Patent application number | Description | Published |
20130207514 | ELASTIC WAVE DEVICE - An elastic wave device includes a piezoelectric substrate and an interdigital transducer electrode. The piezoelectric substrate includes a principal surface with a groove tapered in lateral cross section. The interdigital transducer electrode is arranged on the principal surface such that at least one portion thereof is located in the groove. The interdigital transducer electrode is a laminate including a first conductive layer, a second conductive layer, and a diffusion-preventing layer located between the first conductive layer and the second conductive layer and made of an oxide or nitride of Ti or Cr. | 08-15-2013 |
20130207740 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other. | 08-15-2013 |
20130208398 | METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR - A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces. | 08-15-2013 |
20130208402 | Laminated Ceramic Capacitor and Manufacturing Method Therefor - A laminated ceramic capacitor that includes a laminated body including dielectric ceramic layers having crystal grains and crystal grain boundaries, and including internal electrode layers. An external electrode is formed on a surface of the laminated body, and is electrically connected to the internal electrode layers exposed at the surface of the laminated body. The laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, and further including Mn, Sr, and Si. When the laminated body is dissolved, the Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, and the molar ratio of Mn to Sr is 0.3 or more and 3.2 or less. | 08-15-2013 |
20130209323 | OZONE GENERATING ELEMENT AND METHOD FOR MANUFACTURING OZONE GENERATING ELEMENT - An ozone generating element includes a laminated body including stacked dielectric layers. A discharge electrode is provided on a first of the dielectric layers. An induction electrode is provided on a second of the dielectric layers that is opposed to the discharge electrode with the first dielectric layer interposed therebetween. A protective layer is arranged on the first dielectric layer so as to cover the discharge electrode, and includes a glass ceramic. | 08-15-2013 |
20130213699 | SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced. | 08-22-2013 |
20130214049 | WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE - A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna. | 08-22-2013 |
20130214640 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device having high heat radiation performance is provided. A surface acoustic wave device includes a piezoelectric substrate, IDT electrodes, a cover, and wiring lines. The IDT electrodes are arranged on a main surface of the piezoelectric substrate. The cover is joined to the main surface. The wiring lines extend to join portions of the main surface and the cover. The cover is provided with through-holes facing the wiring lines, respectively. The surface acoustic wave device further includes under-bump metals arranged in the through-holes, respectively, and bumps arranged on the under-bump metals, respectively. In a plan view, each of the under-bump metals is provided in a region larger than a joint portion of each of the under-bump metals and the corresponding one of the bumps | 08-22-2013 |
20130214873 | ELASTIC WAVE DEMULTIPLEXER - In an elastic wave demultiplexer having excellent isolation characteristics, a first ground wiring electrode is connected to a second ground wiring electrode, via first ground via-hole electrodes. The first ground wiring electrode is connected to ground land electrodes via second ground via-hole electrodes. The second ground wiring electrode is connected to a ground terminal via third ground via-hole electrodes. The number of the first ground via-hole electrodes is greater than the number of the second ground via-hole electrodes and the number of the third ground via-hole electrodes. | 08-22-2013 |
20130214880 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including a plurality of insulator layers laminated on each other in a lamination direction. A first strip line resonator is provided within a first region in the laminated body. A second strip line resonator is provided within a second region in the laminated body. A third strip line resonator is provided within the first region in the laminated body, and in a planar view in a lamination direction, the third strip line resonator and the first strip line resonator sandwich therebetween the second strip line resonator. A coupling conductor capacitively couples the first strip line resonator and the third strip line resonator. | 08-22-2013 |
20130214891 | CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated. | 08-22-2013 |
20130216909 | ELECTRODE ACTIVE MATERIAL AND SECONDARY BATTERY - An electrode active material is based on an organic compound containing in the structural unit thereof a pyrazine structure bound to cycloalkane. The electrode active material and a secondary battery containing it have large energy density, outputting high power, and having excellent cycle characteristics with little reduction in capacity even after repetition of charging and discharging. | 08-22-2013 |
20130220696 | CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF - The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz | 08-29-2013 |
20130221209 | METHOD OF MEASURING CHARACTERISTICS OF SPECIMEN, AND FLAT-PLATE PERIODIC STRUCTURE - The present invention provides a measuring method comprising the steps of holding a specimen on a flat-plate periodic structure, applying a linearly-polarized electromagnetic wave to the periodic structure, and measuring characteristics of the specimen based on change of the electromagnetic wave scattered forward or backward by the periodic structure, wherein the periodic structure is structured such that plural unit structures having the same shape are two-dimensionally and periodically interconnected in a direction of one reference plane, the unit structure has at least one aperture penetrating therethrough in a direction perpendicular to the reference plane, the electromagnetic wave is applied from a direction perpendicular to the reference plane, and the unit structure has a shape that is not mirror-symmetric with respect to an imaginary plane orthogonal to a polarizing direction of the electromagnetic wave. | 08-29-2013 |
