Patent application number | Description | Published |
20090014501 | ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD - Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint. | 01-15-2009 |
20090064489 | ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD - In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process. | 03-12-2009 |
20090293265 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. | 12-03-2009 |
20100163602 | ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD - To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. | 07-01-2010 |
20100230472 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure. | 09-16-2010 |
Patent application number | Description | Published |
20100053399 | Analog-digital converter, analog-digital conversion method, image pickup device, method of driving the same, and camera - An analog-digital converter includes: comparators disposed to correspond to analog signals which are converted into digital signals and configured to compare a voltage value of the analog signal, which is converted into the digital signal, with a voltage value of a predetermined reference signal; counters disposed to correspond to the comparators and configured to count a count value at the time point when the comparison process of the corresponding comparator is finished; and a determiner configured to determine a time point when all the comparators finish their comparison processes. | 03-04-2010 |
20100265374 | A/D converter, solid-state imaging device and camera system - An A/D converter includes: plural comparators to which reference voltages as ramp waves different from each other are supplied, which are configured to compare the supplied reference voltages with an analog input signal; and plural latches arranged so as to correspond to the plural comparators, which are configured to count comparison time of the corresponding comparators, to stop counting when an outputs of the comparator is inverted and to store the count value, wherein the plural reference voltages are offset by an arbitrary voltage at the same time point. | 10-21-2010 |
20130093934 | A/D CONVERTER, SOLID-STATE IMAGING DEVICE AND CAMERA SYSTEM - An A/D converter includes: plural comparators to which reference voltages as ramp waves different from each other are supplied, which are configured to compare the supplied reference voltages with an analog input signal; and plural latches arranged so as to correspond to the plural comparators, which are configured to count comparison time of the corresponding comparators, to stop counting when an outputs of the comparator is inverted and to store the count value, wherein the plural reference voltages are offset by an arbitrary voltage at the same time point. | 04-18-2013 |
20130193306 | ANALOG-DIGITAL CONVERTER, ANALOG-DIGITAL CONVERSION METHOD, IMAGE PICKUP DEVICE, METHOD OF DRIVING THE SAME, AND CAMERA - An analog-digital converter includes: comparators disposed to correspond to analog signals which are converted into digital signals and configured to compare a voltage value of the analog signal, which is converted into the digital signal, with a voltage value of a predetermined reference signal; counters disposed to correspond to the comparators and configured to count a count value at the time point when the comparison process of the corresponding comparator is finished; and a determiner configured to determine a time point when all the comparators finish their comparison processes. | 08-01-2013 |
20140167998 | A/D CONVERTER, SOLID-STATE IMAGING DEVICE AND CAMERA SYSTEM - An A/D converter includes: plural comparators to which reference voltages as ramp waves different from each other are supplied, which are configured to compare the supplied reference voltages with an analog input signal; and plural latches arranged so as to correspond to the plural comparators, which are configured to count comparison time of the corresponding comparators, to stop counting when an outputs of the comparator is inverted and to store the count value, wherein the plural reference voltages are off set by an arbitrary voltage at the same time point. | 06-19-2014 |
Patent application number | Description | Published |
20090030134 | Inorganic Hollow Particle, Process For Producing The Same, And Composition Containing The Same - The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m | 01-29-2009 |
20090306272 | CERAMIC POWDER AND METHOD OF USING THE SAME - The present invention herein provides ceramic powder which is to be incorporated into rubber or a resin and which can be used as, for instance, a semiconductor-sealing material and for the preparation of a composition excellent in the narrow interstice-filling up property and moldability. The ceramic powder has a multiple peak-frequency type particle size distribution which has at least two peaks, as determined according to the laser diffraction-scattering type particle size distribution analyzer, wherein the maximum particle size observed for the first peak falls within the range of from 12 to 30 μm; that observed for the second peak falls within the range of from 2 to 7 μm; the content of the particles having a particle size of greater than 7 μm and less than 12 μm is not more than 18% (including 0%); and wherein the ratio (F | 12-10-2009 |
20090312477 | CERAMIC POWDER AND APPLICATIONS THEREOF - The present invention provides ceramic powder capable of being incorporated into rubber or a resin for the preparation of a composition, which shows excellent heat resistance and flame retardancy and which is used, for instance, as a semiconductor-sealing material. The ceramic powder has a multi-peak frequency distribution pattern having at least two peaks as a particle size distribution as determined using a laser diffraction-scattering type particle size-analyzer, wherein the maximum particle size for the first peak ranges from 40 to 80 μm and that for the second peak ranges from 3 to 8 μm and wherein the rate of the particles having a particle size of not less than 20 μm and less than 40 μm is not more than 20% by mass (inclusive of 0% by mass). | 12-17-2009 |
20100204383 | SILICA POWDER, PROCESS FOR ITS PRODUCTION, AND COMPOSITION EMPLOYING IT - To provide a silica powder which is excellent in flowability and packing properties and which is less likely to form a flash, a process for its production, and a composition having it incorporated in at least one of a rubber and a resin, particularly a sealing material. | 08-12-2010 |
20100222487 | INORGANIC HOLLOW POWDER, PROCESS FOR PRODUCING THE INORGANIC HOLLOW POWDER, AND COMPOSITION COMPRISING THE INORGANIC HOLLOW POWDER - Inorganic hollow powder is provided having a high purity, an enhanced fineness and a high hollowness. Specifically, inorganic hollow powder is provided having an average particle diameter of 1 to 5 μm, the maximum particle diameter of 20 μm or less, a particle size distribution standard deviation of 3 μm or less, and an average hollowness of 35 to 70 vol %. The inorganic hollow powder is obtained, for instance, by supplying, via an inorganic feed material powder supply pipe at a discharge rate of 80 m/s or more, inorganic raw material powder having a specific surface area of 500 m | 09-02-2010 |
20110021666 | AMORPHOUS SILICA POWDER, PROCESS FOR ITS PRODUCTION, AND SEALING MATERIAL FOR SEMICONDUCTORS - To provide an amorphous silica powder suitable for a sealing material for semiconductors having improved HTSL properties and HTOL properties, and a process for its production. | 01-27-2011 |
20110077329 | AMORPHOUS SILICEOUS POWDER, PROCESS FOR PRODUCTION THEREOF, RESIN COMPOSITION, AND SEMICONDUCTOR ENCAPSULATION MATERIAL - A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20. | 03-31-2011 |
20110300384 | POWDER, METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION CONTAINING SAME - Provided is a semiconductor sealing material in which the contamination rate of conductive foreign matter is extremely low. Further provided are powder comprising spherical silica powder and/or spherical alumina powder suitable for preparing such a semiconductor sealing material, a method for producing the same, and a resin composition. The powder comprises spherical silica powder and/or spherical alumina powder, and when a color reaction test for particles using an aqueous potassium ferricyanide solution under specific conditions is performed for magnetizable particles having a particle size of 45 [mu]m or more, the ratio of the number of particles which develop color to the total number of the magnetizable particles is 20% or less. Such powder can be produced by supplying a specific amount of oxygen gas and/or water vapor to at least one arbitrary site at which the atmospheric temperature is 1600 to 1800 DEG C. in a furnace at an angle of 60 DEG to 90 DEG with respect to the injection direction of a starting material of the powder, and setting the relative velocity of the starting material of the powder and/or the spherical powder to stainless steel and/or iron to 5 m/s or less. | 12-08-2011 |