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| 20100156559 | MILLIMETER WAVE TRANSMISSION LINE FOR SLOW PHASE VELOCITY - A grounding plate and a transmission line are provided in a stack of dielectric material layers. First transmission line portions having a first width are alternately interlaced with second transmission line portions having a second width in the transmission line. The second width is greater than the first width so that inductance of the transmission line is increased relative to a transmission line having a fixed width. Metal fins may be provided between the grounding plate and the transmission line in the stack of the dielectric material layers. The metal fins may be grounded to the grounding plate to increase capacitance between the transmission line and the grounding plate. The increase in the inductance and the capacitance per unit length between the transmission line and the grounding plate is advantageously employed to provide a reduced phase velocity for electromagnetic signal transmitted through the transmission line. A design structure for the transmission line structure is provided. | 06-24-2010 |
| 20110241796 | On-Chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structure - On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion. The wide portion extends toward the at least one ground. | 10-06-2011 |
| 20120096419 | METHODOLOGY ON DEVELOPING METAL FILL AS LIBRARY DEVICE AND DESIGN STRUCTURE - A methodology is provided on developing metal fill as a library device and, in particular, a method of generating a model of the effects (e.g., capacitance) of metal fills in an integrated circuit and a design structure. The method is implemented on a computing device and includes generating a model for effects of metal fill in an integrated circuit. The metal fill model is generated prior to completion of a layout design for the integrated circuit. | 04-19-2012 |
| 20120139667 | ON-CHIP HIGH PERFORMANCE SLOW-WAVE COPLANAR WAVEGUIDE STRUCTURES, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - On-chip high performance slow-wave coplanar waveguide structures, method of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and signal layer provided in a same plane as the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness. The wide portion extends toward the at least one ground. | 06-07-2012 |
| 20120139668 | ON-CHIP HIGH PERFORMANCE SLOW-WAVE MICROSTRIP LINE STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground. | 06-07-2012 |
| 20120193121 | HIGH PERFORMANCE ON-CHIP VERTICAL COAXIAL CABLE, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - A high performance on-chip vertical coaxial cable structure, method of manufacturing and design structure thereof is provided. The coaxial cable structure includes an inner conductor and an insulating material that coaxially surrounds the inner conductor. The structure further includes an outer conductor which surrounds the insulating material. Both the inner and outer conductors comprise a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by conductors. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface. | 08-02-2012 |
| 20120256678 | Variable Impedance Single Pole Double Throw CMOS Switch - A single pole double throw (SPDT) semiconductor switch includes a series connection of a first transmitter-side transistor and a first reception-side transistor between a transmitter node and a reception node. Each of the two first transistors is provided with a gate-side variable impedance circuit, which provides a variable impedance connection between a complementary pair of gate control signals. Further, the body of each first transistor can be connected to a body bias control signal through a body-side variable impedance circuit. In addition, the transmitter node is connected to electrical ground through a second transmitter-side transistor, and the reception node is connected to electrical ground through a second reception-side transistor. Each of the second transistors can have a body bias that is tied to the body bias control signals for the first transistors so that switched-off transistors provide enhanced electrical isolation. | 10-11-2012 |
| 20140059509 | METHODOLOGY ON DEVELOPING METAL FILL AS LIBRARY DEVICE - A methodology for developing metal fill as a library device and, in particular, a method of generating a model of the effects (e.g., capacitance) of metal fills in an integrated circuit and a design structure is disclosed. The method is implemented on a computing device and includes generating a model for effects of metal fill in an integrated circuit. The metal fill model is generated prior to completion of a layout design for the integrated circuit. | 02-27-2014 |
| 20140065817 | HIGH PERFORMANCE ON-CHIP VERTICAL COAXIAL CABLE, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - A high performance on-chip vertical coaxial cable structure, method of manufacturing and design structure thereof is provided. The coaxial cable structure includes an inner conductor and an insulating material that coaxially surrounds the inner conductor. The structure further includes an outer conductor which surrounds the insulating material. Both the inner and outer conductors comprise a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by conductors. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface. | 03-06-2014 |
| 20150054592 | ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERISTIC IMPEDANCE TUNING TECHNIQUE AND DESIGN STRUCTURES - A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance. | 02-26-2015 |
