Patent application number | Description | Published |
20130021116 | ELASTIC WAVE DEVICE - An elastic wave device includes a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a capacitive electrode that is located on the piezoelectric substrate and is connected in series with the IDT electrode. The capacitive electrode includes a plurality of capacitive electrode portions, each of which includes a pair of mutually interdigitated comb-shaped electrodes. The plurality of capacitive electrode portions are connected with each other in parallel. The plurality of capacitive electrode portions are arranged such that an intersecting width direction D | 01-24-2013 |
20130021976 | METHOD AND APPARATUS FOR ACCURATE TIME SYNCHRONIZATION IN WIRELESS COMMUNICATION SYSTEM - A method and apparatus for time synchronization and an OFDMA receiver thereof are provided. A preamble timing is obtained by a two-stage correlation in a time domain between a sequence of a received symbol and a reference preamble. The two-stage correlation is further simplified to perform a conjugate multiplication between a one-stage correlation and its correspondingly delayed result. A preamble boundary is adaptively determined by a peak value based on a result of the two-stage correlation. In this way, the time synchronization is achieved with a robust performance in a low SNR, high frequency offset or large delay spread fading channel. | 01-24-2013 |
20130021977 | METHOD AND APPARATUS FOR INTEGER FREQUENCY OFFSET ESTIMATION IN WIRELESS COMMUNICATION SYSTEM - A method and apparatus for performing time synchronization and an OFDMA receiver thereof are provided. The method preferably includes performing a differential phase correlation in a frequency domain based on one received sequence and one reference preamble and detecting an integer frequency offset based on a result of the differential phase correlation. The method and apparatus advantageously enable the use of one OFDM symbol to estimate ICFO and the use of a simple method to facilitate ICFO detection. Moreover, the performance of the integer frequency offset estimation becomes more robust in high noise and time-variant fading channels, with reduced hardware complexity. | 01-24-2013 |
20130025931 | Electronic Component and Method for Manufacturing the Same - An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members. | 01-31-2013 |
20130027175 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME - A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion. | 01-31-2013 |
20130038406 | CIRCUIT MODULE - A circuit module includes a duplexer and a circuit substrate. A first signal path connects a first external electrode to a second external electrode. A second signal path connects a third external electrode to a fourth external electrode. A third signal path connects a fifth external electrode to a sixth external electrode. A first ground path connects a seventh external electrode to an eighth external electrode. A second ground path is connected to a ninth external electrode and is capacitively coupled to the second signal path. | 02-14-2013 |
20130039516 | Sound Production Component - A sound production component that includes a vibration element, a support member, and a connection part. The vibration element includes a polygonal vibration plate and an electromechanical conversion element attached to the vibration plate. The connection part connects an entire periphery of the vibration plate to the support member. At least a portion of the connection part has a curved shape. The length of a portion of the connection part which connects each corner of the vibration plate and the support member is shorter than the length of a portion of the connection part which connects a central portion of each side edge of the vibration plate and the support member. | 02-14-2013 |
20130050957 | ELECTRONIC COMPONENT INCORPORATING BOARD AND COMPOSITE MODULE - An electronic component incorporating board that is less susceptible to a solder flash phenomenon therein even with application of heat, for example, when it is mounted to another substrate, includes a core substrate, electrodes located respectively on one principal surface and the other principal surface of the core substrate, an electronic component mounted to the electrodes that are located on the one principal surface of the core substrate, and a resin layer located on the one principal surface of the core substrate and covering the electronic component, wherein surfaces of the electrodes located on the one principal surface of the core substrate are not plated. | 02-28-2013 |
20130055817 | Operation-Position Detector and Application Thereof - An operation-position detector having a tube that allows an ultrasonic signal to propagate therethrough. The tube has a plurality of holes capable of being selectively closed or opened by an operation and is provided with an ultrasonic transmitter-receiver arranged at a first end thereof. A signal processor drives the ultrasonic transmitter-receiver and causes an ultrasonic signal to propagate through the inside of the tube, receives a reflection signal corresponding to a closed or open state of each of the holes, and detects the state of each hole on the basis of the reflection signal, thereby detecting the operation position of an operation conducted by an operator. | 03-07-2013 |
20130057113 | ELASTIC WAVE DEVICE - In an elastic wave device that significantly reduces and prevents deterioration of a frequency characteristic without roughening an undersurface of a piezoelectric substrate, a structure is bonded to a surface of a piezoelectric substrate other than a main surface of the piezoelectric substrate on which IDTs are located. The structure is provided so that a path difference is defined between a first component and a second component of a bulk wave that is excited by the IDT and propagates in the piezoelectric substrate toward the bonding surface. The first component of the bulk wave is reflected from the bonding surface. The second component of the bulk wave enters the structure from the bonding surface, propagates in the structure, enters the piezoelectric substrate from the bonding surface, and propagates in the same direction as that of the first component reflected from the bonding surface in the piezoelectric substrate. | 03-07-2013 |
20130057361 | SURFACE ACOUSTIC WAVE DEVICE AND PRODUCTION METHOD THEREFOR - A surface acoustic wave device includes a surface acoustic wave element including a plurality of electrode pads, and a mount substrate. The surface acoustic wave element is flip-chip mounted on a die-attach surface of the mount substrate by bumps made of Au. The mount substrate includes at least one resin layer including via-holes, a plurality of mount electrodes provided on the die-attach surface of the mount substrate, and via-hole conductors. The mount electrodes are bonded to the electrode pads via the bumps. The via-hole conductors are provided in the via-holes. At least one of each of the electrode pads and each of the mount electrodes includes a front layer made of Au. At least one of the via-hole conductors is located below the corresponding bump. | 03-07-2013 |
20130057499 | TOUCH PANEL, AND TOUCH-TYPE INPUT APPARATUS AND CONTROL METHOD THEREFOR - A touch panel capable of detecting a pen and a finger, capable of corresponding to multi-touch, capable of detecting pressing force, and capable of reducing the use amount of a transparent electrode as much as possible. The touch panel has a piezoelectric sheet of poly-L-lactic acid having a predetermined stretching axial direction, electrodes that are opposed to each other and formed on the piezoelectric sheet do not cover the entire surface of the piezoelectric sheet and are formed so that they are discretely distributed in plural positions. The piezoelectric sheet is brought into the condition that tension is imparted in directions not coincident with the stretching axial direction. | 03-07-2013 |
20130058055 | SUBSTRATE WITH BUILT-IN COMPONENT - A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component are to be built in. The substrate includes a component to be embedded in a resin layer, and a land electrode (a component mounting electrode) to which external electrodes of the component are to be bonded, the land electrode being provided with a concave groove extending in a transverse direction through which an uncured resin of the resin layer flows, and the uncured resin of the resin layer flows through the concave groove and sufficiently goes around a lower side of the component so that the resin is well filled in when the component in a mounting state is to be embedded in the resin layer. | 03-07-2013 |
20130062524 | METHOD OF MEASURING CHARACTERISTICS OF SPECIMEN, AND APERTURE ARRAY STRUCTURE AND MEASURING DEVICE USED IN SAME - A method of measuring characteristics of a specimen by holding the specimen on an aperture array structure, which is formed of a flat plate and which includes at least two apertures penetrating therethrough in a direction perpendicular to a principal surface thereof; applying a linearly-polarized electromagnetic wave to the aperture array structure on which the specimen is held; and detecting a frequency characteristic of the electromagnetic wave having transmitted through the aperture array structure. The aperture array structure has a lattice structure in which the apertures are periodically arrayed at least in one direction in the principal surface of the aperture array structure, and a ratio (s/A) of a lattice spacing (s) of the aperture array structure to a thickness (A) of the specimen is 100 or less. | 03-14-2013 |
20130069036 | LIGHT-EMITTING ELEMENT, METHOD OF PRODUCING LIGHT-EMITTING ELEMENT, AND DISPLAY DEVICE - A light-emitting element where a positive electrode is formed on the surface of a transparent substrate; a hole transport layer is formed on the surface of the positive electrode; and a light-emitting layer made of quantum dots is formed on the surface of the hole transport layer. The light-emitting layer has a light-emitting region that emits light of a first predetermined wavelength in which a surfactant is present on the surface of the quantum dots and a non-light-emitting region that does not emit light in which a surfactant is absent on the surface of the quantum dots. A second light-emitting layer that emits light of a second predetermined wavelength is formed on the surface of the light-emitting layer, and a negative electrode is formed on the surface of the second light-emitting layer. | 03-21-2013 |
