Niazimbetova
Zuhra I. Niazimbetova, Westborough, MA US
Patent application number | Description | Published |
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20130098770 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 04-25-2013 |
20140027297 | PLATING BATH AND METHOD - This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. | 01-30-2014 |
20140027298 | PLATING BATH AND METHOD - This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. | 01-30-2014 |
20150136611 | REACTION PRODUCTS OF GUANIDINE COMPOUNDS OR SALTS THEREOF, POLYEPOXIDES AND POLYHALOGENS - Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability. | 05-21-2015 |
20150159288 | ADDITIVES FOR ELECTROPLATING BATHS - Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias. | 06-11-2015 |
20150342063 | COPOLYMERS OF DIGLYCIDYL ETHER TERMINATED POLYSILOXANE COMPOUNDS AND NON-AROMATIC POLYAMINES - Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines are used in the preparation of dielectric materials for electroless metal plating. The copolymers may be used in the manufacture of printed circuit boards such as in cleaning and conditioning through-holes prior to electroless metallization. | 11-26-2015 |
20160102404 | COPOLYMERS OF DIGLYCIDYL ETHER TERMINATED POLYSILOXANE COMPOUNDS AND NON-AROMATIC POLYAMINES - Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines are used in the preparation of dielectric materials for electroless metal plating. The copolymers may be used in the manufacture of printed circuit boards such as in cleaning and conditioning through-holes prior to electroless metallization. | 04-14-2016 |
Zuhra I. Niazimbetova, Marlborough, MA US
Patent application number | Description | Published |
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20160143152 | REACTION PRODUCTS OF HETEROCYCLIC NITROGEN COMPOUNDS POLYEPOXIDES AND POLYHALOGENS - Reaction products of heterocyclic nitrogen compounds, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate metal with good surface properties and good physical reliability. | 05-19-2016 |
Zukhra I. Niazimbetova, Westborough, MA US
Patent application number | Description | Published |
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20080268138 | Metal plating compositions and methods - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 10-30-2008 |
20110318479 | METAL PLATING COMPOSITIONS AND METHODS - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 12-29-2011 |
20120034371 | METAL PLATING COMPOSITIONS - Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate. | 02-09-2012 |
20130048505 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 02-28-2013 |
Zukhra I. Niazimbetova, Westboro, MA US
Patent application number | Description | Published |
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20110220512 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110220513 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110220514 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110290660 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 12-01-2011 |
Zukra I. Niazimbetova, Westborough, MA US
Patent application number | Description | Published |
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20080269395 | Metal plating compositions - Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate. | 10-30-2008 |
20140081045 | METAL PLATING COMPOSITIONS AND METHODS - Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power. | 03-20-2014 |