Patent application number | Description | Published |
20090176369 | LOW-H PLASMA TREATMENT WITH N2 ANNEAL FOR ELECTRONIC MEMORY DEVICES - A method for forming a single damascene and/or dual damascene, contact and interconnect structure, comprising: performing front end processing, depositing copper including a copper barrier, annealing the copper in at least 90% N | 07-09-2009 |
20100065901 | Electrically programmable and erasable memory device and method of fabrication thereof - The present memory device includes a substrate, a tunneling layer over the substrate, a floating gate over the tunneling layer, a dielectric over the floating gate and including silicon oxynitride, and a control gate over the dielectric. A method for fabricating such a memory device is also provided, including various approaches for forming the silicon oxynitride. | 03-18-2010 |
20100123178 | High ultraviolet light absorbance silicon oxynitride film for improved flash memory device performance - An ultraviolet light absorbent silicon oxynitride layer overlies a memory cell including a pair of source/drains, a gate insulator, a floating gate, a dielectric layer, and a control gate. A conductor is disposed through the silicon oxynitride layer for electrical connection to the control gate, and another conductor is disposed through the silicon oxynitride layer for electrical connection to a source/drain. | 05-20-2010 |
20140124848 | ELECTRICALLY PROGRAMMABLE AND ERASEABLE MEMORY DEVICE - The present claimed subject matter is directed to memory device that includes substrate, a tunneling layer over the substrate, a floating gate over the tunneling layer, a dielectric over the floating gate and including silicon oxynitride, and a control gate over the dielectric. | 05-08-2014 |
20140339597 | SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS - A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region and first and second metal contacts, wherein the first metal contact is in direct contact with the n-type region and the second metal contact is in direct contact with the p-type region. First and second metal layers are disposed on the first and second metal contacts, respectively. The first and second metal layers are sufficiently thick to mechanically support the semiconductor structure. A sidewall of one of the first and second metal layers comprises a three-dimensional feature. | 11-20-2014 |
20150076538 | SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE - A method according embodiments of the invention includes providing a wafer of semiconductor devices. The wafer of semiconductor devices includes a semiconductor structure comprising a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor devices further includes first and second metal contacts for each semiconductor device. Each first metal contact is in direct contact with the n-type region and each second metal contact is in direct contact with the p-type region. The method further includes forming a structure that seals the semiconductor structure of each semiconductor device. The wafer of semiconductor devices is attached to a wafer of support substrates. | 03-19-2015 |
20150140711 | METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES - A method according to embodiments of the invention includes providing a wafer comprising a semiconductor structure grown on a growth substrate. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. The wafer includes trenches defining individual semiconductor devices. The trenches extend through an entire thickness of the semiconductor structure to reveal the growth substrate. The method further includes forming a thick conductive layer on the semiconductor structure. The thick conductive layer is configured to support the semiconductor structure when the growth substrate is removed. The method further includes removing the growth substrate. | 05-21-2015 |
Patent application number | Description | Published |
20100063068 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, II, III, IV, and V, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 03-11-2010 |
20100093694 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 04-15-2010 |
20100184800 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, II, III, IV, and V, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 07-22-2010 |
20100249094 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 09-30-2010 |
20110256099 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 10-20-2011 |
20120201783 | COMPOUNDS FOR THE TREATMENT OF HEPATITIS C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 08-09-2012 |
20120232099 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, II, III, IV, and V, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 09-13-2012 |
20120316126 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 12-13-2012 |
20130197012 | Compounds for the Treatment of Hepatitis C - The disclosure provides compounds of formula I, including their salts, as well as compositions and methods of using the compounds. The compounds have activity against hepatitis C virus (HCV) and may be useful in treating those infected with HCV. | 08-01-2013 |