20130069481 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device includes a piezoelectric substrate including a groove located in a surface thereof, an IDT electrode, and a dielectric film. The IDT electrode includes a first electrode layer located in the groove and a second electrode layer located outside the groove. The dielectric film is arranged on the piezoelectric substrate so as to cover the IDT electrode. The second electrode layer is tapered toward a side opposite to the piezoelectric substrate. | 03-21-2013 |
20130069490 | Piezoelectric Actuator And Drive Device - A piezoelectric actuator that includes a piezoelectric substrate, first and second electrodes, and a conductive layer. The first and second electrodes are configured to apply a voltage to the piezoelectric substrate. The conductive layer is formed on the first electrode. The conductive layer is made of a metal or an alloy different in color from the second electrode. | 03-21-2013 |
20130069742 | DUAL-BAND SURFACE ACOUSTIC WAVE FILTER AND COMPOSITE HIGH-FREQUENCY COMPONENT - A dual-band surface acoustic wave filter is mounted on a circuit board together with a high-frequency switch, constitutes a composite high-frequency component together with the high-frequency switch, and significantly reduces and prevents deterioration of filter characteristics of the composite high-frequency component. A first input terminal is located on a first corner portion of a second principal surface of a wiring board. A second input terminal is located on the second principal surface of the wiring board and along a first long side or a first short side so as to be next to the first input terminal. First and second output terminals are arranged on an edge portion of the second principal surface of the wiring board on a second long side and along the second long side. | 03-21-2013 |
20130071770 | HIGH-TEMPERATURE STRUCTURAL MATERIAL, STRUCTURAL BODY FOR SOLID ELECTROLYTE FUEL CELL, AND SOLID ELECTROLYTE FUEL CELL - A high-temperature structural material which not only has a coefficient of thermal expansion close to the coefficient of thermal expansion of an electrolyte material, but also undergoes no decrease in mechanical strength even in a reducing atmosphere, and can be sintered at relatively low temperatures just by adding a predetermined sintering aid, a structural body for a solid electrolyte fuel cell, which is formed with the use of the high-temperature structural material, and a solid electrolyte fuel cell including the structural body. The high-temperature structural material contains strontium titanate and aluminum, wherein the aluminum is in an amount of 10 parts by mol or more and 60 parts by mol or less with respect to 100 parts by mol of the strontium titanate. | 03-21-2013 |
20130076203 | CERAMIC BODY AND METHOD FOR PRODUCING THE SAME - A ceramic body including therein conductors more effectively prevents ingress of moisture into voids between the conductors and the ceramic body. A supercritical fluid containing a monomer flows in the voids between internal electrode layers and a ceramic laminated body. Then, the voids between the internal electrode layers and the ceramic laminated body are filled with a polymer by the polymerization of the monomer. | 03-28-2013 |
20130077199 | ESD PROTECTION DEVICE - A highly reliable ESD protection device that prevents failure of discharge and variation of a discharge start voltage even when protection from static electricity is repeatedly performed includes a cavity provided in a ceramic multilayer substrate. First and second discharge electrodes are provided in the ceramic multilayer substrate and face each other across a gap. A tip of the first discharge electrode and a tip of the second discharge electrode are positioned at edges of the cavity or at positions receded from the edges. | 03-28-2013 |
20130077262 | MODULE BOARD AND MANUFACTURING METHOD THEREOF - In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin. | 03-28-2013 |
20130083439 | HIGH-FREQUENCY MODULE - A high-frequency module includes an inductor and an ESD protection element. The inductor is a circuit element defining a low pass filter, and includes parasitic capacitance between a signal line and a ground in a specific frequency band. The ESD protection element transfers a surge current flowing through a signal line to the ground, includes a capacitor in a specific frequency band, and has a configuration in which the capacitor and the parasitic capacitance of the inductor are connected in parallel. | 04-04-2013 |
20130083502 | PACKAGE SUBSTRATE - A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface. | 04-04-2013 |
20130087625 | WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE - A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna. | 04-11-2013 |
20130087626 | WIRELESS COMMUNICATION DEVICE AND METAL ARTICLE - A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal. | 04-11-2013 |
20130088121 | BOUNDARY ACOUSTIC WAVE DEVICE - Regarding a boundary acoustic wave device in which at least a part of an IDT electrode is embedded in a groove disposed in a piezoelectric substrate, the acoustic velocity is increased. A boundary acoustic wave device is provided with a piezoelectric substrate, a first dielectric layer, and an IDT electrode. The surface of the piezoelectric substrate is provided with a groove. The IDT electrode is disposed at the boundary between the piezoelectric substrate and the first dielectric layer in such a way that at least a part thereof is located in the groove. In the inside of the groove, the groove angle γ, which is the size of an angle formed by an upper end portion of the inside surface of the groove with the surface of the piezoelectric substrate, is less than 90 degrees. | 04-11-2013 |
20130088305 | LADDER ACOUSTIC WAVE FILTER DEVICE AND BRANCHING FILTER - A ladder acoustic wave filter device is constructed such that ripples in the pass band are suppressed, and insertion loss is small in both of a high frequency side portion and a low frequency side portion of the pass band. Apodization weighting is applied to a series-arm-side IDT electrode. Busbars of the series-arm-side IDT electrode are configured so that in an acoustic wave propagation direction, a distance in an overlap width direction between the busbars becomes shorter as the overlap width of electrode fingers becomes smaller. Each of a pair of comb-shaped electrodes of a parallel-arm-side IDT electrode further includes a plurality of dummy electrodes that extend from a busbar and are opposed to electrode fingers of the other comb-shaped electrode in the overlap width direction. The parallel-arm-side IDT electrode is a normal IDT electrode in which the overlap width is constant. | 04-11-2013 |
20130088811 | Thin-Film Capacitor - A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part. | 04-11-2013 |
20130088896 | SWITCHING CONTROL CIRCUIT AND SWITCHING POWER SUPPLY APPARATUS - In a switching control circuit, a length of a soft start period is set by a time constant of an external circuit that is connected to a soft start terminal of a switching control IC. After a voltage of the soft start terminal has reached a predetermined voltage at the termination of the soft start period, the on-pulse period of a first switching device is limited by a maximum value. When a Zener diode is connected between the soft start terminal and ground, the upper limit voltage of the soft start terminal is a Zener voltage and, hence, the maximum on-pulse period is limited by this voltage. As a result, the switching control circuit and a switching power supply apparatus, which have a soft start function and a power limiting function, are reduced in size and cost by limiting the number of terminals. | 04-11-2013 |
20130092933 | ULTRAVIOLET SENSOR AND METHOD FOR MANUFACTURING THE SAME - An ultraviolet sensor has a p-type semiconductor layer composed of a solid solution of NiO and ZnO, and an n-type semiconductor layer composed of ZnO and joined to the p-type semiconductor layer such that a part of the surface of the p-type semiconductor layer is exposed. In the p-type semiconductor layer, trivalent Ni is contained in a crystal grain in a state of being solid-solved with the solid solution of NiO and ZnO. The trivalent Ni can be contained in the crystal grain of the p-type semiconductor layer by adding NiOOH to NiO and ZnO, and firing the resulting mixture. Thereby, an inexpensive ultraviolet sensor capable of being downsized, which can easily detect the intensity of ultraviolet light by a photovoltaic power without utilizing a peripheral circuit can be realized. | 04-18-2013 |
20130093536 | MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ELECTRONIC COMPONENT MANUFACTURING METHOD - A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance. | 04-18-2013 |
20130094163 | Surface Mount Electronic Component - A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of the case. The metal plate seals the through hole. The metal plate has a coefficient of linear expansion that is different from a coefficient of linear expansion of the case so that deformation to unseal the through hole occurs when heated. | 04-18-2013 |
20130099353 | ESD PROTECTION DEVICE - An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes. | 04-25-2013 |
20130099994 | ANTENNA APPARATUS AND COMMUNICATION TERMINAL INSTRUMENT - In an antenna apparatus, a first current is induced in a first booster conductor by a current flowing through a coil conductor of a power feed antenna, and the first current circulates along a circumference of the first booster conductor. A second current is induced in a second booster conductor by the current flowing through the coil conductor of the power feed antenna, and the second current circulates along a circumference of the second booster conductor. A third current is induced in the first booster conductor by the second current flowing through the second booster conductor, and the third current circulates along the circumference of the first booster conductor. Thus, the antenna apparatus is much less influenced by nearby metallic objects and a shape of an included radiation plate may be more freely determined without requiring a highly accurate positional relationship between the radiation plate and the coil conductor. | 04-25-2013 |