| 20150054595 | THREE DIMENSIONAL BRANCHLINE COUPLER USING THROUGH SILICON VIAS AND DESIGN STRUCTURES - A three dimensional (3D) branchline coupler using through silicon vias (TSV), methods of manufacturing the same and design structures are disclosed. The method includes forming a first waveguide structure in a first dielectric material. The method further includes forming a second waveguide structure in a second dielectric material. The method further includes forming through silicon vias through a substrate formed between the first dielectric material and the second dielectric material, which connects the first waveguide structure to the second waveguide structure. | 02-26-2015 |
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| 20100276809 | T-CONNECTIONS, METHODOLOGY FOR DESIGNING T-CONNECTIONS, AND COMPACT MODELING OF T-CONNECTIONS - T-connections, methodology for designing T-connections, and compact modeling of T-connections. The T-connections include an electrically conductive T-junction comprising a body and first, second and third integral arms projecting from mutually perpendicular sides of the body, each arm of the three integral arms having a same first width abutting the body and a same length extending away from the body; an electrically conductive step-junction comprising a first section having the first width and an integral and abutting second section having a second width, the second width different from the first width, the first section smoothly abutting and integral with the first arm of the T-junction; and wherein top surfaces of the T-junction and the step-junction are coplanar. | 11-04-2010 |
| 20100315181 | VERTICAL COPLANAR WAVEGUIDE WITH TUNABLE CHARACTERISTIC IMPEDANCE DESIGN STRUCTURE AND METHOD OF FABRICATING THE SAME - An on-chip vertical coplanar waveguide with tunable characteristic impedance, a design structure, and a method of making the same. An on-chip transmission line includes a signal line, an upper ground line spaced apart from and above the signal line, and a lower ground line spaced apart from and below the signal line. The signal line, the upper ground line and the lower ground line are substantially vertically aligned in a dielectric material. | 12-16-2010 |
| 20110043299 | Compact On-Chip Branchline Coupler Using Slow Wave Transmission Line - Branchline coupler structure using slow wave transmission line effect having both large inductance and large capacitance per unit length. The branchline coupler structure includes a plurality of quarter-wavelength transmission lines, at least one of which includes a high impedance arm and a low impedance arm. The high and low impedances are relative to each other. The high impedance arm includes a plurality of narrow cells and having an inductance of nL and a capacitance of C/n, and the low impedance arm includes a plurality of wide cells and having an inductance of L/n and capacitance of nC. The wide and narrow cells are relative to each other, and the wide and narrow cells are adjacent each other to form a signal layer having step discontinuous alternative widths. | 02-24-2011 |
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| 20090189725 | ON-CHIP INTEGRATED VOLTAGE-CONTROLLED VARIABLE INDUCTOR, METHODS OF MAKING AND TUNING SUCH VARIABLE INDUCTORS, AND DESIGN STRUCTURES INTEGRATING SUCH VARIABLE INDUCTORS - On-chip integrated variable inductors, methods of making and tuning an on-chip integrated variable inductor, and design structures embodying a circuit containing the on-chip integrated variable inductor. The inductor generally includes a signal line configured to carry an electrical signal, a ground line positioned in proximity to the signal line, and at least one control unit electrically coupled with the ground line. The at least one control unit is configured to open and close switch a current path connecting the ground line with a ground potential so as to change an inductance of the signal line. | 07-30-2009 |
| 20090249610 | METHODS OF FABRICATING COPLANAR WAVEGUIDE STRUCTURES - Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. Each of the second plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array. | 10-08-2009 |
| 20090251232 | COPLANAR WAVEGUIDE STRUCTURES AND DESIGN STRUCTURES FOR RADIOFREQUENCY AND MICROWAVE INTEGRATED CIRCUITS - Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is disposed between upper and lower arrays of substantially parallel shield conductors. Conductive bridges, which are electrically isolated from the signal conductor, are located laterally between the signal conductor and each of the ground conductors. Pairs of the conductive bridges connect one of the shield conductors in the first array with one of the shield conductors in the second array to define closed loops encircling the signal line. | 10-08-2009 |
| 20120313736 | ON-CHIP SLOW-WAVE THROUGH-SILICON VIA COPLANAR WAVEGUIDE STRUCTURES, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - On-chip high performance slow-wave coplanar waveguide through-silicon via structures, method of manufacture and design structures for integrated circuits are provided herein. The method includes forming at least one ground plane layer in a substrate and forming a signal layer in the substrate, in a same plane layer as the at least one ground. The method further includes forming at least one metal filled through-silicon via between the at least one ground plane layer and the signal layer. | 12-13-2012 |
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| 20110119190 | ANONYMOUS TRANSACTION PAYMENT SYSTEMS AND METHODS - Disclosed are methods, apparatus, systems, and non-transitory, tangible computer-readable media associated with use of transaction authorization codes to each of the parties involved in a buying and selling transaction. In various embodiments, the transaction authorization code(s) may be exchanged between parties, and once confirmed or validated, the transaction may be consummated. In one embodiment, the transaction authorization code may conceal personal and/or financial information about a party with whom the code is associated. In various embodiments, transaction authorization codes may be used on shared or separate devices. In various embodiments transaction authorization codes may be entered through web-based interfaces or using mobile devices. | 05-19-2011 |