20160107980 | CROSS METATHESIS OF POLY-BRANCHED POLY-OLEFINS - This invention describes processes to make products by cross metathesis of functionalized or non-functionalized olefins with poly-branched poly-olefins such as terpenes (e.g., farnesene(s), α-farnesene, β-farnesene, β-myrcene, etc.) and compositions made by such methods. More particularly, the present invention relates to methods of making (i) cross metathesis products by a cross metathesis reaction between at least one hydrovinylated olefinic substrate and at least one hydrovinylated cross metathesis substrate in the presence of at least one olefin metathesis catalyst; (ii) cross metathesis products by a cross metathesis reaction between at least one hydrovinylated olefinic substrate and at least one cross metathesis substrate in the presence of at least one olefin metathesis catalyst; and (iii) cross metathesis products by a cross metathesis reaction between at least one olefinic substrate and at least one hydrovinylated cross metathesis substrate in the presence of at least one olefin metathesis catalyst; as well as compositions made by such methods. | 04-21-2016 |
Patent application number | Description | Published |
20090260796 | Passive Cooling In Response To Ambient Environmental Properties - A system for passively cooling an electronic component includes a conduit configured to carry a pressurized cooling fluid. The conduit has a plurality of delivery orifices configured to dispense the pressurized cooling fluid from the conduit to cool the electronic component. Each delivery orifice has a hydrogel mechanism associated therewith, which is configured to individually control each of the plurality of delivery orifices to automatically regulate flow of the cooling fluid in response to a variation in a property of an ambient environment surrounding the hydrogel mechanism. The property of the ambient environment is influenced by an operation of the electronic component. | 10-22-2009 |
20110253966 | IONIC-MODULATED DOPANT PROFILE CONTROL IN NANOSCALE SWITCHING DEVICES - A nanoscale switching device is provided, comprising: a first electrode of a nanoscale width; a second electrode of a nanoscale width; an active region disposed between the first and second electrodes, the active region having at least one non-conducting layer comprising an electronically semiconducting or nominally insulating and a weak ionic conductor switching material capable of carrying a species of dopants and transporting the dopants under an electric field; and a source layer interposed between the first electrode and the second electrode and comprising a highly reactive and highly mobile ionic species that reacts with a component in the switching material to create dopants that are capable of drifting through the non-conducting layer under an electric field, thereby controlling dopant profile by ionic modulation. A crossbar array comprising a plurality of the nanoscale switching devices is also provided, along with a process for making at least one nanoscale switching device. | 10-20-2011 |
20120081945 | MEMORY ARRAY WITH GRADED RESISTANCE LINES - A memory array with graded resistance lines includes a first set of lines intersecting a second set of lines. A line from one of the sets of lines includes a graded resistance along a length of the line. | 04-05-2012 |
20120112167 | NANOSCALE ELECTRONIC DEVICE - One example of the present invention is a nanoscale electronic device comprising a first conductive electrode, a second conductive electrode, and an anisotropic dielectric material layered between the first and second electrodes having a permittivity in a direction approximately that of the shortest distance between the first and second electrodes less than the permittivity in other directions within the anisotropic dielectric material. Additional examples of the present invention include integrated circuits that contain multiple nanoscale electronic devices that each includes an anisotropic dielectric material layered between first and second electrodes having a permittivity in a direction approximately that of the shortest distance between the first and second electrodes less than the permittivity in other directions within the anisotropic dielectric material. | 05-10-2012 |
20130009128 | NANOSCALE SWITCHING DEVICE - A nanoscale switching device has an active region containing a switching material. The switching device has a first electrode and a second electrode with nanoscale widths, and the active region is disposed between the first and second electrodes. A protective cladding layer surrounds the active region. The protective cladding layer is formed of a cladding material unreactive to the switching material. An interlayer isolation layer formed of a dielectric material is disposed between the first and second electrodes and outside the protective cladding layer. | 01-10-2013 |
20130114329 | Multilayer Memory Array - A multilayer crossbar memory array includes a number of layers. Each layer includes a top set of parallel lines, a bottom set of parallel lines intersecting the top set of parallel lines, and memory elements disposed at intersections between the top set of parallel lines and the bottom set of parallel lines. A top set of parallel lines from one of the layers is a bottom set of parallel lines for an adjacent one of the layers. | 05-09-2013 |
20130168629 | NANOSCALE SWITCHING DEVICE - A nanoscale switching device comprises a first electrode of a nanoscale width; a second electrode of a nanoscale width; an active region disposed between the first and second electrodes, the active region containing a switching material; an area within the active region that constrains current flow between the first electrode and the second electrode to a central portion of the active region; and an interlayer dielectric layer formed of a dielectric material and disposed between the first and second electrodes outside the active region. A nanoscale crossbar array and method of forming the nanoscale switching device are also disclosed. | 07-04-2013 |