20130112466 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component in which a direction identification mark can be easily formed includes a laminate including a plurality of laminated insulating material layers and a mounting surface parallel or substantially parallel to a z-axis direction. A directional coupler including a main line and a sub-line is included in the laminate. A direction identification mark is provided on an upper surface of the laminate which is parallel or substantially parallel to the mounting surface, and is defined by a via-hole conductor portion, which is obtained by filling a via hole provided in the insulating material layers with a conductor, being exposed from the upper surface. | 05-09-2013 |
20130112754 | READER/WRITER ANTENNA MODULE AND ANTENNA DEVICE - A reader/writer antenna module includes a flexible substrate that includes a first base portion, a second base portion and a bending portion that connects the first base portion and the second base portion to each other. The flexible substrate has a structure that is folded by utilizing the flexibility of the bending portion such that a first main surface of the first base portion and a first main surface of the second base portion face each other, and a magnetic layer is provided between an antenna conductor and the chip component in the folded structure. | 05-09-2013 |
20130113560 | POWER AMPLIFYING CIRCUIT AND HIGH-FREQUENCY MODULE - A high-frequency module including a power amplifying circuit includes a high-frequency power amplifying element, a matching circuit, and a driving power-supply circuit. The high-frequency power amplifying element includes a high-frequency amplifying circuit and a directional coupler. A first end of a main line of the directional coupler is connected to an output terminal of a latter-stage amplifying circuit of the high-frequency amplifying circuit. A second end of the main line of the directional coupler is connected through an output matching circuit to a high-frequency signal output terminal of the high-frequency power amplifying element. The output terminal of the latter-stage amplifying circuit is also connected to a second driving power-supply voltage application terminal of the high-frequency power amplifying element. The second driving power-supply voltage application terminal is connected to the high-frequency signal output terminal by a connecting conductor. | 05-09-2013 |
20130115810 | COAXIAL CONNECTOR PLUG - An outer conductor has a substantially cylindrical shape extending in an axial direction. A center conductor has a substantially cylindrical shape extending in the axial direction, and is provided inside the outer conductor. An insulator fixes the center conductor relative to the outer conductor. The center conductor is provided with a hole that communicates with the inside and the outside of the center conductor. The insulator extends, via the hole, to the inside of the center conductor from the outside. | 05-09-2013 |
20130119953 | DC-DC CONVERTER - A DC-DC converter operates as a step-down chopper using a main switch element, a sub switch element, an inductor and a capacitor. A sub switch control signal generating circuit discharges a capacitor with a voltage that is proportional to a difference between a voltage of a power supply input unit and a voltage of a power supply output unit when a PGATE signal is at an “L” level, and charges the capacitor with a voltage that is proportional to the voltage of the power supply output unit when an NGATE signal is at an “H” level. The sub switch element is forcibly turned off and reverse flow of an inductor current is prevented even at the time of a light load as a result of the voltage of the capacitor being generated as an NCTL signal. Thus, reverse flow of an inductor current is prevented and a high-efficiency DC-DC converter is provided without the use of a high-speed comparator or any other kind of comparator. | 05-16-2013 |
20130120076 | DIRECTIONAL COUPLER - In a directional coupler, a laminated body includes a plurality of insulator layers that are laminated to one another. A main line and a sub-line are embedded in the laminated body, include spiral-shaped portions including central axes parallel or substantially parallel to a z-axis direction, and are electromagnetically coupled to each other. The main line and the sub-line have the same or substantially the same shape and are provided within regions coinciding or substantially coinciding with each other in a y-axis direction. | 05-16-2013 |
20130122347 | POWER STORAGE DEVICE AND MANUFACTURING METHOD THEREFOR - A power storage device having: a laminated body formed by providing a separator layer between a first electrode which is one of a cathode and an anode and a second electrode which is the other electrode; an electrolyte; and a package which houses the laminated body and the electrolyte. At least two first electrode composite sheets are included which are each obtained by integrating a first collector electrode, a first electrode active material layer provided on one principal surface of the first collector electrode, and a separator layer covering at least part of the one principal surface, and the other principal surface of the first collector electrode of one first electrode composite sheet out of the at least two first electrode composite sheets is opposed to, and bonded to, the other principal surface of the first collector electrode of the other first electrode composite sheet. | 05-16-2013 |
20130127293 | METHOD FOR PRODUCING PIEZOELECTRIC THIN-FILM ELEMENT, PIEZOELECTRIC THIN-FILM ELEMENT, AND MEMBER FOR PIEZOELECTRIC THIN-FILM ELEMENT - Provided is a method for producing a piezoelectric thin-film element including a piezoelectric thin-film layer having good surface morphology and high crystallinity. The method includes forming a lower electrode layer on a substrate; forming a piezoelectric thin-film buffer layer on the lower electrode layer at a relatively low film-formation temperature; forming a piezoelectric thin-film layer on the piezoelectric thin-film buffer layer at a film-formation temperature that is higher than the film-formation temperature for the piezoelectric thin-film buffer layer; and forming an upper electrode layer on the piezoelectric thin-film layer. | 05-23-2013 |
20130127300 | PIEZOELECTRIC THIN-FILM RESONATOR AND METHOD FOR PRODUCING PIEZOELECTRIC THIN FILM - A piezoelectric thin-film resonator includes a piezoelectric thin film which includes aluminum nitride containing Sc and which has a concentration distribution such that the concentration of Sc is non-uniform in a thickness direction of the piezoelectric thin film; a first electrode; a second electrode facing the first electrode across the piezoelectric thin film; and a substrate supporting a piezoelectric vibrating section defined by the piezoelectric thin film and the first and second electrodes. | 05-23-2013 |
20130127560 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE - Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈ | 05-23-2013 |
20130127573 | COMMUNICATION TERMINAL APPARATUS AND ANTENNA DEVICE - An antenna device which includes a coil conductor and a booster conductor. The coil conductor is defined by wound loop-shaped conductors and includes a first opening at a winding center and two ends connected to a feeding circuit. The booster conductor includes a coupling conductor portion and a frame-shaped radiation conductor portion. The coupling conductor portion includes a second opening overlapped at least partially by the first opening, is split in a portion thereof by a slit, and is electromagnetically coupled to the coil conductor. The frame-shaped radiation conductor portion includes a third opening and is connected to the coupling conductor portion. | 05-23-2013 |
20130128623 | SWITCHING CONTROL CIRCUIT AND SWITCHING POWER SUPPLY APPARATUS - An external circuit is connected to a polarity detection terminal of a switching control IC. An increased value of the voltage of a pulse signal input to the polarity detection terminal at the time of the activation of a power supply changes in response to this external circuit. Accordingly, owing to the external circuit connected to the polarity detection terminal, the validity/invalidity of a standby mode is set. When the standby mode is validated, a blanking frequency changes in response to the voltage of a feedback terminal, and a switching loss in a light load is reduced. Accordingly, a switching control circuit and a switching power supply apparatus are configured that are able to set the validity/invalidity of the standby mode or select the method of the standby mode without using a dedicated terminal. | 05-23-2013 |
20130132922 | CAPACITOR ARRANGEMENT ASSISTING METHOD AND CAPACITOR ARRANGEMENT ASSISTING DEVICE - A capacitor arrangement assisting method wherein data entered by a user, such as the width w of a power supply wiring, the thickness h of a dielectric between the power supply wiring and a ground plane, the ESL | 05-23-2013 |
20130134228 | ELECTROMAGNETIC-COUPLING-MODULE-ATTACHED ARTICLE - An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling. | 05-30-2013 |
20130140362 | ELECTRICAL PRODUCT - A wireless IC device processing a high-frequency signal is arranged in an electrical product main body, and an input-output terminal of the wireless IC device is coupled to at least a portion of a power cable externally extending from the electrical product main body | 06-06-2013 |
20130140369 | WIRELESS IC DEVICE - A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors. | 06-06-2013 |
20130140956 | Ultrasonic Generator - An ultrasonic generator that includes an ultrasonic generating element and a first acoustic path. The ultrasonic generating element includes a frame including a through hole in its central portion, a first transducer being flat-shaped and bonded to a first principal surface of the frame, and a second transducer being flat-shaped and bonded to a second principal surface of the frame and is configured to generate ultrasonic waves in a buckling tuning-fork vibration mode where the first transducer and the second transducer vibrate in mutually opposite phases. The first acoustic path is disposed so as to be adjacent to at least one of both principal surfaces of the ultrasonic generating element and configured to compress the ultrasonic waves generated from the ultrasonic generating element and to allow the ultrasonic waves to propagate therethrough in a direction along the principal surface of the ultrasonic generating element. | 06-06-2013 |
