Patent application number | Description | Published |
20090230265 | Mounting System for Photovoltaic Panels - A mounting system for mounting photovoltaic panels on a support structure. The mounting system comprises photovoltaic panel frames in which the photovoltaic panels are mounted, panel support rails, and mounting brackets or cross beams for supporting the panel support rails. The panel frames have inwardly extending panel frame extensions on their back side. The panel support rails are mounted on the support structure with either pivoting brackets or cross beams. In either case, the support rails have pairs of stationary clamps and movable clamps with clamp lips that engage the panel frame extensions of the panel frames. | 09-17-2009 |
20110048408 | Pressurized Solar Power System - Systems and methods for generating electrical power using a solar power system comprising pressurized pipes for transporting liquid water. The pressurized pipes flow through solar collectors which concentrate sunlight on the water flowing through the pipes. The pressurization in the pipes allows for the water flowing therethrough to absorb large quantities of energy. The pressurized and heated water is then pumped to a heat exchanger where the thermal energy is released to produce steam for powering a steam turbine electrical generator. Thereafter, the water is returned to the solar collectors in a closed loop to repeat the process. | 03-03-2011 |
20110094498 | Drainback Solar Water Heater - A solar water heater includes a drainback unit with a drainback reservoir and an anti-airlock conduit for assuring that working fluid in the solar collectors is consistently drained from the solar collectors into a drainback reservoir once circulation the working fluid in the solar collectors has stopped. The drainback unit also provides rapid startup by positioning the heat exchanger outside of the drainback reservoir and by positioning the inlet and outlet of drainback reservoir in close proximity to each other. | 04-28-2011 |
20120124998 | System and Method for Generating Steam Using a Solar Power Source in Conjunction with a Geothermal Power Source - System and method for generating electrical power using a solar power system comprising pressurized pipes for transporting liquid water in conjunction with a geothermal power source. The pressurized pipes flow through solar collectors which concentrate light on the water flowing through the pipes. The pressurization in the pipes allows for the water to absorb large quantities of energy. The pressurized and heated water is then pumped to a heat exchanger where the thermal energy is released to produce steam for powering a steam turbine electrical generator. Thereafter, the water is returned to the solar collectors in a closed loop to repeat the process. In conjunction with the solar power system, heated water from the geothermal power source is directed through a second pipe that also traverses the heat exchanger to assist in the production of steam for powering the turbine electrical generator. | 05-24-2012 |
20120199181 | Mounting System for Photovoltaic Panels - A mounting system for mounting photovoltaic panels on a support structure. The mounting system comprises photovoltaic panel frames in which the photovoltaic panels are mounted, panel support rails, and mounting brackets or cross beams for supporting the panel support rails. The panel frames have inwardly extending panel frame extensions on their back side. The panel support rails are mounted on the support structure with either pivoting brackets or cross beams. In either case, the support rails have pairs of stationary clamps and movable clamps with clamp lips that engage the panel frame extensions of the panel frames. | 08-09-2012 |
20130312411 | Pressurized Solar Power System - Systems and methods for generating electrical power using a solar power system comprising pressurized pipes for transporting liquid water. The pressurized pipes flow through solar collectors which concentrate sunlight on the water flowing through the pipes. The pressurization in the pipes allows the water flowing through the pipes to absorb large quantities of energy. The pressurized and heated water is then pumped to a heat exchanger coil where the thermal energy is released to produce steam for powering a steam turbine electrical generator. Thereafter, the water is returned to the solar collectors in a closed loop to repeat the process. | 11-28-2013 |
20140153913 | Solar Photovoltaic Water Heating System - A solar photovoltaic water heating system is disclosed having a photovoltaic solar panel array, a storage tank containing water to be heated, a resistance heating element in the water to be heated. The water heating system matches the load resistance of the resistance heating element to the power that is available from the photovoltaic solar panel array in order to maximum energy transferred to the water in the storage tank. | 06-05-2014 |
20140338729 | Mounting System for Photovoltaic Panels - A mounting system for mounting photovoltaic panels on a support structure. The mounting system comprises photovoltaic panel frames in which the photovoltaic panels are mounted, panel support rails, and mounting brackets or cross beams for supporting the panel support rails. The panel frames have inwardly extending panel frame extensions on their back side. The panel support rails are mounted on the support structure with either pivoting brackets or cross beams. In either case, the support rails have pairs of stationary clamps and movable clamps with clamp lips that engage the panel frame extensions of the panel frames. | 11-20-2014 |
Patent application number | Description | Published |
20090283082 | FAST-LOAD LID ASSEMBLY FOR PAINTBALL - A lid assembly for a paintball hopper is disclosed, which reduces the paintball reload time. The lid assembly has an outer ring dimensioned to fit over a loading opening of the paintball hopper. A barrier member, such as an elastic membrane or plurality of flanges, is disposed across the inner perimeter of the outer ring such that the loading opening is substantially sealed. Also, a securing member is provided for securing the outer ring to the paintball hopper. A paintball hopper formed with the lid assembly described above is disclosed as well. | 11-19-2009 |