20140027700 | MEMRISTOR WITH EMBEDDED SWITCHING LAYER - A method of making a memristor having an embedded switching layer include exposing a surface portion of a first electrode material within a via to a reactive species to form the switching layer embedded within and at surface of the via. The via is in contact with a first conductor trace. The method further includes depositing a layer of a second electrode material adjacent to the via surface and patterning the layer into a column aligned with the via. The method further includes depositing an interlayer dielectric material to surround the column and providing a second conductor trace in electrical contact with the second electrode material of the column. | 01-30-2014 |
20140097398 | MEMRISTIVE DEVICES AND MEMRISTORS WITH RIBBON-LIKE JUNCTIONS AND METHODS FOR FABRICATING THE SAME - Memristive devices, memristors and methods for fabricating memristive devices are disclosed. In one aspect, a memristor includes a first electrode wire and a second electrode wire. The second electrode wire and the first electrode wire define an overlap area. The memristor includes an electrode extension in contact with the first electrode wire and disposed between the first and second electrode wires. At least one junction is disposed between the second electrode wire and the electrode extension. Each junction contacts a portion of the electrode extension and has a junction contact area with the second electrode wire, and the sum total junction contact area of the at least one junction is less than the overlap area. | 04-10-2014 |
20140211535 | MITIGATION OF INOPERABLE LOW RESISTANCE ELEMENTS IN PROGRAMABLE CROSSBAR ARRAYS - A programmable crossbar array includes a layer of row conductors and a layer of column conductors with the row conductors crossing over the column conductors to form junctions. Programmable crosspoint devices are sandwiched between a row conductor and a column conductor at a junction. Each programmable crosspoint device includes a data element with a first programming threshold and a control element with a second programming threshold, in which the second programming threshold is greater than the first programming threshold. A method for mitigating shorts in a programmable crossbar array is also provided. | 07-31-2014 |
20140313816 | SELECT DEVICE FOR CROSS POINT MEMORY STRUCTURES - The present disclosure provides a memory cell that includes a resistive memory element disposed between a first conductor and a second conductor, the first conductor and the second conductor configured to activate the resistive memory element. The memory cell also includes a backward diode disposed in series with the memory element between the memory element and either the first conductor or the second conductor. | 10-23-2014 |
Patent application number | Description | Published |
20110282593 | WELD CHECK STATIONS - A method of manufacture for a portable computing device is described. In particular, methods and apparatus for assessing a quality of weld joints used to connect one or more components of the portable computing device are described. The weld joints can include one or more weld points. At a weld check station, using a vector network analyzer, a test signal generated can be passed through the weld joint and a response signal can be measured. The measured characteristics can be used to assess a quality of the weld joint. In one embodiment, the vector network analyzer can be used to generate a number of high frequency test signals that are passed through the weld to perform a time domain reflectometry measurement where the weld joint can be accepted or rejected based upon the measurement. | 11-17-2011 |
20120115347 | CABLE CONNECTOR RETENTION CLIPS - Electrical devices may be tested using test equipment. A device may have an associated cable with a connector. The test equipment may have an associated cable with a connector. An adapter may have a pair of connectors. One of the adapter connectors may be connected to the connector of the cable associated with the device and the other of the adapter connectors may be connected to the connector of the cable that is associated with the tester. A retention clip may be attached to a groove in the adapter. Flexible members in the clip may each grasp an opposing side of the adapter within the groove. A retention member in the clip may bear against the connector on the cable that is associated with the device to hold the connectors for the device cable and the adapter together. | 05-10-2012 |
20120139571 | System for Field Testing Wireless Devices With Reduced Multipath Interference - A portable test chamber with an open top may serve as a field testing apparatus for wireless testing of electronic devices. A wireless device under test may be mounted within a cavity in the test chamber. The cavity may be surrounded by a dielectric lining of anechoic material. A layer of electromagnetic shielding such as metal foil may cover the outer surfaces of the dielectric lining. The chamber may have a box shape with a rectangular opening at its top. Satellite navigation system signals or other wireless signals may be received through the opening at the top of the test chamber during testing. The electromagnetic shielding may reduce the effects of multipath interference during field tests. | 06-07-2012 |
