Patent application number | Description | Published |
20080296818 | FLUID-FILLED TYPE VIBRATION DAMPING DEVICE - A fluid filled type vibration damping device includes a first mounting member, a second mounting member, a main rubber elastic body, a flexible film, a partition member, a valve, a coil, a control-signals-generating circuit and a power amplifier circuit. The valve enables to switch the second orifice passage between an open state and a closed state. The second orifice passage communicates the pressure-receiving chamber and the equilibrium chamber with each other. The switch of the valve is performed by an electromagnetic force occurring by an electrical connection of the coil. Furthermore the control-signals-generating circuit is formed and disposed separately from the coil. The control-signals-generating circuit produces state switching control signals of the valve. Moreover the power amplifier circuit which supplies an electric-current to the coil by amplifying the state switching control signals, constitutes an actuator unit attached integrally to the coil, and is disposed separately from the control-signals-generating circuit. | 12-04-2008 |
20090008201 | Vibration damping device and manufacturing method thereof - A vibration damping device including a hollow housing having a fastening frame and a housing main body attached to the fastening frame for providing the hollow housing enclosing a mass member. With the housing main body inserted between top and base plate portions through an opening in the fastening frame, an urging force of a first spring projection is directed against the housing main body from one of the top base plate portions towards the other thereby holding the housing main body pressed against the other of the top and base plate portions, while an urging force of a second spring projection is directed against the housing main body towards the opening side from a back plate portion causing the housing main body to become engaged by a catch projection, for attaching the housing main body to the fastening frame and preventing it from slipping out through the opening of the fastening frame. | 01-08-2009 |
20090184447 | FLUID-FILLED TYPE VIBRATION DAMPING DEVICE - A Fluid-filled type vibration damping device, which is configured to be free from the necessity of supplying a continuous application of electricity to a coil so as to maintain a movable valve body in either an opened state or a closed state, is provided. The device includes a cam mechanism, which transmits a rotational drive force of a motor to the movable valve body in the form of a reciprocating drive force. In the device, a first rotation angle switch is connected to a first control switch in series relative to a motor coil, and a second rotation angle switch is connected to a second control switch in parallel relative to the first switch. The first rotation angle switch is turned on in a state of a first angular range θ | 07-23-2009 |
20100301530 | Fluid-filled type active vibration damping device and manufacturing method thereof - A fluid-filled type active vibration damping device including a vibration damping device main unit, an oscillation member, and an actuator. The actuator is constituted by an electromagnetic actuator having a stator that includes a coil fixed to a second mounting member while having a movable member linearly displaceable relative to the stator when the coil is energized. A shaft member is provided for connecting the movable member and the oscillation member with each other. A connecting portion is provided for attaching the shaft member to the movable member while permitting the shaft member to tilt as well as to undergo displacement in an axis-perpendicular direction with respect to the movable member. A displacement preventing portion is provided for fastening the movable member and the shaft member to each other by preventing tilt as well as displacement in the axis-perpendicular direction due to the connecting portion. | 12-02-2010 |
20110057367 | ACTIVE VIBRATION DAMPER AND METHOD OF MANUFACTURING ACTIVE VIBRATION DAMPER - An active vibration damper including: an inner shaft member provided to a movable member; an outer tube member provided to a stator; a pair of leaf springs elastically connecting axially both sides of the inner shaft member and the outer tube member so as to make a linear actuator operatable by itself; an elastic connecting rubber connecting the inner shaft member and the outer tube member; a mass body holding portion provided to the inner shaft member for holding an additional mass body that is disposed further outwardly than the elastic connecting rubber; and a housing having a structure dividable in an axial direction in which respective openings are secured to each other with an annular seal being interposed therebetween at an outer peripheral side of the elastic connecting rubber. | 03-10-2011 |
20110180980 | ACTIVE ANTIVIBRATION DEVICE AND MANUFACTURING METHOD FOR THE SAME - An active antivibration device which includes a main body, a mobile element which is elastically supported inside the main body and movable in an axial direction of the main body, and a coil which is disposed inside the main body and fixed to the main body. The mobile element includes a mobile axis body supported in the axial direction of the main body, and a first yoke, a permanent magnet and a second yoke which are held by the mobile axis body and disposed successively along an axial direction of the mobile axis body. The permanent magnet is magnetized in the axial direction of the mobile axis body and disposed between the first yoke and the second yoke. | 07-28-2011 |
20130089765 | ELECTRICITY ACCUMULATION DEVICE - An electricity accumulation device includes an electricity accumulation element, an outer jacket material configured to house the electricity accumulation element, and a deformation sensor disposed on an expansive surface of the outer jacket material. The deformation sensor includes a sensor membrane having a base material made of an elastomer or a resin and conductive fillers filling the base material, the sensor membrane being subjected to bending deformation along with expansion of the outer jacket material, and a pair of electrodes connected to the sensor membrane. A three-dimensional conductive path is formed in the sensor membrane through contact between the conductive fillers. An electric resistance is increased along with an increase in amount of deformation of the sensor membrane from a natural state. The electricity accumulation device senses expansion of the outer jacket material on the basis of variations in electric resistance along with bending deformation of the sensor membrane. | 04-11-2013 |
20130133435 | BENDING SENSOR - A bending sensor includes a high resistance layer; a low resistance layer having a crack and a lower electrical resistance than the high resistance layer in a state where the crack is closed; an insulating layer between the high and low resistance layers; and a plurality of electrode portions connecting electrically in parallel the high resistance and low resistance layers. In an OFF state where a bend amount is small, the crack is unlikely to open and a combined resistance of electrical resistances of the high resistance layer and the low resistance layer is output as OFF resistance from the plurality of electrode portions. In an ON state where the bend amount is large, the crack is likely to open and at least the electrical resistance of the high resistance layer is output as ON resistance higher than the OFF resistance from the plurality of electrode portions. | 05-30-2013 |
Patent application number | Description | Published |
20090255719 | WIRING BOARD AND CERAMIC CHIP TO BE EMBEDDED - A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom. | 10-15-2009 |
20100139090 | WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD - A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer. | 06-10-2010 |
20110018099 | COMPONENT-INCORPORATING WIRING BOARD - An objective is to provide a component-incorporated wiring substrate capable of solving a problem caused by an increase in length of wiring lines that connect a component and a capacitor. A component-incorporated wiring substrate | 01-27-2011 |
20110157763 | CAPACITOR FOR INCORPORATION IN WIRING BOARD, WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, AND CERAMIC CHIP FOR EMBEDMENT - A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body. | 06-30-2011 |