Patent application number | Description | Published |
20090321387 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - Disclosed is a manufacturing method of a printed circuit board. The method in accordance with an embodiment of the present invention includes: providing a laminated substrate having an insulator as well as a first metal layer and a second metal layer, which are sequentially laminated on one side of the insulator; processing a via hole in the laminated substrate; forming a seed layer on an inner wall of the via hole and on a surface of the second metal layer; plating an inside of the via hole and the surface of the second metal layer with a conductive material that is different from a material of the second metal layer; etching the seed layer and the conductive material, formed on the second metal layer; etching the second metal layer; and forming a first circuit pattern by selectively etching the first metal layer. | 12-31-2009 |
20090324992 | Metal clad laminate and manufacturing method thereof - A metal clad laminate and a method of manufacturing the metal clad laminate are disclosed. The metal clad laminate can include a barrier layer made of a metallic material, a metal foil formed on one side of the barrier layer and coupled with the barrier layer by plating, and an insulator attached to the metal foil. By utilizing the metal clad laminate, the metal foil can be prevented from being perforated when processing a via hole using laser, so that a VOP structure may be implemented with a higher level of reliability. | 12-31-2009 |
20100132876 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via. | 06-03-2010 |
20120192417 | METHOD OF MANUFACTURING A METAL CLAD LAMINATE - A method for manufacturing a printed circuit board having a via-on-pad (VOP) structure, the method including: preparing an insulator and a metal clad laminate, the laminate having a metal foil and a barrier layer successively formed on the insulator; processing a via hole in the insulator from an upper surface of the insulator, a bottom of the via hole being shielded by the metal foil; removing the barrier layer so as to expose a surface of the metal foil; forming a seed layer of the metal foil and in the via hole; forming a patterned plating resist on upper and lower surfaces of the laminate, a portion of the metal foil, which shields the bottom of the via hole, and a top of the via hole being open; and forming a via inside the via hole, and forming a pad on a lower side of the via. | 08-02-2012 |
Patent application number | Description | Published |
20080241361 | Printed circuit board manufacturing method - A printed circuit board manufacturing method is disclosed. The printed circuit manufacturing method, which includes forming an adhesive layer on a carrier, adhesiveness of the adhesive layer being changed according to heat; forming a circuit pattern on a surface of the adhesive layer; compressing the carrier into the insulation layer to allow the circuit pattern to face the insulation layer; and separating the carrier from the insulation layer by supplying heat to allow the adhesive to reach a predetermined temperature, can reduce a cost of a transferring process and improve the reliability of products by minimizing the affect on a metal pattern, by using a material having the adhesiveness changed according to the temperature as an adhesive layer. | 10-02-2008 |
20080251494 | Method for manufacturing circuit board - A method of manufacturing a circuit board is disclosed. The method may include: forming a relievo pattern, which is in a corresponding relationship with a circuit pattern, on a metal layer that is stacked on a carrier; stacking and pressing the carrier onto an insulation layer with the relievo pattern facing the insulation layer; transcribing the metal layer and the relievo pattern into the insulation layer by removing the carrier; forming a via hole in the insulation layer on which the metal layer is transcribed; and filling the via hole and forming a plating layer over the metal layer by performing plating over the insulation layer on which the metal layer is transcribed. As the relievo pattern may be formed on the metal layer stacked on the carrier, and the relievo pattern may be transcribed into the insulation layer, high-density circuit patterns can be formed. | 10-16-2008 |
20080264676 | Circuit board and method for manufaturing thereof - A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stacked on a carrier; stacking and pressing together the carrier and an insulator, such that a surface of the carrier having the conductive relievo pattern faces the insulator; transcribing the conductive relievo pattern into the insulator by removing the carrier; forming a conduction pattern, including a third plating layer and a second metal layer stacked sequentially in correspondence with a second circuit pattern, on the surface of the insulator having the conductive relievo pattern transcribed; removing the first plating layer and seed layer; and removing the first and second metal layers, can provide a circuit board that has high-density circuit patterns without an increased amount of insulator. | 10-30-2008 |
20090242238 | Buried pattern substrate - A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of the insulation layer, and such that the other end portion is exposed at the other surface of the insulation layer. | 10-01-2009 |
20110259627 | Circuit board with buried circuit pattern - A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator. | 10-27-2011 |
20120111607 | CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS - A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein. | 05-10-2012 |
20140360768 | SEMICONDUCTOR PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a semiconductor package board and a method for manufacturing the same. The semiconductor package board according to a preferred embodiment of the present invention includes an insulating layer; a first circuit layer formed on one surface of the insulating layer and including a bump pad; a post bump formed on the bump pad and formed integrally with the bump pad; and a first solder resist layer formed on the insulating layer and the first circuit layer and having a first opening part exposing the post bump and bump pad formed thereon. | 12-11-2014 |
Patent application number | Description | Published |
20090008143 | Board having buried patterns and manufacturing method thereof - A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards. | 01-08-2009 |
20090095508 | Printed circuit board and method for manufacturing the same - A printed circuit board and a method for manufacturing the same are disclosed. The manufacturing method includes: forming a first plating resist corresponding to the circuit pattern on a surface of each of a first carrier and a second carrier; forming a second plating resist corresponding to the pad on each of the surfaces; forming the pad by performing plating over each of the surfaces; stripping the second plating resists; forming the circuit pattern by performing plating over each of the surfaces; pressing the first carrier and the second carrier with an insulation layer interposed between the first carrier and the second carrier such that the circuit patterns face each other; and removing the first carrier and the second carrier. Since plating bars need not be used, the degree of freedom in designing circuits can be increased, and circuits of higher densities can be designed. | 04-16-2009 |
20090206468 | Board on chip package and manufacturing method thereof - A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer. | 08-20-2009 |
20130042472 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS - A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer. | 02-21-2013 |
Patent application number | Description | Published |
20110163823 | ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD - In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other. | 07-07-2011 |
20110186997 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed. | 08-04-2011 |
20120225521 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed. | 09-06-2012 |