Patent application number | Description | Published |
20080298670 | Method and its apparatus for reviewing defects - As a result of the improvement in throughput of review SEMs, the volume of defect image data which are collected in a semiconductor mass production line becomes larger. In order to achieve efficiency in management (deletion, search, display, and the like) of the image data in response to the above circumstance, a review SEM according to the present invention is configured to judge the importance levels of defect images taken and the like from information such as the classification results of the defect images, the defect feature computed from the defect images, and the imaging states of the defect images and to provide each of the defect images with the importance level and the like as supplementary information so that a large quantity of image data is managed on the basis of the supplementary information. | 12-04-2008 |
20090084953 | Method and system for observing a specimen using a scanning electron microscope - It is intended to reduce the auto focusing time and to increase the stability in a case that a defect on a specimen that has been detected by an inspection apparatus is observed by using a scanning electron microscope. One or more regions to be used for auto focusing are set in an imaging region or its neighborhood on the basis of semiconductor design information. A target focusing position in the imaging region is determined by performing auto focusing using the thus-set regions. The determined target focusing position is used for low-magnification imaging and high-magnification imaging. An auto focusing mode that is suitable for each imaging region is selected on the basis of the semiconductor design information. | 04-02-2009 |
20090136121 | Defect review method and apparatus - A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained from the design data of the pattern, the systematic defect being caused due to a layout shape of the pattern, properties of a processor for forming the pattern, or the like. | 05-28-2009 |
20090252403 | METHOD AND ITS APPARATUS FOR REVIEWING DEFECTS - A method for reviewing a defect on a sample involves the steps of imaging a defect image containing the defect in first magnification by using an image acquisition unit, synthesizing a reference image not containing the defect from the defect image, comparing the defect image acquired with the reference image synthesized to detect a defect applicant, executing a processing for classifying the defect applicant into a defect and a normal portion and imaging only the portion identified as the detect in second magnification. The method makes it possible to specify a defect position without error from the image taken in the first magnification and to image the defect in the second magnification when a large number of defects are observed within a short time by using the image acquisition unit. | 10-08-2009 |
20090268959 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method. | 10-29-2009 |
20110261190 | DEFECT OBSERVATION DEVICE AND DEFECT OBSERVATION METHOD - A review SEM is provided with a means to store sets of images acquired using multiple imaging conditions or sets of images for which multiple imaging conditions are simulated using simulation, a means to store defect position information for each set of images, and a means to store information relating to imaging conditions and process time. A means to estimate predicted capture rate and throughput with the individual imaging conditions for the sets of images from the stored information, and a means to display the results thereof are additionally provided. | 10-27-2011 |
20110299760 | DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION APPARATUS - Provided is a defect observation apparatus capable of analyzing a structure such as an arrangement and a vertical relationship of a circuit pattern formed by using design information of a sample, creating a non-defective product image from a defect image based on the analysis results, and detecting a defect by comparative inspection. The defect observation apparatus is provided with a computing unit | 12-08-2011 |
20120093392 | REVIEWED DEFECT SELECTION PROCESSING METHOD, DEFECT REVIEW METHOD, REVIEWED DEFECT SELECTION PROCESSING TOOL, AND DEFECT REVIEW TOOL - The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S | 04-19-2012 |
20120257041 | METHOD FOR DEFECT INSPECTION AND APPARATUS FOR DEFECT INSPECTION - Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated. | 10-11-2012 |
20130070078 | METHOD AND DEVICE FOR TESTING DEFECT USING SEM - In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large. | 03-21-2013 |
20130108147 | INSPECTION METHOD AND DEVICE THEREFOR | 05-02-2013 |
20130114881 | METHOD AND APPARATUS FOR REVIEWING DEFECTS - Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method. | 05-09-2013 |
20130222574 | DEFECT CLASSIFICATION SYSTEM AND DEFECT CLASSIFICATION DEVICE AND IMAGING DEVICE - In a defect classification system using plural types of observation devices that acquire images having different characteristics, classification performance and operability of the system are improved. The a defect classification system includes plural imaging part that acquire images of an inspection target, a defect classification device that classifies the acquired images acquired by the plural imaging part, and a communication part that transmits data between the plural imaging devices and the defect classification device, in which the defect classification device includes an image storage part that stores the acquired image data acquired by the plural imaging part, an information storage part that stores associated information about the input image data, and a part for changing a processing method or a display method depending on the associated information. | 08-29-2013 |
20130294680 | IMAGE CLASSIFICATION METHOD AND IMAGE CLASSIFICATION APPARATUS - In an apparatus for automatically classifying an image picked up of a defect on a semiconductor wafer according to user defined class, when images picked up by a plurality of different observation apparatuses are inputted in a mixed manner, the defect image classification accuracy rate decreases due to image property differences corresponding to differences in the observation apparatuses. In an automatic image classification apparatus supplied with defect images picked up by a plurality of observation apparatuses, when preparing a recipe, image process parameters are adjusted and a classification discriminating surface is prepared for each observation apparatus. When classifying an image, the observation apparatus that picked up a defect image is identified based on accompanying information or the like of the image, and an image process and a classification process are performed by using the image process parameters and the classification discriminating surface corresponding to the observation apparatus that picked up the image. In order to efficiently adjust the image process parameters for each observation apparatus, appropriate image process parameters are automatically adjusted on the basis of an exemplified defect area. The image process parameters adjusted in a given observation apparatus may be used for setting the image process parameters for another observation apparatus. | 11-07-2013 |
20140037188 | DEFECT REVIEW METHOD AND APPARATUS - A candidate-defect classification method, including acquiring a scanning electron microscope image of a candidate defect detected on a sample including a pattern; computing a feature value of the candidate defect by processing the image; executing defect classification of the candidate defect as a pattern shape defect or another defect, by using the computed feature value; acquiring positional information contained in design data of the pattern regarding the candidate defect; and extracting a systematic defect from candidate defects classified as pattern shape defects, by comparing the positional information contained in the design data of the acquired candidate defect to positional information of a portion having a high probability of causing pattern formation failure, and that has been obtained from the design data of the pattern, or a systematic defect caused due to a layout shape of the pattern, or properties of a processor for forming the pattern. | 02-06-2014 |