Patent application number | Description | Published |
20080287169 | BIDIRECTIONAL SLIDE-TYPE MOBILE COMMUNICATION TERMINAL AND METHOD OF PROVIDING GRAPHIC USER INTERFACE THEREOF - A bidirectional slide-type mobile communication terminal for providing a user interface that changes in real time according to input includes a sensor-equipped lower body and an upper body that slides with respect to the lower body. A method of providing such a graphic user interface includes sensing a sliding movement of the upper body, switching the terminal to an operation mode corresponding to the direction of the sliding movement, displaying the graphic user interface corresponding to the operation mode to which the terminal is switched, receiving input from a sensor, and changing the displayed graphic user interface in real time corresponding to the received input. | 11-20-2008 |
20120056245 | SEMICONDUCTOR DEVICES INCLUDING SILICIDE REGIONS AND METHODS OF FABRICATING THE SAME - A semiconductor device includes a semiconductor substrate, a gate electrode structure including a gate electrode located on an active region of the semiconductor substrate, first and second epitaxial regions located in the active region at opposite sides of the gate electrode structure, and first and second silicide layers on upper surfaces of the first and second epitaxial regions, respectively. The first and second epitaxial regions include Si—X, where X is one of germanium and carbon, and at least a portion of each of the first and second silicide layers is devoid of X and includes Si—Y, where Y is a metal or metal alloy | 03-08-2012 |
20120329252 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device may include a semiconductor substrate with an active region, a gate line disposed on the active region, an epitaxial pattern disposed on the semiconductor substrate beside the gate line, the epitaxial pattern including a semiconductor material different from the semiconductor substrate, and a capping pattern disposed on the epitaxial pattern. The capping pattern may improve contact with contact plug and may reduce variation in mean ion depths of an associated field effect transistor. | 12-27-2012 |
20130005096 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device comprises a substrate and first and second stress-generating epitaxial regions on the substrate and spaced apart from each other. A channel region is on the substrate and positioned between the first and second stress-generating epitaxial regions. A gate electrode is on the channel region. The channel region is an epitaxial layer, and the first and second stress-generating epitaxial regions impart a stress on the channel region. | 01-03-2013 |
20140174352 | APPARATUS FOR PROCESSING WAFERS - A wafer processing apparatus includes a first tube extending in a vertical direction, a second tube arranged in the first tube and defining a reaction chamber, the reaction chamber being configured to receive a boat that holds a plurality of wafers, first and second gas nozzles in the second tube, the first and second gas nozzles being configured to supply first and second reaction gases, respectively, and being spaced apart from each other along a circumferential direction of the second tube to define a central angle of at about 50° to about 130° with respect to a center of the second tube, and an exhaust portion configured to exhaust residual gas from the reaction chamber, the exhaust portion including an exhaust slit in the second tube and an exhaust space between the first tube and the second tube. | 06-26-2014 |
20150008452 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device comprises a substrate and first and second stress-generating epitaxial regions on the substrate and spaced apart from each other. A channel region is on the substrate and positioned between the first and second stress-generating epitaxial regions. A gate electrode is on the channel region. The channel region is an epitaxial layer, and the first and second stress-generating epitaxial regions impart a stress on the channel region. | 01-08-2015 |
20150031183 | SEMICONDUCTOR DEVICES INCLUDING SILICIDE REGIONS AND METHODS OF FABRICATING THE SAME - A semiconductor device has a silicide source/drain region is fabricated by growing silicon on an epitaxial region including silicon and either germanium or carbon. In the method, a gate electrode is formed on a semiconductor substrate with a gate insulating layer interposed therebetween. An epitaxial layer is formed in the semiconductor substrate at both sides of the gate electrodes. A silicon layer is formed to cap the epitaxial layer. The silicon layer and a metal material are reacted to form a silicide layer. In a PMOS, the epitaxial layer has a top surface and inclined side surfaces that are exposed above the upper surface of the active region. The silicon layer is grown on the epitaxial layer in such a way as to cap the top and inclined surfaces. | 01-29-2015 |
20150035023 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device may include first and second fins formed side by side on a substrate, a first elevated doped region formed on the first fin and having a first doping concentration of impurities, a second elevated doped region formed on the second fin, and a first bridge connecting the first elevated doped region and the second elevated doped region to each other. Methods of manufacturing such a semiconductor device are also disclosed. | 02-05-2015 |
Patent application number | Description | Published |
20120199183 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - The solar cell includes a substrate, a semiconductor layer, a first doped pattern and a second doped pattern. The substrate has a first surface adapted to receive solar light and a second surface opposite to the first surface. The semiconductor layer includes an insulating pattern formed on a first area of the second surface of the substrate and a semiconductor pattern formed on a second area of the second surface of the substrate in which the insulating pattern is not formed. The first doped pattern and the second doped pattern are formed either in or on the semiconductor pattern. | 08-09-2012 |
20120234382 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - A solar cell and a method of manufacturing the solar cell, the solar cell including a first surface configured to receive incident sunlight and having a concavo-convex pattern, a substantially flat second surface opposite to the first surface, a first doped layer formed as a crystalline silicon layer having a first dopant, and a second doped layer formed as an amorphous silicon layer having a second dopant. The processes for forming these layers, with the exception of forming the first doped layer, are performed at a low temperature. Accordingly, reflectivity of sunlight may be minimized, a high terminal voltage may be generated, and a wafer including the solar cell can be kept from being bent. | 09-20-2012 |