| 20110270925 | SYSTEM TO SHARE CREDIT INFORMATION - Disclosed are methods, apparatuses, systems, and non-transitory computer-readable media associated with the use of a randomly generated reporting code unique to a party involved in a credit reporting exchange. In embodiments, once used, the reporting code may become unique to both parties (applicant and requestor) as well as the particular transaction between both parties. In embodiments, the reporting code or codes may be exchanged between the applicant and requestor, and once confirmed, credit information may be obtained by, or transmitted from, the requestor. In various embodiments, the reporting code may conceal the applicant's Social Security Number or other unique identifier(s) during the application process. If the applicant is approved for a transaction by the requestor (e.g., credit is issued), the requestor may use a reporting code to report information about the approved applicant. | 11-03-2011 |
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| 20110026869 | Sagnac Interferometric Switch Utilizing Faraday Rotation - A fiber-based, magneto-optic (MO) optical modulator or switch based on Sagnac interferometry is provided. The system uses a magneto-optic Faraday rotator (MOFR) to produce optical modulation with low magnetic fields. The Sagnac geometry allows for increased modulation at lower fields than traditional MO modulators. This switch uses the MOFR to create different states of polarization in counter-propagating waves, which results in interference at the output port. A magnetic field is used to control the amount of rotation in the state of polarization (SOP), and therefore, the ON-OFF extinction ratio. | 02-03-2011 |
| 20110267121 | APPARATUS AND METHOD FOR ALTERING THE PROPERTIES OF MATERIALS BY PROCESSING THROUGH THE APPLICATION OF A MAGNETIC FIELD - A system and method for altering the properties of a material by exposure of the material to a magnetic field is described herein. The method comprises generating a magnetic field; exposing a material to the magnetic field, and determining the optimum settings of the magnetic field parameters for the particular material. The magnetic field may be time varying or time invariant. Various properties of the magnetic field can be altered to determine the optimum settings for altering the material properties, including the amplitude, frequency, and waveform. In one embodiment, a method for improving the conductivity of a transmission line is provided, comprising: providing a high voltage electrical transmission line; temporarily installing a magnetic field generator along at least a portion of the transmission line; and generating a pulsed magnetic field around at least a portion of the transmission line using the magnetic field generator and simultaneously running a current through the transmission line. | 11-03-2011 |
| 20140262939 | APPARATUS AND METHOD FOR ALTERING THE PROPERTIES OF FUEL BY PROCESSING THROUGH THE APPLICATION OF A MAGNETIC FIELD - A system and method for altering the properties of a fuel by exposure of the fuel to a magnetic field is described herein. The method comprises generating a magnetic field; exposing a material to the magnetic field, and determining the optimum settings of the magnetic field parameters for the particular material. The magnetic field may be time varying or time invariant. Various properties of the magnetic field can be altered to determine the optimum settings for altering the fuel properties, including the amplitude, frequency, and waveform. In one embodiment, a method for improving the performance of a fuel is provided, comprising: providing a fuel line comprising fuel; installing a magnetic field generator along at least a portion of the fuel line; and generating a pulsed magnetic field around at least a portion of the fuel line using the magnetic field generator. | 09-18-2014 |
| 20140266023 | APPARATUS AND METHOD FOR ALTERING THE PROPERTIES OF A BATTERY BY PROCESSING THROUGH THE APPLICATION OF A MAGNETIC FIELD - A system and method for altering the properties of a battery by exposure of the battery to a magnetic field is described herein. The method comprises generating a magnetic field; exposing a battery to the magnetic field, and determining the optimum settings of the magnetic field parameters for the particular material. The magnetic field may be time varying or time invariant. Various properties of the magnetic field can be altered to determine the optimum settings for altering the material properties, including the amplitude, frequency, and waveform. In one embodiment, a method for improving the performance of a battery is provided, comprising: providing a battery; temporarily installing a magnetic field generator along at least a portion of the battery; and generating a pulsed magnetic field around at least a portion of the battery using the magnetic field generator and simultaneously running a current through the battery. | 09-18-2014 |