20130141180 | HIGH-FREQUENCY MODULE - A high-frequency module has a structure including balanced terminals, with high design flexibility and good transmission characteristics. Wiring patterns to be connected to balanced terminals of SAW filters of SAW duplexers are located on a second layer to a sixth layer of a layered body. The characteristic impedances of first wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of second wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of third wiring patterns defining a pair of parallel or substantially parallel lines match, and the characteristic impedances of fourth wiring patterns defining a pair of parallel or substantially parallel lines match. | 06-06-2013 |
20130141184 | DIRECTIONAL COUPLER - In a directional coupler, sub-lines or main lines are electromagnetically coupled to each other to degrade isolation characteristics. A capacitor is located between the sub-lines or between the main lines to cause the isolation characteristics to have poles in order to improve the isolation characteristics of the directional coupler. | 06-06-2013 |
20130141836 | METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO | 06-06-2013 |
20130141838 | DIELECTRIC CERAMIC, LAMINATED CERAMIC CAPACITOR, METHOD FOR PRODUCING THE DIELECTRIC CERAMIC, AND METHOD FOR MANUFACTURING THE MULTILAYER CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor which produces excellent lifetime characteristics in a high-temperature loading test even when dielectric layers are reduced in thickness. The dielectric ceramic contains, as its main constituent, a compound represented by the general formula (Ba | 06-06-2013 |
20130146807 | ELECTRODE ACTIVE MATERIAL AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY HAVING THE SAME - An electrode active material that contains a lithium-nickel-manganese-cobalt composite oxide having a hexagonal, layered rock-salt type crystal structure that belongs to the space group R3m. The lithium-nickel-manganese-cobalt composite oxide is represented by the general formula Li | 06-13-2013 |
20130147574 | NON-RECIPROCAL CIRCUIT ELEMENT - In a non-reciprocal circuit element, a first center electrode and a second center electrode are disposed in a ferrite so as to intersect with each other in an insulated state. The ferrite receives a direct-current magnetic field from a permanent magnet. One end of the first center electrode is connected to a first port, the other end thereof is connected to a second port, one end of the second center electrode is connected to the second port, and the other end thereof is connected to a third port. Between the first and second ports, a terminating resistor and a capacitance-variable capacitor are connected in parallel to the first center electrode. By changing the capacitance value of the capacitor, the isolation frequency is adjusted. | 06-13-2013 |
20130147581 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS - An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack. | 06-13-2013 |
20130147670 | COMMUNICATION TERMINAL DEVICE - An RFID antenna is arranged in the vicinity of a metal portion of and on an outer surface side of a casing of a communication terminal device. The RFID antenna includes a magnetic core, and a coil conductor that is wound around the magnetic core. The coil conductor includes a first conductor portion positioned on a first main surface side of the magnetic core and a second conductor portion positioned on the second main surface side of the magnetic core and arranged at a different position than the first conductor portion when viewed in plan from the direction of the first and second main surfaces, and the coil conductor is arranged such that the first main surface side of the magnetic core is on the metal portion side and such that the first conductor portion of the coil conductor faces a leading end portion of the casing. | 06-13-2013 |
20130147675 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device includes an antenna coil including a first conductive pattern disposed on a first major surface of a magnetic sheet, a second conductive pattern disposed on a first major surface of a non-magnetic sheet, and an interlayer conductor connecting the first conductive pattern and second conductive pattern. The antenna coil including the first conductive pattern and second conductive pattern defines a spiral or substantially spiral pattern. The antenna device is a resin multilayer structure in which its base body is a laminate of the magnetic layer and non-magnetic layer and the predetermined patterns are disposed inside and outside the laminate. | 06-13-2013 |
20130147678 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE - A high-frequency module includes first and second demultiplexers and a band elimination filter. The first and second demultiplexers include common terminals, transmission filters, and reception filters, respectively. In the band elimination filter, a demultiplexer-side terminal is connected to the common terminal of the first demultiplexer. The band elimination filter includes a first pass band, and a second pass band and a stop band that are located adjacent to each other within the first pass band. The band elimination filter is configured so that the second pass band includes the pass band of each of the transmission filter and the reception filter in the first demultiplexer and the stop band includes the pass band of the transmission filter in the second demultiplexer. | 06-13-2013 |
20130148244 | ESD PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity | 06-13-2013 |
20130148256 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers, and an external electrode located on an outer surface of the laminated body. In the laminated ceramic electronic component, the ceramic layers have a composition including a main constituent of a barium titanate-based compound and Bi | 06-13-2013 |
20130149592 | Layered Solid-State Battery - A layered solid-state battery that includes a first unit cell, a second unit cell, and an internal collection layer that is disposed to intervene between the unit cells. Each of the unit cells includes a positive electrode layer, a solid electrolyte layer, and a negative electrode layer that are sequentially stacked. The internal collection layer has one side surface that is in contact with the positive electrode layer of the first unit cell and the other side surface that is in contact with the negative electrode layer of the second unit cell. Also, the internal collection layer contains an electron conductive material and an ion-conductively insulating specific conductive material. | 06-13-2013 |
20130149593 | LAYERED SOLID-STATE BATTERY - A layered solid-state battery that includes a first unit cell, a second unit cell, and an internal collection layer that is disposed to intervene between the first unit cell and the second unit cell. Each of the unit cells is constituted of a positive electrode layer, a solid electrolyte layer, and a negative electrode layer that are sequentially stacked. The internal collection layer is disposed to be in contact with each of the negative electrode layers of the unit cells. Also, the internal collection layer contains an electron conductive material and an ion-conductively electrically conductive specific conductive material. | 06-13-2013 |
20130152351 | METHOD AND APPARATUS FOR PRODUCING A CERAMIC ELECTRONIC COMPONENT - A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer. | 06-20-2013 |
20130153132 | EXPANDING DEVICE AND METHOD FOR MANUFACTURING COMPONENTS - In an expanding device that can more effectively expand an adhesive tape in its wafer-attached region and can pick up components on the adhesive tape with high accuracy, a central first portion of an adhesive tape, including a portion with a wafer attached thereto, is laid on a top surface of a heating table, a non-heated ring is disposed to surround an outer peripheral edge of the heating table, a heat insulation is laid on an upper surface of the non-heated ring, a second portion of the adhesive tape located outwardly of the first portion thereof is located on or above the insulation, a third portion of the adhesive tape located outwardly of the second portion is held by a holder, and the holder is movable up and down relative to the heating table and the non-heated ring by a drive unit. | 06-20-2013 |
20130154388 | ANTENNA DEVICE AND MOBILE COMMUNICATION TERMINAL - An antenna device includes a feeding member including a coil pattern and an emitting member to emit a transmit signal supplied from the feeding member and to receive a receive signal and supplying it to the feeding member. The emitting member includes an opening portion and a slit portion communicating with the opening portion. When seen in plan view from the direction of the winding axis of the coil pattern, the opening portion of the emitting member and the inner region of the coil pattern overlap each other, and the emitting member and the coil pattern overlap each other at least partially. | 06-20-2013 |
20130154757 | COMPOSITE ELECTRONIC MODULE - In a composite electronic module, electronic components including magnetic substances are mounted on a substrate such that lines of magnetic force generated by a permanent magnet of a non-reciprocal circuit element are concentrated to the non-reciprocal circuit element side. Therefore, even when a metal yoke is omitted, for example, it is possible to reduce the number of lines of magnetic force generated by the permanent magnet and which leak to the outside of the substrate, and hence to significantly reduce and prevent the influence of a magnetic field generated by the permanent magnet upon other electronic components that are arranged near or adjacent to the composite electronic module around the substrate. | 06-20-2013 |
20130154763 | ELASTIC WAVE BRANCHING FILTER - An elastic wave surface acoustic wave duplexer includes an antenna terminal, a transmission filter, a reception filter, and a plurality of elastic wave resonators connected in series between the antenna terminal and the reception filter. The reception filter is a longitudinally coupled resonator-type surface acoustic wave filter including a plurality of IDT electrodes and arranged along a propagation direction of elastic wave. A combined capacitance of the plurality of surface acoustic wave resonators is smaller than a capacitance of the IDT electrodes and included in the plurality of IDT electrodes and connected to the antenna terminal. | 06-20-2013 |
