Patent application number | Description | Published |
20090268392 | NOTEBOOK COMPUTER HAVING HEAT PIPE - A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component. | 10-29-2009 |
20090284912 | NOTEBOOK COMPUTER WITH THERMAL MODULE - A notebook computer (1000) includes a base (100), a cover (300), a computer printed circuit board (PCB) (200) and a centrifugal fan (40). The cover covers the base, and cooperates with the base to form a receiving space (500) therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator (401) and an impeller (402), rotatable with respect to the stator. The stator includes a motor (415) and a fan PCB (405) directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (304,104). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB. | 11-19-2009 |
20100155031 | HEAT PIPE AND METHOD OF MAKING THE SAME - A heat pipe includes a casing, a main wick structure received in the casing and attached to an inner surface of the casing, a multi-layered auxiliary wick structure received in the main wick structure and a working fluid contained in the casing and saturating the main wick structure and the auxiliary wick structure. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel therebetween. The auxiliary wick structure extends along a longitudinal direction of the casing and defines a liquid channel therein. The auxiliary wick structure is formed by a plurality of layers radially stacked on each other, such that each outer layer is attached around an adjacent inner layer. | 06-24-2010 |
20100155032 | HEAT PIPE AND METHOD OF MAKING THE SAME - A heat pipe includes a longitudinal casing, a main wick structure, at least one auxiliary wick structure and a working fluid contained in the casing and saturating the main wick structure and the at least one auxiliary wick structure. The main wick structure is received in the casing and attached to an inner surface of the casing. The at least one auxiliary wick structure is received in the main wick structure. An inner peripheral surface of the main wick structure and an outer peripheral surface of the at least one auxiliary wick structure cooperatively define a vapor channel therebetween. At least one end of the at least one auxiliary wick structure is fixed on a corresponding end of the casing. | 06-24-2010 |
20100212870 | FLAT HEAT PIPE - A flat heat pipe includes a casing and a wick structure received in the casing. The casing has a first lateral portion and a second lateral portion. Each of the first lateral portion and the second lateral portion has a C-shape configuration, and the second lateral portion has an opening facing an opening of the first lateral portion. The wick structure is attached to an inner surface of only one of the first and lateral portions of the casing. The inner surface of the other of the first and second lateral portions without the wick structure attached thereto defines a first vapor channel, and an inner surface of the wick structure defines a second vapor channel. The first vapor channel has a height greater than the second vapor channel. | 08-26-2010 |
20100238628 | PORTABLE ELECTRONIC DEVICE INCORPORATING EXTENDABLE THERMAL MODULE - An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis. | 09-23-2010 |
20100259893 | PORTABLE ELECTRONIC DEVICE INCORPORATING EXTENDABLE HEAT DISSIPATION DEVICE - An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component. | 10-14-2010 |
20110005726 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder. | 01-13-2011 |
20110030923 | THERMAL MODULE - A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan. | 02-10-2011 |
20110277964 | FLAT HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided. | 11-17-2011 |
20120075805 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer. | 03-29-2012 |
20120292007 | HEAT DISSPATION DEVICE AND CONTROL METHOD - A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided. | 11-22-2012 |
20130037244 | FLAT HEAT PIPE - A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure. | 02-14-2013 |
20130105124 | HEAT DISSIPATION FAN | 05-02-2013 |
20130160976 | HEAT PIPE WITH COMPOSITE WICK STRUCTURE - An exemplary heat pipe includes an elongated casing, a first wick structure, a second wick structure, and working medium filled in the casing. The heat pipe has an evaporating section and a condensing section. The first wick structure is located within an inner wall of the casing and defines a window at the evaporating section of the heat pipe. The first wick structure has a first pore size. The second wick structure is received in the window of the first wick structure. The second wick structure is in direct physical contact with the inner wall of the evaporating section of the casing and the first wick structure. The second wick structure has a second pore size smaller than the first pore size of the first wick structure. The working medium saturates the first wick structure and the second wick structure. | 06-27-2013 |
20130223773 | BEARING DEVICE - A bearing device includes a cylindrical body. The body defines an axial hole for rotatably receiving a rotatable member therein. The body defines a guiding groove at a side wall thereof. The guiding groove has a bottom end communicating a bottom of the axial hole and a top end at the body. The body defines a bore in a middle portion thereof to communicate the axial hole and the top end of the guiding groove, whereby lubricant can flow in a loop in the body. | 08-29-2013 |
20130224057 | MANUFACTURING METHOD OF BEARING DEVICE - A method for manufacturing a bearing device includes steps: providing a hollow mold, then injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired perform of a cylindrical body and a desired perform of a cover; separating the binder from the desired perform of the body and the desired perform of the cover; sintering the desired perform of the body and the desired perform of the cover, thereby forming the body and the cover; and mounting the cover on the body, thereby forming the bearing device. | 08-29-2013 |
20130269858 | MANUFACTURING METHOD OF CASING OF HEAT PIPE - A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe. | 10-17-2013 |
20130312938 | HEAT PIPE WITH VAPORIZED WORKING FLUID FLOW ACCELERATOR - An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section. | 11-28-2013 |
20130323344 | INJECTION MOLDING APPARATUS HAVING THERMOSTAT ASSEMBLY - An exemplary injection molding apparatus includes a first mold defining a passage therein, a second mold engaging with the first mold, working fluid received in the passage of the first mold, and a thermal conductive member engaged in the first mold and thermally interconnecting the first mold and the working fluid. The first mold and the second mold cooperatively define a molding chamber therebetween adapted to receive injected molten material therein. The thermal conductive member transfers heat from the first and second molds to the working fluid when the first and second molds are hotter than the working fluid, and transfers heat from the working fluid to the first and second molds when the working fluid is hotter than the first and second molds. | 12-05-2013 |