20120262188 | RADIO-FREQUENCY TEST PROBES WITH INTEGRATED MATCHING CIRCUITRY - Wireless electronic devices include wireless communications circuitry such as transceiver circuitry coupled to an antenna resonating element. The transceiver circuitry and the antenna element may be formed on first and second substrates, respectively. In compact wireless devices, transceiver and antenna matching circuits may be formed on the first substrate. During production testing, a radio-frequency test probe with integrated matching circuitry may be used to mate with a corresponding contact point on the first substrate. The integrated matching circuitry may include resistors, capacitors, and inductors soldered in desired series-parallel configurations within the test probe. When the test probe is mated to the contact point on the first substrate, a test unit connected to the test probe may be used to perform radio-frequency measurements to determine whether the transceiver circuitry satisfies design criteria. | 10-18-2012 |
20120268153 | NON-CONTACT TEST SYSTEM - Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault. | 10-25-2012 |
20120274346 | TESTING SYSTEM WITH CAPACITIVELY COUPLED PROBE FOR EVALUATING ELECTRONIC DEVICE STRUCTURES - Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing. | 11-01-2012 |
20120287792 | BIDIRECTIONAL RADIO-FREQUENCY PROBING - Wireless electronic devices may include wireless communications circuitry such as a transceiver, antenna, and other wireless circuitry. The transceiver may be coupled to the antenna through a bidirectional switch connector. The switch connector may mate with a corresponding radio-frequency test probe that is connected to radio-frequency test equipment. When the test probe is mated with the switch connector, the transceiver may be decoupled from the antenna. During transceiver testing, radio-frequency test signals may be conveyed between the test unit and the transceiver using the test probe. During antenna testing, radio-frequency test signals may be conveyed between the test unit and the antenna using the test probe. Transceiver testing and antenna testing may, if desired, be conducted in parallel using the test probe. | 11-15-2012 |
20120293379 | TESTING SYSTEM WITH ELECTRICALLY COUPLED AND WIRELESSLY COUPLED PROBES - Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a pair of pins or other contacts. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the test probe contacts. An antenna may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the conductive electronic device structures contain a fault. | 11-22-2012 |
20120306521 | TEST SYSTEM WITH TEMPORARY TEST STRUCTURES - Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault. | 12-06-2012 |
20120319697 | METHODS FOR PROVIDING PROPER IMPEDANCE MATCHING DURING RADIO-FREQUENCY TESTING - Wireless electronic devices may include a transceiver, an antenna resonating element coupled to the transceiver via a transmission line path, transceiver and antenna impedance matching circuits, and other circuitry. The transceiver and the impedance matching circuits may be formed on a first substrate. The antenna resonating element may be formed using a second substrate. The antenna resonating element may be decoupled from the first substrate during testing. First and second sets of test points may be formed at first and second locations long the transmission line path. During testing, a test probe may mate with the first set of test points, whereas an impedance adjustment circuit that serves to electrically isolate the antenna impedance matching circuit from the transceiver may mate with the second set of test points. The impedance adjustment circuit need not be used if the antenna impedance matching circuit is decoupled from the transceiver during testing. | 12-20-2012 |
20130002280 | TEST PROBE ALIGNMENT STRUCTURES FOR RADIO-FREQUENCY TEST SYSTEMS - Electronic devices may be tested using a test station with a test fixture. The test fixture may include a first holding structure in which a device under test may be placed and a second holding structure for supporting test probes. The second holding structure may be mated with a test probe alignment structure during test station setup operations. The test probe alignment structure may include registration features configured to set the relative position of the first and second holding structures to a known configuration and may include test probe alignment features that can be used to correctly position the placement of the test probes. If at least one of the test probes is not sufficiently aligned to its corresponding alignment feature, the test probe alignment structures will not be able to engage properly with the second holding structure, and the position of the problematic test probe may be adjusted accordingly. | 01-03-2013 |
20130015870 | TEST SYSTEM WITH CONTACT TEST PROBESAANM Nickel; Joshua G.AACI San JoseAAST CAAACO USAAGP Nickel; Joshua G. San Jose CA USAANM Pascolini; MattiaAACI San MateoAAST CAAACO USAAGP Pascolini; Mattia San Mateo CA USAANM Syed; AdilAACI Santa ClaraAAST CAAACO USAAGP Syed; Adil Santa Clara CA US - Electronic device structures such as structures containing antennas, cables, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a test system to perform conducted testing. The test system may include a vector network analyzer or other test unit that generates radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using a contact test probe that has at least signal and ground pins. The test probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault. | 01-17-2013 |