20130154768 | LAMINATED BALANCED FILTER - A laminated balanced filter includes one unbalanced terminal, two balanced terminals, a ground terminal, an unbalanced-side LC parallel resonator, an intermediate LC parallel resonator, and a balanced-side inductor. The inductor electrode pattern of the balanced-side inductor includes a first portion extending from one end portion to a connection portion and a second portion extending from the other end portion to the connection portion. A direction of a current flowing through the first portion is opposite to a direction of a current flowing through the inductor electrode pattern of the intermediate LC parallel resonator. A direction of a current flowing through the second portion of the balanced-side inductor is the same as a direction of a current flowing through the inductor electrode pattern of the intermediate LC parallel resonator. The laminated balanced filter further includes a coupling capacitor connected between a balanced terminal connected to the first portion and an unbalanced terminal. | 06-20-2013 |
20130154769 | BAND-PASS FILTER - A capacitor of a certain LC resonator, among multiple LC resonators in a band-pass filter, is arranged at a side of one main surface in a stacking direction of a multilayer body of the band-pass filter and the capacitors of the remaining LC resonators are arranged at a side of the other main surface in the stacking direction of the multilayer body. One of a pair of capacitor electrodes of the capacitor of the certain LC resonator is grounded. The one capacitor electrode that is grounded covers at least the plurality of LC resonators, as viewed from the stacking direction of the multilayer body. | 06-20-2013 |
20130154783 | HIGH-FREQUENCY TRANSFORMER, HIGH-FREQUENCY COMPONENT, AND COMMUNICATION TERMINAL DEVICE - In a high frequency transformer, when a current flows between input-output ports, a magnetic flux produced by first and third coil conductor patterns of a primary coil is interlinked with a second coil conductor pattern of a secondary coil. A magnetic flux produced by the second coil conductor pattern of the primary coil is interlinked with the first and third coil conductor patterns of the secondary coil. The coil conductor patterns are wound so that when a current flows through a transformer, the directions of magnetic fields occurring within the first and third coil conductor patterns of the primary coil and the second coil conductor pattern of the secondary coil are the same and the directions of magnetic fields occurring within the first and third coil conductor patterns of the secondary coil and the second coil conductor pattern of the primary coil are the same. | 06-20-2013 |
20130154785 | LAMINATED TYPE INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR - In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state. | 06-20-2013 |
20130155639 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a substrate, first electronic components mounted on a first principle surface of the substrate, a first resin layer that covers the first principal surface of the substrate and the first electronic components, a second electronic component mounted on a second principle surface of the substrate, a second resin layer that covers the second principal surface of the substrate and the second electronic component, an electrically conductive shield layer, and a ground electrode arranged in the substrate so as to reach a side surface of the substrate. The shield layer is a single continuous layer that covers the first resin layer, the side surface of the substrate, and a portion of the second resin layer adjacent to the substrate. The shield layer is in contact with and electrically connected to the ground electrode. | 06-20-2013 |
20130157134 | METHOD OF PRODUCING IRON PHOSPHATE, LITHIUM IRON PHOSPHATE, ELECTRODE ACTIVE SUBSTANCE, AND SECONDARY BATTERY - A mixed aqueous solution is prepared in which a phosphorus source, a divalent Fe compound, and an oxidant are mixed at a predetermined ratio. Then, this mixed aqueous solution is dropwise added into a buffer solution having a pH value of 1.5 to 9, thereby to produce a precipitated powder of FePO | 06-20-2013 |
20130161613 | Ultraviolet Sensor and Method for Manufacturing the Same - An ultraviolet sensor that includes a p-type semiconductor layer principally composed of (Ni, Zn)O, an n-type semiconductor layer composed of ZnO which is joined to the p-type semiconductor layer, an internal electrode embedded in the p-type semiconductor layer, and first and second terminal electrodes formed at both ends of the p-type semiconductor layer. The surface roughness of the p-type semiconductor layer is 1.5 μm or less, and preferably 0.3 μm or more and 1.0 μm or less. In a manufacturing process, the formed product prior to firing and/or the p-type semiconductor layer after firing is polished by barrel polishing so that the surface roughness Ra thereof is 1.0 μm or less. Thereby, light absorption efficiency can be improved to directly detect a desired large photocurrent and secure high reliability, and a spectral property can be controlled to strongly respond to various wavelength bands of ultraviolet light. | 06-27-2013 |
20130162372 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes at least two types of stacked ceramic layers having different dielectric constants and also includes internal electrodes partially disposed along boundaries between the ceramic layers having different dielectric constants. The internal electrodes include an additive component common to a component included in at least one of the ceramic layers adjacent to each other with the internal electrodes placed therebetween. | 06-27-2013 |
20130163130 | ESD PROTECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - An ESD protection device includes an alumina multilayer substrate, a hollow portion, a discharge electrode pair, discharge-assisting electrodes, and a vitreous substance. The hollow portion is disposed inside of the alumina multilayer substrate. The electrodes of the discharge electrode pair are disposed opposite to each other at an interface between the hollow portion and the alumina multilayer substrate. The discharge-assisting electrodes are disposed dispersedly between the opposite electrodes of the discharge electrode pair. The vitreous substance covers the discharge-assisting electrodes in the inside of the hollow portion. A trial discharge is executed so as to induce creepage discharge between the electrodes of the discharge electrode pair in advance. | 06-27-2013 |
20130163144 | LAMINATED CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor which can suppress degradation of the insulation resistance due to the addition of vanadium. Second insulating layers are stacked on both sides in the stacking direction of a first insulating layer group, which has first insulating layers stacked over one another, and internal electrodes are placed on principal surfaces of the first insulating layers. At least one internal electrode is placed between the first and second insulating layers. Both contain, as their main constituent, a perovskite-type compound represented by the formula “ABO | 06-27-2013 |
20130164533 | PIEZOELECTRIC CERAMIC AND METHOD OF MANUFACTURING THE SAME - A piezoelectric ceramic having excellent electrical characteristics, and in which all of three crystallographic axes are oriented is obtained by slip cast or sheet forming a ceramic slurry containing plate-shaped ceramic particles in magnetic field. The degree of orientation of a first axis (for example, a c axis) calculated with the Lotgering method based on an X-ray diffraction (XRD) pattern in a prescribed cross-section of this piezoelectric ceramic is not less than 0.30. With a cross-section where the degree of orientation of the first axis indicates a maximum value being defined as a reference plane, the degree of orientation of a second axis (for example, an a axis) calculated with the Lotgering method based on an X-ray diffraction pattern in a cross-section orthogonal to this reference plane is not less than 0.20. The degree of orientation of the second axis is represented by a value in such a cross-section that the degree of orientation of the second axis attains to a maximum value, among cross-sections orthogonal to the reference plane. | 06-27-2013 |
20130168837 | ESD PROTECTION DEVICE - An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer located on the top surface of the semiconductor substrate. An ESD protection circuit is provided in the top layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post-shaped electrodes. First ends of the interlayer wiring lines provided in the thickness direction are connected to the input/output electrodes provided on the top surface of the semiconductor substrate and the second ends are connected to first ends of the in-plane wiring lines extending in the plane direction. The distance between the centers of the first and second post-shaped electrodes is larger than the distance between the centers of the first and second input/output electrodes. | 07-04-2013 |
20130171537 | FORWARD CHECK VALVE AND FUEL CELL SYSTEM - A forward check valve and a fuel cell system in which fluid control is performed with increased reliability when a highly active fluid is used are structured such that when an edge portion of a cap is joined to an edge portion of a valve housing, a peripheral edge portion of a diaphragm is pushed and sandwiched by a peripheral edge portion of the cap and a placement portion. Further, the diaphragm is formed of rubber. As a result, the peripheral edge portion of the diaphragm is compressed by the peripheral edge portion of the cap and the placement portion, so that the degree of contact at a contact portion between the placement portion and the peripheral edge portion of the diaphragm becomes very high. Consequently, in the forward check valve, joints of the members including a joint of the edge portion of the cap and the edge portion of the valve housing do not contact methanol. | 07-04-2013 |
20130175176 | FLAT Ni PARTICLE, LAMINATED CERAMIC ELECTRONIC COMPONENT USING FLAT Ni PARTICLE, AND PRODUCTION METHOD FLAT Ni PARTICLE - Provided is a flat Ni particle which has a large specific surface area, permitting efficient binder removal when the flat Ni particle is used for internal electrodes of a laminated ceramic electronic component. The flat Ni particle has a thickness t (m), a specific gravity ρ (g/m | 07-11-2013 |
20130176087 | ELASTIC WAVE FILTER - An elastic wave filter that prevents damage caused by ESD is constructed such that a distance between an electrode finger or a dummy electrode of a first IDT electrode and an adjacent electrode finger or an adjacent dummy electrode of a fourth comb-shaped electrode, which is a floating electrode that is not connected to any of an input terminal, output terminals, and a ground terminal, is longer than a distance between the electrode finger or the dummy electrode of the first IDT electrode and an adjacent electrode finger or an adjacent dummy electrode of a third comb-shaped electrode, which is connected to the input terminal, the output terminal, or the ground terminal. | 07-11-2013 |
