Patent application number | Description | Published |
20090029505 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS - A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode. | 01-29-2009 |
20090050353 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal. | 02-26-2009 |
20090102323 | ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode. | 04-23-2009 |
20090114441 | ELECTRONIC COMPONENT - An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In the electronic component, the sealing member includes a core part formed on the first substrate and having elasticity and a metal film formed on a surface of the core part, and the metal film is bonded to the second substrate. | 05-07-2009 |
20090115054 | ELECTRONIC COMPONENT - An electronic component includes: an active surface; a plurality of external connection terminals included in the active surface; a bump electrode disposed to the active surface, the bump electrode including: an internal resin formed on the active surface as a core; and a conductive film on a surface of the internal resin, the internal resin being formed in a nearly half-cylindrical shape having a transverse section of one of a nearly semicircular shape, a nearly semielliptical shape, and a nearly trapezoidal shape and extending orthogonal to the transverse section, the transverse section being orthogonal to the active surface; and a global wiring line disposed on the active surface and connecting between the plurality of external connection terminals, and at least one of the external connection terminals being electrically connected to the conductive film. | 05-07-2009 |
20090115055 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes: a substrate having a terminal and the electronic component which is mounted on the substrate; and a bump electrode included in the electronic component. This bump electrode has an underlying resin provided on an active surface of the electronic component, and a conductive film covering part of a surface of the underlying resin and exposing the rest so as to be electrically continued to an electrode terminal. In this mounting structure, the conductive film of the bump electrode makes direct conductive contact with the terminal, and the underlying resin of the bump electrode elastically deforms so that at least part of an exposed area which is exposed without being covered by the conductive film directly adheres to the substrate. Further, the substrate and the electronic component retain a state of the bump electrode making conductive contact with the terminal by adhesivity of the exposed area of the underlying resin to the substrate. | 05-07-2009 |
20100071946 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state. | 03-25-2010 |
20100109484 | ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode. | 05-06-2010 |
20100134993 | ELECTRONIC COMPONENT, CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug. | 06-03-2010 |
20100155944 | SEMICONDUCTOR DEVICE - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate and including a plurality of first portions and a second portion disposed between two of the first portions adjacent to each other; and an interconnect electrically connected to the electrode and extending over one of the first portions of the resin protrusion. A lower portion of a side surface of the second portion includes a portion which extends in a direction intersecting a direction in which the resin protrusion extends. | 06-24-2010 |
20100155945 | SEMICONDUCTOR DEVICE - A semiconductor device including: a semiconductor chip; a plurality of electrodes formed on the semiconductor chip and arranged along one side of the semiconductor chip; a resin protrusion formed on the semiconductor chip and extending in a direction which intersects the side; and a plurality of electrical connection sections formed on the resin protrusion and electrically connected to the respective electrodes. | 06-24-2010 |
20100219927 | ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face. | 09-02-2010 |
20100223784 | ELECTRONIC SUBSTRATE, MANUFACTURING METHOD FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE - An electronic substrate includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. | 09-09-2010 |
20100226109 | ELECTRONIC SUBSTRATE, MANUFACTURING METHOD FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE - An electronic substrate includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. | 09-09-2010 |
20100237749 | ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode. | 09-23-2010 |
20100252925 | SEMICONDUCTOR DEVICE - A semiconductor device including: a semiconductor chip having a rectangular surface on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the surface of the semiconductor chip; and a plurality of interconnects each of which is electrically connected to one of the electrodes and includes an electrical connection section disposed on one of the resin protrusions. At least part of the resin protrusions are disposed in a region near a short side of the surface and extend in a direction which intersects the short side. | 10-07-2010 |
20100254113 | ELECTRONIC BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE - An electronic board includes a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; a rearrangement wiring for the connection terminal disposed at a top side of the stress-relaxation layer; and a capacitor. The capacitor has a first electrode that is disposed between the substrate and the stress-relaxation layer, a second electrode that is disposed at the top side of the stress-relaxation layer, and a dielectric material that is disposed between the first electrode and the second electrode. The first electrode and/or the second electrode has a corrugated surface facing the dielectric material. | 10-07-2010 |
20100258901 | SEMICONDUCTOR DEVICE, INK CARTRIDGE, AND ELECTRONIC DEVICE - A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit. | 10-14-2010 |
20100304533 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive. | 12-02-2010 |
20110062534 | ELECTRONIC COMPONENT - An electronic component includes: a first substrate having a through-hole; a second substrate opposite the first substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; a functional element having at least a part thereof disposed in the sealing space, and a through-electrode filling the through-hole, the through-hole penetrating the first substrate. The sealing member includes an elastic core part on the first substrate. A metal film is on a surface of the core part and is bonded to the second substrate. | 03-17-2011 |