20130044033 | TEST SYSTEM WITH ADJUSTABLE RADIO-FREQUENCY PROBE ARRAY - Electronic device structures may be tested using a radio-frequency test system. The radio-frequency test system may include radio-frequency test equipment and an associated test fixture. The radio-frequency test equipment may be used in generating and measuring radio-frequency signals. The test fixture may contain adjustable structures that allow the positions of radio-frequency test probes to be adjusted. The test system may be configured to position radio-frequency probes in the test fixture so that some probe contacts form electrical connections with conductive antenna structures. The radio-frequency probes may contain other contacts that are positioned to form electrical connections with conductive electronic device housing structures. During radio-frequency testing, the test equipment in the test system may apply radio-frequency test signals to the device structures under test using the test probes. Corresponding radio-frequency test signals may be measured by the test equipment. | 02-21-2013 |
20130050046 | CUSTOMIZABLE ANTENNA FEED STRUCTURE - Custom antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member. The custom antenna structures compensate for manufacturing variations that could potentially lead to undesired variations in antenna performance. The custom antenna structures may make customized alterations to antenna feed structures or conductive paths within an antenna. An antenna may be formed from a conductive housing member that surrounds an electronic device. The custom antenna structures may be formed from a printed circuit board with a customizable trace. The customizable trace may have a contact pad portion on the printed circuit board. The customizable trace may be customized to connect the pad to a desired one of a plurality of contacts associated with the conductive housing member to form a customized antenna feed terminal. | 02-28-2013 |
20130093447 | Methods for Reducing Path Loss While Testing Wireless Electronic Devices with Multiple Antennas - A test station may include a test host, a test unit, and a test enclosure. A device under test (DUT) having at least first and second antennas may be placed in the test enclosure during production testing. Radio-frequency test signals may be conveyed from the test unit to the DUT using a test antenna in the test enclosure. In a first time period during which the performance of the first antenna is being tested, the DUT may be oriented in a first position such that path loss between the first antenna and the test antenna is minimized. In a second time period during which the performance of the second antenna is being tested, the DUT may be oriented in a second position such that path loss between the second antenna and the test antenna is minimized. The DUT is marked as a passing DUT if gathered test data is satisfactory. | 04-18-2013 |
20130169490 | Antenna With Switchable Inductor Low-Band Tuning - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antennas. An antenna may be formed from an antenna resonating element arm and an antenna ground. The antenna resonating element arm may have a shorter portion that resonates at higher communications band frequencies and a longer portion that resonates at lower communications band frequencies. A short circuit branch may be coupled between the shorter portion of the antenna resonating element arm and the antenna ground. A series-connected inductor and switch may be coupled between the longer portion of the antenna resonating element arm and the antenna ground. An antenna feed branch may be coupled between the antenna resonating element arm and the antenna ground at a location that is between the short circuit branch and the series-connected inductor and switch. | 07-04-2013 |
20130194139 | ELECTRONIC DEVICE WITH CALIBRATED TUNABLE ANTENNA - An electronic device may have tunable antenna structures. A tunable antenna may have an antenna resonating element and an antenna ground. An adjustable electronic component such as an adjustable capacitor, adjustable inductor, or adjustable phase-shift element may be used in tuning the antenna. An impedance matching circuit may be coupled between the tunable antenna and a radio-frequency transceiver. The adjustable electronic component may be coupled to the antenna resonating element or other structures in the antenna or may form part of the impedance matching circuit, a transmission line, a parasitic antenna element, or other antenna structures. During manufacturing, manufacturing variations may cause the performance of the tunable antenna to deviate from desired specifications. Calibration operations may be performed to identify compensating adjustments to be made with the adjustable electronic component. Calibration data for the adjustable component may be stored in control circuitry in the electronic device. | 08-01-2013 |
20130203364 | Tunable Antenna System with Multiple Feeds - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. The transceiver circuit may have a first circuit that handles communications using the first feed and may have a second circuit that handles communications using the second feed. A first filter may be interposed between the first feed and the first circuit and a second filter may be interposed between the second feed and the second circuit. The first and second filters and the antenna may be configured so that the first circuit can use the first feed without being adversely affected by the presence of the second feed and so that the second circuit can use the second feed without being adversely affected by the presence of the first feed. | 08-08-2013 |