| 20150280433 | APPARATUS AND METHOD FOR ALTERING THE PROPERTIES OF MATERIALS BY PROCESSING THROUGH THE APPLICATION OF A MAGNETIC FIELD - A system and method for altering the properties of a material by exposure of the material to a magnetic field is described herein. The method comprises generating a magnetic field; exposing a material to the magnetic field, and determining the optimum settings of the magnetic field parameters for the particular material. The magnetic field may be time varying or time invariant. Various properties of the magnetic field can be altered to determine the optimum settings for altering the material properties, including the amplitude, frequency, and waveform. In one embodiment, a method for improving the conductivity of a transmission line is provided, comprising: providing a high voltage electrical transmission line; temporarily installing a magnetic field generator along at least a portion of the transmission line; and generating a pulsed magnetic field around at least a portion of the transmission line using the magnetic field generator and simultaneously running a current through the transmission line. | 10-01-2015 |
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| 20100033907 | Sealed circuit breaker - A sealed electrical enclosure used in hazardous locations for enclosing circuit breakers having a bottom housing and a top housing with a labyrinth seal or joint formed therebetween, the bottom housing adapted to receive one or more circuit breakers, a first metal bus extending from a point internal to the bottom housing through a first end wall to a point external thereto, and a second metal bus extending from a point internal to the bottom housing through a second end wall to a point external to thereto, where the first and second metal buses are adapted to contact first and second electrical terminals of a circuit breaker when placed within the bottom housing, and a first vent positioned on the top housing for dissipating pressure buildup, wherein the top housing is removably secured to the bottom housing to allow for removal and replacement of a circuit breakers within the housing. | 02-11-2010 |
| 20110176259 | Sealed Circuit Breaker - A sealed electrical enclosure used in hazardous locations for enclosing circuit breakers having a bottom housing and a top housing with a labyrinth seal or joint formed therebetween, the bottom housing adapted to receive one or more circuit breakers, a first metal bus extending from a point internal to the bottom housing through a first end wall to a point external thereto, and a second metal bus extending from a point internal to the bottom housing through a second end wall to a point external to thereto, where the first and second metal buses are adapted to contact first and second electrical terminals of a circuit breaker when placed within the bottom housing, and a first vent positioned on the top housing for dissipating pressure buildup, wherein the top housing is removably secured to the bottom housing to allow for removal and replacement of a circuit breakers within the housing. | 07-21-2011 |
| 20120281341 | Sealed Circuit Breaker - A sealed electrical enclosure used in hazardous locations for enclosing electrical components having a bottom housing and a top housing with a serrated joint formed therebetween, the bottom housing adapted to receive one or more electrical components, a first metal bus extending from a point internal to the bottom housing through a first end wall to a point external thereto, and a second metal bus extending from a point internal to the bottom housing through a second end wall to a point external to thereto, where the first and second metal buses are adapted to contact first and second electrical terminals of an electrical component when placed within the bottom housing, wherein the top housing is removably secured to the bottom housing to allow for removal and replacement of an electrical component within the housing. | 11-08-2012 |
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| 20090242604 | Cap assembly of a fastener-driving tool having switch mechanism incorporated therein for switching modes of operation of the fastener-driving tool - A fastener-driving tool is provided with a cap assembly which includes a switch mechanism that permits the tool to be operated in one of two firing modes of operation. The switch mechanism comprises a two-position switch mechanism such that when the switch mechanism is disposed at a first one of its two positions, the tool will be able to operate in a fully automatic continuous firing mode of operation so as to continuously fire fasteners into a substrate as long as the workpiece contact element and the trigger mechanism are disposed at their depressed positions, or alternatively, when the switch mechanism is disposed at the second one of the two positions, the tool can be operated in a one-shot firing mode such that the tool can only fire a single fastener, either in accordance with, for example, a sequential-firing mode of operation or a bump-firing mode of operation, until the trigger mechanism is released and again depressed. | 10-01-2009 |
| 20090266867 | FASTENER DRIVING TOOL AND WORKPIECE POSITIONING ATTACHMENTS - Attachments for a fastening tool are configured to position the fastening tool raceway for driving a fastener from the tool into a workpiece at a desired location. The attachments include work contact elements including a pair of surfaces for contact with two surfaces of the workpiece to properly position the tool raceway. | 10-29-2009 |
| 20120223120 | VALVE CAP FOR PNEUMATIC NAILER - A pneumatic nailer includes a tool housing enclosing a cylinder with a reciprocating drive piston, and having a trigger and a workpiece contact element both connected to a trigger valve. A valve cap is mounted to the housing and includes a cycle valve and a dump valve, each valve reciprocating in a respective valve chamber. The dump valve controls drive pressure for the drive piston, the cycle valve controls the return of the dump valve to allow piston return. The valve cap and the valves are constructed and arranged such that the piston is returned to a start position independent of positions of the trigger or the workpiece contact element. | 09-06-2012 |