20110062566 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS - A semiconductor device comprising: a substrate; a terminal on the substrate's first surface; a first electrode on the first surface connected to the terminal; an electronic element on the substrate's second surface; a second electrode connected to the electronic element; a groove on the second surface leading to the second electrode; a conductive portion inside the grove connected to the second electrode's rear face; a first wiring on the first surface connected to the first electrode; a second wiring connecting the first wiring and the terminal; a stress-absorbing layer between the substrate and terminal; a land connecting the first wiring and the second wiring, the land opening a part of the stress-absorbing layer and exposing the first wiring, the land being in a region surrounded by terminals, and the land being along a straight line connecting the centers of diagonal terminals, with the region between the terminals. | 03-17-2011 |
20110074250 | MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT - A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices. | 03-31-2011 |
20110266690 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS - A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode. | 11-03-2011 |
20120086088 | ELECTRONIC COMPONENT - An electronic component includes: a first substrate having a through-hole; a second substrate opposite the first substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; a functional element having at least a part thereof disposed in the sealing space, and a through-electrode filling the through-hole, the through-hole penetrating the first substrate. The sealing member includes an elastic core part on the first substrate. A metal film is on a surface of the core part and is bonded to the second substrate. | 04-12-2012 |
20120091860 | ELECTRONIC COMPONENT, MOUNTING STRUCTURE THEREOF, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode. | 04-19-2012 |
20120103673 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal. | 05-03-2012 |
20120235261 | DEVICE-MOUNTED SUBSTRATE, INFRARED LIGHT SENSOR AND THROUGH ELECTRODE FORMING METHOD - A via hole is formed on a base substrate before a device circuit is formed, and thermal oxidation is performed to form a thermal oxidation layer on a surface of the base substrate on which the device circuit is formed and a surface in the via hole. The device circuit having a conductive section is formed on the base substrate after the thermal oxidation, and then, a conductive body is embedded in the via hole. | 09-20-2012 |
20120236301 | MEASUREMENT APPARATUS AND MEASUREMENT METHOD - A measurement apparatus for measuring the concentration of a target substance contained in a sample includes: a light source (light source device); a light-incident body (sensor chip) that has a sample contact surface, where an enhanced electric field is formed by metal particles, and enhances Raman scattering light radiated from the target substance by light emitted from the light source in the enhanced electric field; an irradiation unit that causes the light emitted from the light source to enter into a plurality of areas in the light-incident body; a light-receiving unit (light-receiving element) that receives the Raman scattering light radiated from a plurality of the areas; and a quantitative measurement unit (control device) that quantitatively measures a concentration of the target substance based on a total number of the areas and a strength of the Raman scattering light received from the areas. | 09-20-2012 |
20120238840 | SUBSTANCE COMPONENT DETECTION DEVICE - A substance component detection device includes a sensor substrate which is provided inside a concave groove, in which when an opening is closed by a measurement-target skin to form a closed space, and includes a projection group having a plurality of projections, a light source section which emits light toward the projection group, and light-receiving section which detects Raman scattering light generated by the projection group. | 09-20-2012 |
20120261786 | SEMICONDUCTOR DEVICE, INK CARTRIDGE, AND ELECTRONIC DEVICE - A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit. | 10-18-2012 |
20120261815 | SEALED SURFACE ACOUSTIC WAVE ELEMENT PACKAGE - An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug. | 10-18-2012 |
20120262718 | DETECTION DEVICE - A detection device includes a flow channel for a fluid sample, a suction section adapted to draw the fluid sample into the flow channel, an optical device disposed in the flow channel, a light source adapted to irradiate the optical device with light, a light detection section adapted to detect light emitted from the optical device, a microbalance sensor chip having a piezoelectric substrate provided with an oscillation electrode, and disposed in the flow channel, and a quantitative analysis section adapted to perform quantitative analysis on the fluid sample based on output from the light detection section and the microbalance sensor chip. The optical device has a metal nanostructure including projections ranging in size from 1 through 1000 nm, and emits light representing the fluid sample adsorbed to the metal nanostructure. | 10-18-2012 |
20130026640 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS - A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode. | 01-31-2013 |
20130181357 | MANUFACTURING METHOD FOR AN ELECTRONIC SUBSTRATE - The manufacturing method for electronic substrate includes: forming an active region on a first face of a substrate; forming a first part of an interconnection pattern as a passive element on a second face of the substrate; forming an insulating layer as a stress-relieving layer on the second face of the substrate; and forming a second part of the interconnection pattern as the passive element on the insulating layer. | 07-18-2013 |
20130250015 | SEMICONDUCTOR DEVICE, INK CARTRIDGE, AND ELECTRONIC DEVICE - A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit. | 09-26-2013 |
20140070915 | ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face. | 03-13-2014 |
20150041992 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS - A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side. | 02-12-2015 |