110222264 | LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS - According to one embodiment, a light emitting device which is attached to an illumination apparatus and radiates light having a correlated color temperature of 2900 to 3600K is provided. The light emitting device includes a substrate, blue light emitting LED elements and red light emitting LED elements mounted on the substrate, and a wavelength converting unit. The red light emitting LED elements have a luminous intensity of 0.2 to 2.5 times as large as that of the blue light emitting LED elements at normal use temperature in a state where the light emitting device is attached to the illumination apparatus. The wavelength converting unit is excited by light emitted from the blue light emitting LED elements and converts the light to light having a peak wavelength within a range of 500 to 600 nm. | 09-15-2011 |
20110254023 | LUMINAIRE AND LIGHT-EMITTING APPARATUS WITH LIGHT-EMITTING DEVICE - According to one embodiment, the light-emitting apparatus is provided with a substrate, a plurality of light-emitting devices, and a phosphor layer. The plurality of light-emitting devices are mounted on the substrate. The phosphor layer is formed of a translucent resin containing a phosphor and includes a phosphor portion that is formed in a convex shape and covers a predetermined number of the light-emitting device. Bases of the adjacent phosphor portions are formed by being linked with one another. | 10-20-2011 |
20110309379 | LIGHT-EMITTING DEVICE AND LUMINARE - According to one embodiment, a light-emitting device includes a substrate, a plurality of light-emitting elements and a sealing resin. The substrate is formed in a substantially rectangular shape. The plurality of light-emitting elements forms a plurality of rows by being arranged in a direction perpendicular to a longer dimension of the substrate. The rows are arranged in a longer direction of the substrate with a gap provided therebetween. The gap is set between the rows such that illumination intensity is evenly produced. The sealing resin coves each of the rows of the light-emitting elements. | 12-22-2011 |
20110309381 | LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS - According to one embodiment, a light-emitting device includes a series circuit, a substrate, and a sealing member. The series circuit includes a plurality of parallel circuits each including a plurality of light-emitting elements connected in parallel. The plurality of parallel circuits are connected in series. A plurality of groups are provided on the substrate. Each of the groups includes at least one of the light-emitting elements in the parallel circuit. The light-emitting elements are arranged in a divided manner according to each of the groups. The sealing member covers at least one of the light-emitting elements. | 12-22-2011 |
20120075836 | LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS - A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm | 03-29-2012 |
20120300430 | LIGHT-EMITTING MODULE AND LIGHTING APPARATUS - According to one embodiment, a light-emitting module includes a light-transmissive substrate, an LED chip arranged on one surface of the light-transmissive substrate, and a phosphor layer surrounding the LED chip. The phosphor layer includes a first phosphor layer covering one surface of the LED chip and a second phosphor layer covering the other surface side of the light-transmissive substrate and being continuous with the first phosphor layer. | 11-29-2012 |
20130114253 | Bulb-Type Lamp and Luminaire - A bulb-type lamp includes a base body, a heat pipe, a light-emitting body, a cap and a lighting circuit. One end side of the heat pipe protrudes from one end side of the base body, and the other end side of the heat pipe is connected to the one end side of the base body. The light-emitting body includes plural LED elements, is connected to the one end side of the heat pipe, and is attached to the heat pipe to enable heat conduction. The cap is provided at the other end side of the base body. The lighting circuit is housed in the base body. | 05-09-2013 |
20130250562 | WIRING BOARD DEVICE, LUMINAIRE, AND MANUFACTURING METHOD OF THE WIRING BOARD DEVICE - According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring. | 09-26-2013 |
20130250576 | WIRING BOARD DEVICE, LUMINAIRE AND MANUFACTURING METHOD OF THE WIRING BOARD DEVICE - According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer. | 09-26-2013 |
20140153238 | Light Emitting Device and Luminaire - According to one embodiment, there is provided a light-emitting device including a light-emitting section, a thermal radiation member, and a heat conduction layer. The light-emitting section includes a mounting substrate section and a light-emitting element section. The mounting substrate section includes a substrate, a first metal layer, and a second metal layer. The substrate includes a first principal plane including a mounting region and a second principal plane. The first metal layer includes mounting patterns provided in the mounting region. The light-emitting element section includes semiconductor light-emitting elements and a wavelength conversion layer. The semiconductor light-emitting elements are connected to the mounting patterns. The luminous exitance of the light-emitting element section is equal to or higher than 101 m/mm | 06-05-2014 |
20150060930 | Light Emitting Device - According to an embodiment, a light emitting device includes a heat radiation plate, a semiconductor light emitting element, a mounting substrate section including a ceramic substrate, and first and second metal layers, and a bonding layer. The ceramic substrate is provided between the heat radiation plate and the semiconductor light emitting element. The mounting substrate section contacts the ceramic substrate between the heat radiation plate and the ceramic substrate, and includes a first surface on a side of the heat radiation plate and a side surface intersecting a plane perpendicular to a direction from the heat radiation plate to the semiconductor light emitting element. The bonding layer is provided between the heat radiation plate and the second metal layer, and bonds the heat radiation plate and the second metal layer so as to cover the first surface and to contact a part of the side surface. | 03-05-2015 |