20130221475 | SEMICONDUCTOR CERAMIC AND RESISTIVE ELEMENT - Provided is a resistive element which has excellent inrush current resistance, and can suppress heat generation in a steady state. The resistive element has an element main body of a semiconductor ceramic in which the main constituent has a structure of R1 | 08-29-2013 |
20130221584 | THERMISTOR AND METHOD FOR MANUFACTURING THE SAME - An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired. | 08-29-2013 |
20130222077 | ELASTIC WAVE FILTER DEVICE - An elastic wave filter device includes first and second signal terminals, an inductor, and a ladder elastic wave filter unit. The elastic wave filter device includes an elastic wave filter chip provided with the ladder elastic wave filter unit and a wiring board. The wiring board includes a plurality of dielectric layers and a plurality of electrode layers alternately laminated. An inductor electrode and a ground electrode are arranged so as to not face each other via the dielectric layer. | 08-29-2013 |
20130222105 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion. | 08-29-2013 |
20130222956 | ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREFOR - The ESD protection device includes: opposed electrodes | 08-29-2013 |
20130222968 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic that includes a sintered body of BaTiO | 08-29-2013 |
20130222971 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol, the Si content n meets 0.5≦n≦10 in terms of parts by mol, the Mn content u meets 0.5≦u≦10 in terms of parts by mol, and the Al content w meets 0.02≦w≦4 in terms of parts by mol, m and n satisfying −0.4≦100(m−1)−n≦3.9. | 08-29-2013 |
20130222972 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic capacitor with a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces. | 08-29-2013 |
20130222973 | Laminated Ceramic Electronic Component and Manufacturing Method Therefor - A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes. | 08-29-2013 |
20130223038 | MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE - A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate. | 08-29-2013 |
20130223120 | METHOD AND APPARATUS FOR ACTIVE INRUSH CONTROL OF BOOST POWER STAGE - A power stage includes an input voltage source; an inductor including first and second windings, where the first winding is connected to the input voltage source and where the second winding is magnetically coupled to the first winding; an output capacitor; a first diode connected to the first winding; a second diode connected between the second winding and the output capacitor; a boost switch connected to the first winding; and a control switch connected between the first diode and the output capacitor. The control switch is arranged to actively control inrush current during start-up of the power stage. A method of controlling inrush current of a boost power stage includes actively controlling the inrush current of the power stage by controlling a control switch through which the inrush current during start-up flows. | 08-29-2013 |
20130223637 | Piezoelectric Speaker Device - A piezoelectric speaker device that includes an insulation layer having an electric insulation property formed on a user-side driving electrode, and flaw detection electrode lines formed on the insulation layer. If the flaw detection electrode lines are determined to be damaged due to the occurrence of a flaw, the driving voltage applied to the driving electrodes is lowered. In order to prevent electric-shock accidents, the driving voltage is lowered to below 42.4 V, preferably, and to 0 V, more preferably. | 08-29-2013 |
20130278350 | COMPOSITE COMPONENT - A circuit substrate on which a duplexer is mounted includes a substrate body. First, second and third external electrodes are provided on a first main surface of the substrate body. Fourth, fifth and sixth external electrodes are provided on a second main surface of the substrate body. First, second and third signal paths connect the first, second and third external electrodes to the fourth, fifth and sixth external electrodes, respectively. First and second ground conductors are embedded in the substrate body, and overlap with a mounting area so as to contain the mounting area where the duplexer is mounted, in a planar view seen from the z-axis direction. The first, second and third signal paths extend from the inside of the mounting area to the outside of the mounting area between the first main surface and the second ground conductor. | 10-24-2013 |
20130307372 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, during an isolation formation step, a supporting substrate has a piezoelectric thin film formed on its front with a compressive stress film present on its back. The compressive stress film compresses the surface on a piezoelectric single crystal substrate side of the supporting substrate, and the piezoelectric thin film compresses the back of the supporting substrate, which is opposite to the surface on the piezoelectric single crystal substrate side. Thus, the compressive stress produced by the compressive stress film and that produced by the piezoelectric thin film are balanced in the supporting substrate, which causes the supporting substrate to be free of warpage and remain flat. A driving force that induces isolation in the isolation formation step is gasification of the implanted ionized element rather than the compressive stress to the isolation plane produced by the piezoelectric thin film. | 11-21-2013 |
20130340527 | ACCELERATION SENSOR - An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion. | 12-26-2013 |
20140000368 | DYNAMIC SENSOR | 01-02-2014 |
