Patent application number | Description | Published |
20090008763 | SEMICONDUCTOR PACKAGE - A semiconductor package, which may include a structure of a semiconductor package having a minimized mounting area and height. The semiconductor package may include a board, a first package comprising at least one first semiconductor chip, and disposed on the board so as to be supported, a second package comprising at least one second semiconductor chip, and disposed on the board so as be supported, and a third package that comprises at least one third semiconductor chip, the third package having a cross-sectional area greater than a cross-sectional area of the first package, the third package being disposed on the first package and the second package so as to be supported, wherein the cross-sectional areas of the third package and the first package are taken along a plane parallel to the board. | 01-08-2009 |
20090026628 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 01-29-2009 |
20100227640 | Mobile terminal and operation control method thereof - A method of controlling a mobile terminal, and which includes receiving an blow signal corresponding to a blowing action into a microphone of the mobile terminal, and generating at least one of a visual effect and a vibration effect based on characteristics of the blow signal. | 09-09-2010 |
20110084396 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 04-14-2011 |
20110144497 | ULTRASONIC 3-DIMENSIONAL IMAGE RECONSTRUCTION METHOD AND ULTRASONIC WAVE SYSTEM THEREOF - Disclosed are systems and methods for reconstructing a three-dimensional ultrasound image. The method may include generating a two-dimensional image having various directivities in a frequency space based on plane wave data; manipulating the generated two-dimensional image to generate three-dimensional image data; and reconstructing a three-dimensional ultrasound image by performing an inverse fast Fourier transformation on the three-dimensional image data. The method may further include using a fast Fourier transformation, a lookup table, back-projection, filtering, de-noising, compressed sensing, and/or the projection-slice theorem. | 06-16-2011 |
20120157847 | ULTRASOUND SYSTEM AND METHOD FOR PROCESSING BEAM-FORMING BASED ON SAMPLING DATA - Embodiments of performing beam forming processing based on sampling data in an ultrasound system are disclosed. The ultrasound system includes an ultrasound data acquisition unit configured to form a receive signal based on an ultrasound signal reflected from a target object, perform an analog-to-digital conversion on the receive signal to form sampling data, select pixels, which the respective sampling data are used as pixel values thereof among the plurality of pixels, cumulatively assign the corresponding sampling data to the selected pixels and perform beam forming upon the cumulatively assigned sampling data for the respective pixels to form receive-focused data. | 06-21-2012 |
20120319290 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip. | 12-20-2012 |
20130165777 | ULTRASOUND SYSTEM AND METHOD FOR DETECTING VECTOR INFORMATION USING TRANSMISSION DELAYS - An ultrasound system and a method of detecting vector information with transmission delays are disclosed. In one embodiment, the ultrasound system includes: an ultrasound data acquisition unit configured to set at least two focal points and form ultrasound data corresponding to the respect two focal points by considering transmission delays to the respective focal points; and a processor configured to form vector information of a target object by using the ultrasound data. | 06-27-2013 |
20130165783 | PROVIDING MOTION MODE IMAGE IN ULTRASOUND SYSTEM - There are provided embodiments for providing a motion mode image corresponding to a motion of a target object. In one embodiment, by way of non-limiting example, an ultrasound system comprises: a user input unit configured to receive input information for setting a region of interest on a brightness mode image; and a processing unit configured to form the brightness mode image based on first ultrasound data corresponding to a target object and form vector information of the target object based on second ultrasound data corresponding to the target object, the processing unit being further configured to form a motion mode image including at least one of a brightness motion mode image and a color motion mode image based on the first ultrasound data and the vector information corresponding to the region of interest. | 06-27-2013 |
20130165792 | FORMING VECTOR INFORMATION BASED ON VECTOR DOPPLER IN ULTRASOUND SYSTEM - There are provided embodiments for transmitting ultrasound signals to a living body including a moving target object in at least one transmission direction, and receiving ultrasound echo signals from the living body in at least one reception direction to form vector information of the target object. In one embodiment, by way of non-limiting example, an ultrasound system comprises: an ultrasound data acquiring unit configured to transmit ultrasound signals to a living body including a moving target object in at least one transmission direction, and receive ultrasound echo signals from the living body in at least one reception direction to acquire ultrasound data; and a processing unit configured to form vector information of the target object based on ultrasound data corresponding to the at least one reception direction. | 06-27-2013 |
20130172747 | ESTIMATING MOTION OF PARTICLE BASED ON VECTOR DOPPLER IN ULTRASOUND SYSTEM - There are provided embodiments for estimating the motion of at least one particle by using vector Doppler. In one embodiment, by way of non-limiting example, an ultrasound system comprises: a processing unit configured to form vector information of a target object based on ultrasound data corresponding to the target object, form a plurality of Doppler mode images based on the vector information, set at least one particle on the Doppler mode images based on input information of a user, and estimate a motion of the at least one particle based on the vector information. | 07-04-2013 |
20130172755 | PROVIDING TURBULENT FLOW INFORMATION BASED ON VECTOR DOPPLER IN ULTRASOUND SYSTEM - There are provided embodiments for providing turbulent flow information based on vector Doppler. In one embodiment, by way of non-limiting example, an ultrasound system comprises: a processing unit configured to form vector information of a target object based on ultrasound data corresponding to the target object, the processing unit being further configured to form turbulent flow information for representing a degree of turbulent flow of the target object. | 07-04-2013 |
20130184586 | ULTRASOUND AND SYSTEM FOR FORMING AN ULTRASOUND IMAGE - An ultrasound system and a method of forming an ultrasound image by selectively extracting ultrasound data necessary for forming the ultrasound image from stored ultrasound data are disclosed. In one embodiment, an ultrasound system includes a storage unit configured to store ultrasound data acquired from an object; and a processor configured to selectively extract ultrasound data necessary for forming a target ultrasound image from the ultrasound data stored in the storage unit, and to form the target ultrasound image by using the extracted ultrasound data. | 07-18-2013 |