20120291860 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - A solar cell includes a base substrate having a first surface and a second surface opposite the first surface, the base substrate including a crystalline semiconductor and being configured to have solar light incident on the first surface, a doping pattern on a first portion of the second surface, the doping pattern including a first dopant, a first doping layer on a second portion of the second surface, the first doping layer including a second dopant, and the first and second portions of the second surface being different from each other, a first electrode on the first doping layer, and a second electrode on the doping pattern. | 11-22-2012 |
20130112253 | SOLAR CELL - A solar cell including a first conductive type semiconductor substrate; a first intrinsic semiconductor layer on a front surface of the semiconductor substrate; a first conductive type first semiconductor layer on at least one surface of the first intrinsic semiconductor layer; a second conductive type second semiconductor layer on a back surface of the semiconductor substrate; a second intrinsic semiconductor layer between the second semiconductor layer and the semiconductor substrate; a first conductive type third semiconductor layer on the back surface of the semiconductor substrate, the third semiconductor layer being spaced apart from the second semiconductor layer; and a third intrinsic semiconductor layer between the third semiconductor layer and the semiconductor substrate. | 05-09-2013 |
20130113059 | PHOTOVOLTAIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A photovoltaic device includes a semiconductor substrate; an amorphous first conductive semiconductor layer on a first region of a first surface of the semiconductor substrate and containing a first impurity; an amorphous second conductive semiconductor layer on a second region of the first surface of the semiconductor substrate and containing a second impurity; and a gap passivation layer located between the first region and the second region on the semiconductor substrate, wherein the first conductive semiconductor layer is also on the gap passivation layer. | 05-09-2013 |
20130125964 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - A solar cell including a crystalline semiconductor substrate having a first conductive type; a first doping layer on a front surface of the substrate and being doped with a first conductive type impurity; a front surface antireflection film on the front surface of the substrate; a back surface antireflection film on a back surface of the substrate; an intrinsic semiconductor layer, an emitter, and a first auxiliary electrode stacked on the back surface antireflection film and the substrate; a second doping layer on the back surface of the substrate and being doped with the first impurity; an insulating film on the substrate and including an opening overlying the second doping layer; a second auxiliary electrode in the opening and overlying the second doping layer; a first electrode on the first auxiliary electrode; and a second electrode on the second auxiliary electrode and being separated from the first electrode. | 05-23-2013 |
20130127005 | PHOTOVOLTAIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A photovoltaic device and a method of manufacturing the same are disclosed. In one embodiment, the device includes i) a semiconductor substrate, ii) a first conductive semiconductor layer formed on a first region of the semiconductor substrate and iii) a first transparent conductive layer formed on the first conductive semiconductor layer. The device may further include i) a second conductive semiconductor layer formed on a second region of the semiconductor substrate, ii) a second transparent conductive layer formed on the second conductive semiconductor layer and iii) a gap passivation layer interposed between i) the first layers and ii) the second layers, wherein the gap passivation layer has a thickness greater than the sum of the thicknesses of the first layers. | 05-23-2013 |
20130133729 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - A solar cell includes a semiconductor substrate, a first intrinsic semiconductor layer and a second intrinsic semiconductor layer on the semiconductor substrate, the first intrinsic semiconductor layer and the second intrinsic semiconductor layer being spaced apart from each other, a first conductive semiconductor layer and a second conductive semiconductor layer respectively disposed on the first intrinsic semiconductor layer and the second intrinsic semiconductor layer, and a first electrode and a second electrode, each including a bottom layer on the first conductive semiconductor layer and the second conductive semiconductor layer, respectively, the bottom layer including a transparent conductive oxide, and an intermediate layer on the bottom layer, the intermediate layer being including copper. | 05-30-2013 |
20140014164 | CONNECTING STRUCTURE OF SOLAR CELL MODULES - A solar cell array includes a number of solar cell modules, each of the solar cell modules including a frame having a first side extending along a first direction, and a first insertion hole is formed in the first side and extending along the first direction. The solar cell array also includes a connecting structure extending along a second direction perpendicular to the first direction for connecting two adjacent modules of the solar cell modules, and the connecting structure includes a first coupling portion and a second coupling portion respectively received in the first insertion holes of the two adjacent modules, wherein each of the first insertion holes has a guide portion and an insertion portion, the guide portion bending from the insertion portion to guide the first coupling portion and the second coupling portion into the respective guide portions. | 01-16-2014 |
20140034119 | PHOTOELECTRIC DEVICE - A photoelectric device that reduces optical loss, reduces recombination loss of carriers, and can be manufactured by using a simplified process is provided. The photoelectric device includes a semiconductor substrate, a first semiconductor stack on a first surface of the semiconductor substrate and having a first conductivity, and a second semiconductor stack on the first surface of the semiconductor substrate and having a second conductivity opposite to the first conductivity. Edge portions of the first and second semiconductor stacks face each other with an insulating portion therebetween. | 02-06-2014 |
20140174507 | APPARATUS FOR PHOTOVOLTAIC POWER GENERATION - A photovoltaic power generation apparatus including a photovoltaic power generator; a frame coupled to an edge of the photovoltaic power generator; and a holder coupled to the frame, the frame including a female coupling part coupled to the edge of the photovoltaic power generator, and an inserting part extending from the female coupling part and being inserted in the holder. | 06-26-2014 |