20140020729 | THERMOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING SAME, AND COMMUNICATION DEVICE - A thermoelectric conversion element includes a p-type metal thermoelectric conversion material containing a metal as its main constituent, an n-type oxide thermoelectric conversion material containing an oxide as its main constituent, and a composite oxide insulating material containing a composite oxide as its main constituent. The p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material are directly bonded in a region of a junction plane between the p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material, and the p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material are bonded to each other with the composite oxide insulating material interposed therebetween so as to define a pn conjunction pair in the other region of the junction plane. A perovskite-type oxide is used as the n-type oxide thermoelectric conversion material. | 01-23-2014 |
20140036467 | CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A ceramic multilayer substrate includes stacked ceramic layers; internal conductors which are stacked with one of the ceramic layers therebetween, and are arranged such that at least a portion of the internal conductors overlap each other in a stacking direction; and a constraining layer which is arranged on a layer different from layers on which the internal conductors are located. The constraining layer overlaps, in the stacking direction, an internal conductor-overlapping region where at least two of the internal conductors overlapping each other in the stacking direction, has a planar area not more than twice the planar area of the internal conductor-overlapping region, and contains an unsintered inorganic material powder. The constraining layer has a planar area not more than one-half the planar area of the ceramic layers. The constraining layer is arranged so as to entirely cover the internal conductor-overlapping region. | 02-06-2014 |
20140070394 | SEMICONDUCTOR DEVICE - In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate. | 03-13-2014 |
20140071011 | ANTENNA - An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor. | 03-13-2014 |
20140117810 | BOUNDARY ACOUSTIC WAVE DEVICE - A boundary acoustic wave device includes an LiTaO | 05-01-2014 |
20140130319 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, a compressive stress film is formed on a back surface of a piezoelectric single crystal substrate opposite to a surface on an ion-implanted side. The compressive stress film compresses the surface on the ion-implanted side of the piezoelectric single crystal substrate. The compressive stress produced by the compressive stress film is applied to half of the piezoelectric single crystal substrate on the ion-implanted side with respect to the center line of the thickness of the piezoelectric single crystal substrate to prevent the piezoelectric single crystal substrate from warping. A supporting substrate is then bonded to the surface of a bonding film on the flat piezoelectric single crystal substrate. The joined body of the piezoelectric single crystal substrate and the supporting substrate is then heated to initiate isolation at the ion-implanted portion as the isolation plane. | 05-15-2014 |
20140138804 | HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS - A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals. | 05-22-2014 |
20140142447 | DETECTION CIRCUIT - An amplifier circuit includes first and second amplification units. A first detection electrode and a high impedance circuit are connected to the input terminal of the first amplification unit. A second detection electrode and a high impedance circuit are connected to the input terminal of the second amplification unit. The output terminals of the first and second amplification units output first and second output signals, and are connected to the input terminals of a differential amplifier circuit through coupling capacitors, respectively. The differential amplifier circuit operates a difference between the first and second output signals in a state where a direct-current component is omitted. | 05-22-2014 |
20140145798 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including insulating layers that are stacked on each other. First and second LC parallel resonators each include via hole conductors extending in a z-axis direction and loop shaped conductive layers provided on the insulating layers. The first and second LC parallel resonators define a band pass filter. A first loop plane of the first LC parallel resonator and a second loop plane of the second LC parallel resonator are parallel or substantially parallel to the z-axis direction, are parallel or substantially parallel to each other, and are overlapped with each other at at least a portion of the first loop plane and the second loop plane in a plan view from the direction perpendicular or substantially perpendicular to the first loop plane. The first loop plane protrudes from the second loop plane at the positive direction in the z-axis direction. | 05-29-2014 |
20140152122 | WIRELESS POWER TRANSMISSION SYSTEM, POWER TRANSMITTING DEVICE, AND POWER RECEIVING DEVICE - In a power transmitting device constituting a wireless power transmission system, a voltage generating circuit applies a voltage between an active electrode and a passive electrode. In a power receiving device, a voltage generated between an active electrode that is opposed to the active electrode, and a passive electrode that is opposed to or brought into contact with the passive electrode when the power receiving device is placed on the power transmitting device is inputted to a load circuit as a power supply voltage. Passive electrodes of the power transmitting device are provided to electrostatically shield the opposed active electrodes with respect to the earth. Consequently, a wireless power transmission system, a power transmitting device, and a power receiving device are configured so the potential of the power transmitting device and the power receiving device during power transmission is stabilized to thereby prevent malfunction of the power receiving device. | 06-05-2014 |