20130176184 | WIRELESS COMMUNICATION DEVICE - A wireless communication device includes a flexible base material film, a flexible antenna conductor that is provided in substantially the entire region of one main surface of the flexible base material film and that includes a first radiation element and a second radiation element facing each other through a slit, an inductor substrate that is connected to the first radiation element and the second radiation element so as to extend across the slit, the inductor substrate including an inductance element, and a wireless IC element that is connected in parallel to the inductance element and that is mounted in the inductor substrate. The wireless IC element is connected to the first radiation element and the second radiation element so as to extend across the slit. | 07-11-2013 |
20130176915 | HIGH-FREQUENCY MODULE - A compact high-frequency module that increases isolation between a transmission-side circuit and a reception-side circuit of a duplexer includes a switch element and duplexers. The duplexers include transmission-side SAW filters and reception-side SAW filters. The transmission-side SAW filters are mounted near one edge of a multilayer body. The reception-side SAW filters are mounted near another edge opposite to the one edge of the multilayer body. The switch element is mounted at the center of the multilayer body | 07-11-2013 |
20130176916 | HIGH-FREQUENCY MODULE - A small high-frequency module has a structure such that a high-power signal is prevented from leaking to a switch device. On the top surface of a multilayer body, a switch device and a duplexer are mounted so as to be spaced apart from each other by a predetermined distance. An inductor and resistors connected to a circuit different from a transmission system circuit are mounted between the switch device and the duplexer. The inductor and the resistors are mounted such that external connection terminals connected to the switch device are on the switch device side and external connection terminals connected to external connection power system port electrodes of the high-frequency module are on the duplexer side. | 07-11-2013 |
20130178752 | VALVE, FLUID CONTROL DEVICE - In a fluid control device, a check valve includes a first valve housing and a first diaphragm. The first diaphragm defines a first valve chamber and a second valve chamber. An exhaust valve includes a second valve housing and a second diaphragm. The second diaphragm defines a third valve chamber and a fourth valve chamber. The check valve is opened and closed by a difference in pressure between the first valve chamber and the second valve chamber. The exhaust valve is opened and closed by a difference in pressure between the third valve chamber and the fourth valve chamber. | 07-11-2013 |
20130181578 | Piezoelectric Power Generator - A piezoelectric power generator that includes a first elastic body, which deforms along a first direction x upon receiving a stress, and a piezoelectric power-generating element. A second elastic body is arranged on a y1 side of the first elastic body and a piezoelectric element is fixed to a y1-side surface of the second elastic body. When the first elastic body bends into a shape that is concave toward the y1 side, the second elastic body receives a stress from the first elastic body. When the first elastic body bends into a shape that is convex toward the y1 side, the second elastic body does not receive a stress from the first elastic body. The piezoelectric power generator further includes a vibration suppressing member that is arranged between the first elastic body and the second elastic body and suppresses bending mode vibration of the second elastic body. | 07-18-2013 |
20130181876 | ANTENNA DEVICE AND COMMUNICATION TERMINAL APPARATUS - An antenna device that includes coil antennas each having a coil conductor wound around a winding axis and a planar conductor including a surface and an edge end portion, the surface extending along the winding axis of the coil conductor, the edge end portion being adjacent to a coil opening of the coil conductor. A current flowing through the coil conductor induces a current in the planar conductor, this current produces a magnetic flux in a direction normal to the planar conductor, and thus the planar conductor acts as a booster antenna. The antenna device has directivity in the direction normal to the planar conductor because the magnetic flux produced by the coil antennas and that produced by the planar conductor are combined. This enables the antenna device to occupy a small area while achieving a predetermined communication distance. | 07-18-2013 |
20130182480 | AC POWER SUPPLY APPARATUS - In an AC power supply apparatus, first and second switching circuits connected in series to an input terminal to which a DC input power supply is connected include first and second rectification elements, respectively. A capacitor, an inductor, and a capacitive load are equivalently connected in series to the second switching circuit. The capacitor is charged after the first switching circuit is turned on before the second rectification element is turned off and the charged capacitor is caused to discharge after the second switching circuit is turned on before the second rectification element is turned off. The above operations are periodically repeated. The voltage of the capacitive load is reversed with current flowing during the charge and the discharge of the capacitor to adjust the on and off periods of the first and second switching circuits in order to supply desired AC voltage to the capacitive load. | 07-18-2013 |
20130186961 | WIRELESS COMMUNICATION DEVICE - A wireless communication device includes a wireless IC chip that processes a high-frequency signal and a feeding substrate including a coil conductor, a plane conductor, and a matching circuit that is connected to the wireless IC chip and that has a predetermined resonant frequency. The coil conductor and the plane conductor are connected to the matching circuit. The wireless communication device, when used by itself, operates as a monopole antenna in which the plane conductor functions as a ground and the coil conductor functions as a radiation element. When a conductive object is in a vicinity of the plane conductor, the plane conductor is coupled to the conductive object, and the wireless communication device operates as a dipole antenna in which the plane conductor and the conductive object function as a first radiation element and the coil conductor functions as a second radiation element. | 07-25-2013 |
20130187479 | ELECTRIC POWER TRANSMISSION SYSTEM AND POWER TRANSMISSION DEVICE USED IN THE ELECTRIC POWER TRANSMISSION SYSTEM - An electric power transmission system that includes a power receiving device having a first coupling electrode and a power transmission device having a second coupling electrode, both the devices being coupled via an electrostatic field, and the power transmission device configured to transmit electric power to the power receiving device in a noncontact state. The power transmission device includes a third coupling electrode that is disposed at a distance from the second coupling electrode. The third coupling electrode has a potential higher than that of the second passive electrode and lower than that of the second active electrode. | 07-25-2013 |
20130187480 | DC-DC CONVERTER MODULE AND MULTI-LAYER SUBSTRATE - A DC-DC converter module includes a multi-layer substrate, a switching IC, and a coil. The multi-layer substrate includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals provided on the bottom surface. The switching IC switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil is arranged within the multi-layer substrate in a spiral shape with an axis extending in the substrate stacking direction. The bottom surface side end of the coil is connected to the input/output electrode of the switching IC. | 07-25-2013 |
20130187824 | IMPEDANCE CONVERTING CIRCUIT AND COMMUNICATION TERMINAL APPARATUS - An impedance converting circuit module includes a first matching circuit, a feeding-circuit-side matching circuit interposed between the first matching circuit and a feeding circuit, and an antenna-side matching circuit interposed between the first matching circuit and a radiating element. The feeding-circuit-side matching circuit performs impedance matching between a feeding port of the feeding circuit and the first matching circuit, and the antenna-side matching circuit performs impedance matching between a port of the radiating element and the first matching circuit. | 07-25-2013 |
20130194056 | ELECTRONIC COMPONENT - In an electronic component, a laminated body includes a plurality of insulator layers laminated on each other. First, second and third LC parallel resonators are loop-shaped LC parallel resonators that include via hole conductors extending in a z-axis direction and conductor layers provided on the insulator layers, and define a band pass filter. Loop planes of the first and third LC parallel resonators and a loop plane of the second LC parallel resonator are parallel to the z-axis direction and not parallel to each other. | 08-01-2013 |
20130194149 | WIRELESS COMMUNICATION DEVICE - A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate. | 08-01-2013 |
20130194714 | DIELECTRIC THIN FILM ELEMENT, ANTIFUSE ELEMENT, AND METHOD OF PRODUCING DIELECTRIC THIN FILM ELEMENT - A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer | 08-01-2013 |
20130194717 | DIELECTRIC CERAMIC, STACK CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THESE - A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba | 08-01-2013 |
20130194718 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor having excellent lifetime characteristics in a high-temperature loading test. It includes a laminated body including a plurality of stacked dielectric layers including crystal grain and crystal grain boundaries, and a plurality of internal electrodes and external electrodes. The laminated body contains, as its main constituent, a perovskite-type compound containing Ba and Ti and optionally Ca, and further contains a rare-earth element R, and Mn, Mg, V, and Si With respect to 100 parts by mol the Ti, the total parts by mol content (100×m) of Ba and Ca is 0.950≦m<1.000, the contents in terms of parts by mol is 0.3≦R≦2.5, 0.05≦Mn≦0.5, 0.5≦Mg≦2.0, 0.05≦V≦0.25, 0.5≦Si≦3.0, and further, the molar ratio x of Ca/(Ba+Ca) is 0≦x≦0.01, and the existence of the rare-earth element R in a position of 4 nm inner from a surface of the crystal grain is 20% or more. | 08-01-2013 |