20100231375 | INFORMATION DISPLAY AND COMMUNICATION SYSTEM FOR PAINTBALL - An information display and communication system for use with paintball equipment during a paintball game is provided. The information display and communication system includes a display unit disposed on a housing; a wireless communication unit provided in the housing for receiving information from a paintball marker system; and a controller provided in the housing for displaying the received information on the display unit. The system can be constructed as a portable unit or incorporated into the body of a paintball marker or paintball hopper. Ideally, the display unit includes a touch screen input unit for providing user interaction with the information unit. The wireless communication unit utilizes a short range communication protocol, such as Bluetooth, IR, etc. Additionally, a second wireless communication unit is included having a longer communication range for communicating with other information display and communication systems and players. | 09-16-2010 |
20120032799 | PAINTBALL GUN SYSTEM WITH RATE OF FIRE PAINTBALL MONITORING - A paintball gun includes a detector that detects the ejection of each paintball and a transmitter that transmits a signal to a remote location indicative of the ejection. The signal is used to determine if the paintball gun is ejecting paintballs at an unacceptable rate and in response, either a warning is generated, or a signal is sent back to inhibit the paintball gun. The signal from the transmitter may include a unique ID for the paintball gun. A command center can receive the signals and generate a statistical record of the operation of each paintball gun in a given playing field. | 02-09-2012 |
Patent application number | Description | Published |
20120179457 | CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS - Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture. | 07-12-2012 |
20120179463 | CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS - Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture. | 07-12-2012 |
20120179464 | CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS - Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture. | 07-12-2012 |
20120179469 | CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS - Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture. | 07-12-2012 |
20120179471 | CONFIGURABLE SPEECH RECOGNITION SYSTEM USING MULTIPLE RECOGNIZERS - Techniques for combining the results of multiple recognizers in a distributed speech recognition architecture. Speech data input to a client device is encoded and processed both locally and remotely by different recognizers configured to be proficient at different speech recognition tasks. The client/server architecture is configurable to enable network providers to specify a policy directed to a trade-off between reducing recognition latency perceived by a user and usage of network resources. The results of the local and remote speech recognition engines are combined based, at least in part, on logic stored by one or more components of the client/server architecture. | 07-12-2012 |
Patent application number | Description | Published |
20140036454 | BVA INTERPOSER - A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds. | 02-06-2014 |
20140167267 | METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS - A method for making an interconnect element includes depositing a thermally conductive layer on an in-process unit. The in-process unit includes a semiconductor material layer defining a surface and edges surrounding the surface, a plurality of conductive elements, each conductive element having a first portion extending through the semiconductor material layer and a second portion extending from the surface of the semiconductor material layer. Dielectric coatings extend over at least the second portion of each conductive element. The thermally conductive layer is deposited on the in-process unit at a thickness of at least 10 microns so as to overlie a portion of the surface of the semiconductor material layer between the second portions of the conductive elements with the dielectric coatings positioned between the conductive elements and the thermally conductive layer. | 06-19-2014 |
20140175654 | SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF - Microelectronic elements and methods of their manufacture are disclosed. A microelectronic element may include a substrate including an opening extending through a semiconductor region of the substrate, a dielectric layer cover a wall of the opening within at least a first portion of the opening, a first metal disposed within the first portion of the opening, a second metal disposed within a second portion of the opening. The second metal may form at least part of a contact of the microelectronic element. | 06-26-2014 |
20140179099 | METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING - Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects. | 06-26-2014 |
20140240938 | CARRIER-LESS SILICON INTERPOSER - An interposer can have conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component can include a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. Conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements. | 08-28-2014 |
20140264794 | LOW CTE INTERPOSER WITHOUT TSV STRUCTURE - A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element. | 09-18-2014 |
20140339702 | METAL PVD-FREE CONDUCTING STRUCTURES - Structures and methods of forming the same are disclosed herein. In one embodiment, a structure can comprise a region having first and second oppositely facing surfaces. A barrier region can overlie the region. An alloy region can overlie the barrier region. The alloy region can include a first metal and one or more elements selected from the group consisting of silicon (Si), germanium (Ge), indium (Id), boron (B), arsenic (As), antimony (Sb), tellurium (Te), or cadmium (Cd). | 11-20-2014 |
20140376200 | RELIABLE DEVICE ASSEMBLY - Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction. | 12-25-2014 |