Patent application number | Description | Published |
20080236874 | DEVICES AND METHODS FOR PRODUCING ELECTRICAL CONDUCTORS - A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed. | 10-02-2008 |
20080245765 | ELECTRICAL CONTACTS - Certain embodiments are directed to methods, devices and systems designed to remove selected portions of a material to expose an underlying material or substrate. One or more electrical components may be coupled to the underlying substrate through an electrical contact. Kits and systems for producing electrical contacts are also provided. | 10-09-2008 |
20090025967 | METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS - Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described. | 01-29-2009 |
20090061169 | ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM - Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided. | 03-05-2009 |
20100139952 | FLUX FORMULATIONS - Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like. | 06-10-2010 |
20110318478 | PARTICLES AND INKS AND FILMS USING THEM - Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards. | 12-29-2011 |
20120114927 | SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME - Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput. | 05-10-2012 |
20140153203 | METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS - Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described. | 06-05-2014 |
20140186524 | SOLVENT SYSTEMS FOR METALS AND INKS - Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines. | 07-03-2014 |