20130199717 | METHOD FOR MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENTS - A ceramic green sheet laminate is produced by stacking ceramic green sheets, each including conductive films for forming first or second internal electrodes on a surface thereof. A first cutting step is performed in which the ceramic green sheet laminate is cut to form first and second end surfaces at which the first or second internal electrodes are exposed. A second cutting step is performed in which the ceramic green sheet laminate is cut to form first and second side surfaces at which the first and second internal electrodes are exposed. In the second cutting step, the ceramic green sheet laminate is pressed and cut by moving a cutting blade in a length direction or a width direction. | 08-08-2013 |
20130200162 | RFID CHIP PACKAGE AND RFID TAG - An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω. | 08-08-2013 |
20130200163 | WIRELESS IC DEVICE COMPONENT AND WIRELESS IC DEVICE - A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system. | 08-08-2013 |
20130200749 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer. | 08-08-2013 |
20130200989 | SEMICONDUCTOR CERAMIC ELEMENT AND METHOD FOR PRODUCING SAME - A semiconductor ceramic element includes an element main body where a PTC section including a semiconductor ceramic which has PTC characteristics and an NTC section including a semiconductor ceramic which has NTC characteristics are integrated by co-firing while suppressing interdiffusion. The element main body is formed in such a way that a PTC substrate is first obtained by firing a semiconductor ceramic material to serve as the PTC section at a predetermined temperature, and a paste containing a semiconductor ceramic material to serve as the NTC section is then applied or printed on the PTC substrate, followed by co-firing at a temperature lower than the predetermined temperature. | 08-08-2013 |
20130201600 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal. | 08-08-2013 |
20130201601 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal. | 08-08-2013 |
Patent application number | Description | Published |
20130207514 | ELASTIC WAVE DEVICE - An elastic wave device includes a piezoelectric substrate and an interdigital transducer electrode. The piezoelectric substrate includes a principal surface with a groove tapered in lateral cross section. The interdigital transducer electrode is arranged on the principal surface such that at least one portion thereof is located in the groove. The interdigital transducer electrode is a laminate including a first conductive layer, a second conductive layer, and a diffusion-preventing layer located between the first conductive layer and the second conductive layer and made of an oxide or nitride of Ti or Cr. | 08-15-2013 |
20130207740 | HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other. | 08-15-2013 |
20130208398 | METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR - A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces. | 08-15-2013 |
20130208402 | Laminated Ceramic Capacitor and Manufacturing Method Therefor - A laminated ceramic capacitor that includes a laminated body including dielectric ceramic layers having crystal grains and crystal grain boundaries, and including internal electrode layers. An external electrode is formed on a surface of the laminated body, and is electrically connected to the internal electrode layers exposed at the surface of the laminated body. The laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, and further including Mn, Sr, and Si. When the laminated body is dissolved, the Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, and the molar ratio of Mn to Sr is 0.3 or more and 3.2 or less. | 08-15-2013 |
20130209323 | OZONE GENERATING ELEMENT AND METHOD FOR MANUFACTURING OZONE GENERATING ELEMENT - An ozone generating element includes a laminated body including stacked dielectric layers. A discharge electrode is provided on a first of the dielectric layers. An induction electrode is provided on a second of the dielectric layers that is opposed to the discharge electrode with the first dielectric layer interposed therebetween. A protective layer is arranged on the first dielectric layer so as to cover the discharge electrode, and includes a glass ceramic. | 08-15-2013 |
20130213699 | SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced. | 08-22-2013 |
20130214049 | WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE - A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna. | 08-22-2013 |
20130214640 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device having high heat radiation performance is provided. A surface acoustic wave device includes a piezoelectric substrate, IDT electrodes, a cover, and wiring lines. The IDT electrodes are arranged on a main surface of the piezoelectric substrate. The cover is joined to the main surface. The wiring lines extend to join portions of the main surface and the cover. The cover is provided with through-holes facing the wiring lines, respectively. The surface acoustic wave device further includes under-bump metals arranged in the through-holes, respectively, and bumps arranged on the under-bump metals, respectively. In a plan view, each of the under-bump metals is provided in a region larger than a joint portion of each of the under-bump metals and the corresponding one of the bumps | 08-22-2013 |
20130214873 | ELASTIC WAVE DEMULTIPLEXER - In an elastic wave demultiplexer having excellent isolation characteristics, a first ground wiring electrode is connected to a second ground wiring electrode, via first ground via-hole electrodes. The first ground wiring electrode is connected to ground land electrodes via second ground via-hole electrodes. The second ground wiring electrode is connected to a ground terminal via third ground via-hole electrodes. The number of the first ground via-hole electrodes is greater than the number of the second ground via-hole electrodes and the number of the third ground via-hole electrodes. | 08-22-2013 |
20130214880 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including a plurality of insulator layers laminated on each other in a lamination direction. A first strip line resonator is provided within a first region in the laminated body. A second strip line resonator is provided within a second region in the laminated body. A third strip line resonator is provided within the first region in the laminated body, and in a planar view in a lamination direction, the third strip line resonator and the first strip line resonator sandwich therebetween the second strip line resonator. A coupling conductor capacitively couples the first strip line resonator and the third strip line resonator. | 08-22-2013 |
20130214891 | CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated. | 08-22-2013 |
20130216909 | ELECTRODE ACTIVE MATERIAL AND SECONDARY BATTERY - An electrode active material is based on an organic compound containing in the structural unit thereof a pyrazine structure bound to cycloalkane. The electrode active material and a secondary battery containing it have large energy density, outputting high power, and having excellent cycle characteristics with little reduction in capacity even after repetition of charging and discharging. | 08-22-2013 |
20130220696 | CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF - The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz | 08-29-2013 |
20130221209 | METHOD OF MEASURING CHARACTERISTICS OF SPECIMEN, AND FLAT-PLATE PERIODIC STRUCTURE - The present invention provides a measuring method comprising the steps of holding a specimen on a flat-plate periodic structure, applying a linearly-polarized electromagnetic wave to the periodic structure, and measuring characteristics of the specimen based on change of the electromagnetic wave scattered forward or backward by the periodic structure, wherein the periodic structure is structured such that plural unit structures having the same shape are two-dimensionally and periodically interconnected in a direction of one reference plane, the unit structure has at least one aperture penetrating therethrough in a direction perpendicular to the reference plane, the electromagnetic wave is applied from a direction perpendicular to the reference plane, and the unit structure has a shape that is not mirror-symmetric with respect to an imaginary plane orthogonal to a polarizing direction of the electromagnetic wave. | 08-29-2013 |
20130221475 | SEMICONDUCTOR CERAMIC AND RESISTIVE ELEMENT - Provided is a resistive element which has excellent inrush current resistance, and can suppress heat generation in a steady state. The resistive element has an element main body of a semiconductor ceramic in which the main constituent has a structure of R1 | 08-29-2013 |
20130221584 | THERMISTOR AND METHOD FOR MANUFACTURING THE SAME - An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired. | 08-29-2013 |
20130222077 | ELASTIC WAVE FILTER DEVICE - An elastic wave filter device includes first and second signal terminals, an inductor, and a ladder elastic wave filter unit. The elastic wave filter device includes an elastic wave filter chip provided with the ladder elastic wave filter unit and a wiring board. The wiring board includes a plurality of dielectric layers and a plurality of electrode layers alternately laminated. An inductor electrode and a ground electrode are arranged so as to not face each other via the dielectric layer. | 08-29-2013 |
20130222105 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion. | 08-29-2013 |
20130222956 | ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREFOR - The ESD protection device includes: opposed electrodes | 08-29-2013 |
20130222968 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic that includes a sintered body of BaTiO | 08-29-2013 |
20130222971 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol, the Si content n meets 0.5≦n≦10 in terms of parts by mol, the Mn content u meets 0.5≦u≦10 in terms of parts by mol, and the Al content w meets 0.02≦w≦4 in terms of parts by mol, m and n satisfying −0.4≦100(m−1)−n≦3.9. | 08-29-2013 |
20130222972 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic capacitor with a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces. | 08-29-2013 |