20130234741 | Methods for Characterizing Tunable Radio-Frequency Elements - A wireless electronic device may contain at least one antenna tuning element for use in tuning the operating frequency range of the device. The antenna tuning element may include radio-frequency switches, continuously/semi-continuously adjustable components such as tunable resistors, inductors, and capacitors, and other load circuits that provide desired impedance characteristics. A test station may be used to measure the radio-frequency characteristics associated with the tuning element. The test station may provide adjustable temperature, power, and impedance control to help emulate a true application environment for the tuning element without having to place the tuning element within an actual device during testing. The test system may include at least one signal generator and a tester for measuring harmonic distortion values and may include at least two signal generators and a tester for measuring intermodulation distortion values. During testing, the antenna tuning element may be placed in a series or shunt configuration. | 09-12-2013 |
20130271328 | Impedance Reference Structures for Radio-Frequency Test Systems - A radio-frequency test system configured for testing device structures under test is provided. The test system may include a radio-frequency tester, a test probe that is coupled to the tester, and an auxiliary test fixture that receives the device structures under test. During testing, the device structures under test may be mounted on the auxiliary test fixture. The auxiliary test fixture may provide a ground contact point and a ground reference plane. The device structures under test may include a radio-frequency circuit coupled to a conductive member via a signal path. During testing, the test probe may mate with the conductive member on the device structures under test and the ground contact point on the auxiliary test fixture. The ground reference plane in the auxiliary test fixture may serve to provide proper grounding for the signal path to help improve the accuracy of test results associated with the radio-frequency circuit. | 10-17-2013 |
20130293249 | Methods for Modeling Tunable Radio-Frequency Elements - A test system for characterizing an antenna tuning element is provided. The test system may include a test host, a radio-frequency tester, and a test fixture. The test system may calibrate the radio-frequency tester using known coaxial standards. The test system may then calibrate transmission line effects associated with the test fixture using a THRU-REFLECT-LINE calibration algorithm. The antenna tuning element may be mounted on a test socket that is part of the test fixture. While the antenna tuning element is mounted on the test socket, scattering parameter measurements may be obtained using the radio-frequency tester. An equivalent circuit model for the test socket can be obtained based on the measured scattering parameters and known characteristics of the antenna tuning element. Once the test socket has been characterized, an equivalent circuit model for the antenna tuning element can be obtained by extracting suitable modeling parameters from the measured scattering parameters. | 11-07-2013 |
20130321012 | Methods and Apparatus for Testing Small Form Factor Antenna Tuning Elements - A test system for testing a device under test (DUT) is provided. The test system may include a DUT receiving structure configured to receive the DUT during testing and a DUT retention structure that is configured to press the DUT against the DUT receiving structure so that DUT cannot inadvertently shift around during testing. The DUT retention structure may include a pressure sensor operable to detect an amount of pressure that is applied to the DUT. The DUT retention structure may be raised and lowered vertically using a manually-controlled or a computer-controlled positioner. The positioner may be adjusted using a coarse tuning knob and a fine tuning knob. The positioner may be calibrated such that the DUT retention structure applies a sufficient amount of pressure on the DUT during production testing. | 12-05-2013 |
20140087668 | Methods and Apparatus for Performing Coexistence Testing for Multi-Antenna Electronic Devices - Radio frequency test systems for characterizing antenna performance in various radio coexistence scenarios are provided. In one suitable arrangement, a test system may be used to perform passive radio coexistence characterization. During passive radio coexistence characterization, at least one signal generator may be used to feed aggressor signals directly to antennas within an electronic device under test (DUT). The aggressor signals may generate undesired interference signals in a victim frequency band, which can then be received and analyzed using a spectrum analyzer. During active radio coexistence characterization, at least one radio communications emulator may be used to communicate with a DUT via a first test antenna. While the DUT is communicating with the at least one radio communications emulator, test signals may also be conveyed between DUT | 03-27-2014 |
