Michiyoshi
Michiyoshi Fuyama, Kakegawa JP
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20110307984 | New Guinea impatiens plant named 'SAKIMP021' - A New Guinea | 12-15-2011 |
Michiyoshi Matsumoto, Nagoya-Shi JP
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20130296523 | PROCESS FOR PRODUCING LIQUID CRYSTALLINE POLYESTER RESIN AND APPARATUS FOR PRODUCING LIQUID CRYSTALLINE POLYESTER RESIN - The present invention provides a process for producing a liquid crystalline polyester resin, wherein an acetylation reaction and an oligomerization reaction of raw materials are carried out in an acetylation reaction vessel, and then a deacetylation polycondensation of a liquid after the oligomerization reaction is carried out in a polycondensation reaction vessel, wherein the acetylation reaction vessel used is a vessel having an inner wall surface composed of an alloy containing 50% by mass or more of Ni and 10% by mass or more of Mo; and the inner wall surface of the acetylation reaction vessel is divided into three or more band-like zones arrayed in the height direction of the vessel, and the oligomerization reaction is carried out while maintaining the temperatures of each band-like zone in a particular relationship. | 11-07-2013 |
20130296524 | APPARATUS FOR PRODUCING AROMATIC POLYESTER AND PROCESS FOR PRODUCING AROMATIC POLYESTER - The present invention provides an apparatus for producing an aromatic polyester, comprising a reactor, a rectifying column, a distillation pipe for feeding distillate gas from the reactor to the rectifying column, and a liquid returning pipe for returning reflux liquid from the rectifying column to a reactor, wherein the ratio of (b) the inside diameter of pipe of the liquid returning pipe to (a) the maximum inside diameter of drum of the reactor, (b)/(a), is 0.012 to 0.12. The production apparatus has an efficient rectifying effect and is suitable for producing an aromatic polyester having an excellent heat resistance and color tone efficiently with good polymerizability and at low cost. | 11-07-2013 |
Michiyoshi Miyazaki, Tokyo JP
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20130276920 | CONTROL VALVE FOR A VARIABLE DISPLACEMENT COMPRESSOR - A control valve according to an embodiment includes a body having a valve hole and a guiding passage formed coaxially with the valve hole, an actuating rod, slidably supported along the guiding passage, which is provided with a valve element, a solenoid for applying the solenoidal force in an opening or closing direction of a valve section to the valve element via the actuating rod, and a seal section, provided between the actuating rod and the guiding passage, which houses a sealing member for restricting the leakage of refrigerant from a high pressure side to a low pressure side. The actuating rod and the guiding passage are configured such that the clearance, between the actuating rod and the guiding passage, which is at a higher-pressure side of the seal section is larger than the clearance which is at a lower-pressure side of the seal section. | 10-24-2013 |
Michiyoshi Nagashima, Nara JP
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20090035887 | SOLID-STATE IMAGE PICKUP ELEMENT, METHOD FOR MANUFACTURING SUCH SOLID-STATE IMAGE PICKUP ELEMENT AND OPTICAL WAVEGUIDE FORMING DEVICE - A solid-state imaging device of the present invention includes a base | 02-05-2009 |
20090127430 | COMPOUND-EYE IMAGING APPARATUS - A plurality of imaging optical lenses ( | 05-21-2009 |
20090160997 | IMAGING DEVICE - A plurality of lenses | 06-25-2009 |
20110141309 | IMAGING APPARATUS AND METHOD FOR PRODUCING THE SAME, PORTABLE EQUIPMENT, AND IMAGING SENSOR AND METHOD FOR PRODUCING THE SAME - A plurality of imaging regions are provided in one-to-one correspondence with a plurality of optical systems and are disposed on optical axes of the respective optical systems. Each imaging region has a plurality of pixels. The imaging apparatus further comprises an origin detecting means for detecting an origin of each imaging region, a pixel position specifying means for specifying positions of a plurality of pixels included in each imaging region using the origin as a reference, and a combination means for combining a plurality of images captured by the respective imaging regions. Thereby, it is possible to make a thin imaging apparatus capable of being easily assembled. | 06-16-2011 |
Michiyoshi Takano, Okaya-Shi JP
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20090035929 | Method of manufacturing semiconductor device - A method of manufacturing a semiconductor device includes: (a) forming an insulating layer having a contact hole on a semiconductor section in which an element is formed; (b) forming an electrode pad on the insulating layer so that a depression or a protrusion remains at a position at which the electrode pad overlaps the contact section; (c) forming a passivation film to have an opening on a first section of the electrode pad and to be positioned on a second section of the electrode pad; (d) forming a barrier layer on the electrode pad; and (e) forming a bump to be larger than the opening in the passivation film and to be partially positioned on the passivation film. The contact section is connected with the second section at a position within a range in which the contact section overlaps the bump while avoiding the first section of the electrode pad. | 02-05-2009 |
Michiyoshi Takano, Chino JP
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20090139085 | CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES - A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By pushing up on a tape substrate by a bonding stage, and applying suction to the tape substrate through a suction groove, boundary portions of a semiconductor chip mounting region are drawn into the suction groove, and curved sections are formed in the tape substrate at locations corresponding to edge sections of a semiconductor chip and inclined sections disposed in outer circumference sections of the curved sections are formed in the tape substrate. | 06-04-2009 |
Michiyoshi Takano, Okaya JP
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20100252829 | SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS - A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection. | 10-07-2010 |
Michiyoshi Yamashita, Tokyo JP
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20140094095 | POLISHING METHOD - A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate. | 04-03-2014 |