20130222973 | Laminated Ceramic Electronic Component and Manufacturing Method Therefor - A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes. | 08-29-2013 |
20130223038 | MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE - A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate. | 08-29-2013 |
20130223120 | METHOD AND APPARATUS FOR ACTIVE INRUSH CONTROL OF BOOST POWER STAGE - A power stage includes an input voltage source; an inductor including first and second windings, where the first winding is connected to the input voltage source and where the second winding is magnetically coupled to the first winding; an output capacitor; a first diode connected to the first winding; a second diode connected between the second winding and the output capacitor; a boost switch connected to the first winding; and a control switch connected between the first diode and the output capacitor. The control switch is arranged to actively control inrush current during start-up of the power stage. A method of controlling inrush current of a boost power stage includes actively controlling the inrush current of the power stage by controlling a control switch through which the inrush current during start-up flows. | 08-29-2013 |
20130223637 | Piezoelectric Speaker Device - A piezoelectric speaker device that includes an insulation layer having an electric insulation property formed on a user-side driving electrode, and flaw detection electrode lines formed on the insulation layer. If the flaw detection electrode lines are determined to be damaged due to the occurrence of a flaw, the driving voltage applied to the driving electrodes is lowered. In order to prevent electric-shock accidents, the driving voltage is lowered to below 42.4 V, preferably, and to 0 V, more preferably. | 08-29-2013 |
20130278350 | COMPOSITE COMPONENT - A circuit substrate on which a duplexer is mounted includes a substrate body. First, second and third external electrodes are provided on a first main surface of the substrate body. Fourth, fifth and sixth external electrodes are provided on a second main surface of the substrate body. First, second and third signal paths connect the first, second and third external electrodes to the fourth, fifth and sixth external electrodes, respectively. First and second ground conductors are embedded in the substrate body, and overlap with a mounting area so as to contain the mounting area where the duplexer is mounted, in a planar view seen from the z-axis direction. The first, second and third signal paths extend from the inside of the mounting area to the outside of the mounting area between the first main surface and the second ground conductor. | 10-24-2013 |
20130307372 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, during an isolation formation step, a supporting substrate has a piezoelectric thin film formed on its front with a compressive stress film present on its back. The compressive stress film compresses the surface on a piezoelectric single crystal substrate side of the supporting substrate, and the piezoelectric thin film compresses the back of the supporting substrate, which is opposite to the surface on the piezoelectric single crystal substrate side. Thus, the compressive stress produced by the compressive stress film and that produced by the piezoelectric thin film are balanced in the supporting substrate, which causes the supporting substrate to be free of warpage and remain flat. A driving force that induces isolation in the isolation formation step is gasification of the implanted ionized element rather than the compressive stress to the isolation plane produced by the piezoelectric thin film. | 11-21-2013 |
20130340527 | ACCELERATION SENSOR - An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion. | 12-26-2013 |
20140000368 | DYNAMIC SENSOR | 01-02-2014 |
20140020729 | THERMOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING SAME, AND COMMUNICATION DEVICE - A thermoelectric conversion element includes a p-type metal thermoelectric conversion material containing a metal as its main constituent, an n-type oxide thermoelectric conversion material containing an oxide as its main constituent, and a composite oxide insulating material containing a composite oxide as its main constituent. The p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material are directly bonded in a region of a junction plane between the p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material, and the p-type metal thermoelectric conversion material and the n-type oxide thermoelectric conversion material are bonded to each other with the composite oxide insulating material interposed therebetween so as to define a pn conjunction pair in the other region of the junction plane. A perovskite-type oxide is used as the n-type oxide thermoelectric conversion material. | 01-23-2014 |
20140036467 | CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A ceramic multilayer substrate includes stacked ceramic layers; internal conductors which are stacked with one of the ceramic layers therebetween, and are arranged such that at least a portion of the internal conductors overlap each other in a stacking direction; and a constraining layer which is arranged on a layer different from layers on which the internal conductors are located. The constraining layer overlaps, in the stacking direction, an internal conductor-overlapping region where at least two of the internal conductors overlapping each other in the stacking direction, has a planar area not more than twice the planar area of the internal conductor-overlapping region, and contains an unsintered inorganic material powder. The constraining layer has a planar area not more than one-half the planar area of the ceramic layers. The constraining layer is arranged so as to entirely cover the internal conductor-overlapping region. | 02-06-2014 |
20140070394 | SEMICONDUCTOR DEVICE - In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate. | 03-13-2014 |
20140071011 | ANTENNA - An antenna includes antenna coil having a magnetic-material core and a coil conductor. The antenna coil is arranged toward a side of a planar conductor, such as a circuit board. Of the coil conductor, a first conductor part close to a first main face of the magnetic-material core and a second conductor part close to a second main face of the magnetic-material core are provided such that the first conductor part is not over the second conductor part in view from a line in a direction normal to the first main face or the second main face of the magnetic-material core. In addition, a coil axis of the coil conductor is orthogonal to the side of the planar conductor. | 03-13-2014 |
20140117810 | BOUNDARY ACOUSTIC WAVE DEVICE - A boundary acoustic wave device includes an LiTaO | 05-01-2014 |
20140130319 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, a compressive stress film is formed on a back surface of a piezoelectric single crystal substrate opposite to a surface on an ion-implanted side. The compressive stress film compresses the surface on the ion-implanted side of the piezoelectric single crystal substrate. The compressive stress produced by the compressive stress film is applied to half of the piezoelectric single crystal substrate on the ion-implanted side with respect to the center line of the thickness of the piezoelectric single crystal substrate to prevent the piezoelectric single crystal substrate from warping. A supporting substrate is then bonded to the surface of a bonding film on the flat piezoelectric single crystal substrate. The joined body of the piezoelectric single crystal substrate and the supporting substrate is then heated to initiate isolation at the ion-implanted portion as the isolation plane. | 05-15-2014 |
20140138804 | HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS - A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals. | 05-22-2014 |
20140142447 | DETECTION CIRCUIT - An amplifier circuit includes first and second amplification units. A first detection electrode and a high impedance circuit are connected to the input terminal of the first amplification unit. A second detection electrode and a high impedance circuit are connected to the input terminal of the second amplification unit. The output terminals of the first and second amplification units output first and second output signals, and are connected to the input terminals of a differential amplifier circuit through coupling capacitors, respectively. The differential amplifier circuit operates a difference between the first and second output signals in a state where a direct-current component is omitted. | 05-22-2014 |
20140145798 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including insulating layers that are stacked on each other. First and second LC parallel resonators each include via hole conductors extending in a z-axis direction and loop shaped conductive layers provided on the insulating layers. The first and second LC parallel resonators define a band pass filter. A first loop plane of the first LC parallel resonator and a second loop plane of the second LC parallel resonator are parallel or substantially parallel to the z-axis direction, are parallel or substantially parallel to each other, and are overlapped with each other at at least a portion of the first loop plane and the second loop plane in a plan view from the direction perpendicular or substantially perpendicular to the first loop plane. The first loop plane protrudes from the second loop plane at the positive direction in the z-axis direction. | 05-29-2014 |
20140152122 | WIRELESS POWER TRANSMISSION SYSTEM, POWER TRANSMITTING DEVICE, AND POWER RECEIVING DEVICE - In a power transmitting device constituting a wireless power transmission system, a voltage generating circuit applies a voltage between an active electrode and a passive electrode. In a power receiving device, a voltage generated between an active electrode that is opposed to the active electrode, and a passive electrode that is opposed to or brought into contact with the passive electrode when the power receiving device is placed on the power transmitting device is inputted to a load circuit as a power supply voltage. Passive electrodes of the power transmitting device are provided to electrostatically shield the opposed active electrodes with respect to the earth. Consequently, a wireless power transmission system, a power transmitting device, and a power receiving device are configured so the potential of the power transmitting device and the power receiving device during power transmission is stabilized to thereby prevent malfunction of the power receiving device. | 06-05-2014 |