20140167794 | Methods for Validating Radio-Frequency Test Stations - A manufacturing system for assembling wireless electronic devices is provided. The manufacturing system may include test stations for testing the radio-frequency performance of components that are to be assembled within the electronic devices. A reference test station may be calibrated using calibration coupons having known radio-frequency characteristics. The calibration coupons may include transmission line structures. The reference test station may measure verification standards to establish baseline measurement data. The verification standards may include circuitry having electrical components with given impedance values. Many verification coupons may be measured to enable testing for a wide range of impedance values. Test stations in the manufacturing system may subsequently measure the verification standards to generate test measurement data. The test measurement data may be compared to the baseline measurement data to characterize the performance of the test stations to ensure consistent test measurements across the test stations. | 06-19-2014 |
20140179239 | Methods and Apparatus for Performing Passive Antenna Testing with Active Antenna Tuning Device Control - A wireless electronic device may contain at least one adjustable antenna tuning element for use in tuning the operating frequency range of the device. The antenna tuning element may include radio-frequency switches, continuously/semi-continuously adjustable components such as tunable resistors, inductors, and capacitors, and other load circuits that provide desired impedance characteristics. A test system that is used for performing passive radio-frequency (RF) testing on antenna tuning elements in partially assembled devices is provided. The test system may include an RF tester and a test host. The tester may be used to gather scattering parameter measurements from the antenna tuning element. The test host may be used to ensure that power and appropriate control signals are being supplied to the antenna tuning element so that the antenna tuning element is placed in desired tuning states during testing. | 06-26-2014 |
20140370821 | Methods and Apparatus for Testing Electronic Devices with Antenna Arrays - A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements formed along its periphery. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The electronic device may be tested using a test system for detecting the presence of manufacturing/assembly defects. The test system may include an RF tester and a test fixture. The device under test (DUT) may be attached to the test fixture during testing. Multiple test probes arranged along the periphery of the DUT may be used to transmit and receive RF test signals for gathering scattering parameter measurements on the device under test. The scattering parameter measurements may then be compared to predetermined threshold values to determine whether the DUT contains any defects. | 12-18-2014 |
20150048858 | NON-CONTACT TEST SYSTEM - Electronic device structures such as structures containing antennas, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a non-contact test system. The test system may include a vector network analyzer or other test unit that generates radio-frequency tests signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using an antenna probe that has one or more test antennas. The antenna probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault. | 02-19-2015 |
20150050893 | Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly - Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria. | 02-19-2015 |
20150177277 | Radio-Frequency Test System with Tunable Test Antenna Circuitry - A test system is provided for performing radio-frequency tests on an electronic device under test (DUT) having multiple antennas. The test system may include a test unit for generating radio-frequency test signals, a test enclosure, and a test antenna fixture. The test fixture may include tunable antenna circuitry, antenna tuning elements, a test sensor, a microcontroller, a battery, and a solar cell that charges the battery, each of which is mounted on a test fixture within the test enclosure. The test sensor may be used to detect stimuli issued by the DUT. In response to detecting the stimuli, the microcontroller may send control signals to the antenna tuning elements to configure the antenna circuitry in different modes. Each of the different modes may be optimized to test a selected one of the multiple antennas in the DUT when operating using different radio access technologies and at different frequencies. | 06-25-2015 |
20150357703 | Multiband Antennas Formed From Bezel Bands with Gaps - Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. An inverted-F antenna may have first and second short circuit legs and a feed leg. The first and second short circuit legs and the feed leg may be connected to a folded antenna resonating element arm. The antenna resonating element arm and the first short circuit leg may be formed from portions of a conductive electronic device bezel. The folded antenna resonating element arm may have a bend. The bezel may have a gap that is located at the bend. Part of the folded resonating element arm may be formed from a conductive trace on a dielectric member. A spring may be used in connecting the conductive trace to the electronic device bezel portion of the antenna resonating element arm. | 12-10-2015 |