Patent application number | Description | Published |
20090197068 | POLYIMIDE FILM, AND METHOD FOR PRODUCTION THEREOF - Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine. | 08-06-2009 |
20090212253 | POLYMER ELECTROLYTE COMPOSITION - An inexpensive and durable polymer electrolyte composition exhibiting high ionic conductivity even in the absence of water or a solvent, characterized by comprising a molten salt and an aromatic polymer having a carbonyl bond and/or a sulfonyl bond in the main chain thereof and containing a cation exchange group. The aromatic polymer is preferably an aromatic polyether sulfone having a specific structural unit and containing a cation exchange group, an aromatic polyether ketone having a specific structural unit and containing a cation exchange group, or an aromatic polyether sulfone block copolymer and/or an aromatic polyether ketone block copolymer, the block copolymers comprising a hydrophilic segment containing a cation exchange group and a cation exchange group-free hydrophobic segment. The polymer electrolyte composition containing the block copolymer as an aromatic polymer exhibits high structural retention even in high temperatures. | 08-27-2009 |
20100041860 | POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME - A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): | 02-18-2010 |
20120156482 | POLYMIDE FILM AND PROCESS FOR PRODUCING POLYIMIDE FILM - A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film. | 06-21-2012 |
20120244352 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A polyimide film having improved adhesiveness is produced by
| 09-27-2012 |
20120308816 | POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/METAL LAMINATE COMPRISING SAME - Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): | 12-06-2012 |
20130178597 | POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME - Disclosed is a novel co-polyimide precursor for producing a polyimide having high transparency. The co-polyimide precursor comprises a unit structure represented by general Formula (A1) and a unit structure represented by general Formula (A2): | 07-11-2013 |
20140255710 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, AND METHOD FOR MANUFACTURING TRIAZINE COMPOUND USED FOR MANUFACTURING SAME - Disclosed are a polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing triazine compound used for manufacturing these. The polyimide precursor contains a structural unit represented by general formula (I): | 09-11-2014 |
20140290853 | METHOD FOR MANUFACTURING POLYIMIDE METAL LAMINATE - A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); | 10-02-2014 |