Patent application number | Description | Published |
20130170109 | Mesh Structure Providing Enhanced Acoustic Coupling - A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). According to one aspect, mesh structures, such as mesh barriers, are formed to facilitate improved acoustic sealing in a space efficient manner. In one embodiment, a mesh barrier for an audio port can be reliably acoustically sealed (or coupled) with an audio chamber and/or outer device housing in a space efficient manner. A mesh barrier can serve to block undesired foreign substances from entry or further entry into an audio port and/or serve as a cosmetic barrier which obscures vision into an audio port. In one embodiment, a portion of a mesh structure can be provided with a substantially planar surface that facilitates improved acoustic sealing. | 07-04-2013 |
20130214450 | METHOD AND APPARATUS FOR MOLDING PARTS - A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold. | 08-22-2013 |
20130233611 | MOLDED EMI AND THERMAL SHIELD - One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction. | 09-12-2013 |
20130242150 | Electronic Device with Shape Memory Devices - An electronic device may be provided with shape memory structures. The shape memory structures may be used to form actuators for a camera shutter, an actuator for moving an optical filter, or other actuators in an electronic device. A camera shutter may have an opaque shutter member that is movable between a first position in which the shutter is closed and blocks light from a digital image sensor and a second position in which the shutter is open and allows light to reach the digital image sensor. The camera shutter may have an associated color filter structure. Shape memory wire may be configured to form a loop that heats upon application of a signal or may be configured to form a twisting or linear actuator. The camera shutter may be provided with a controllable aperture. | 09-19-2013 |
20130343015 | Electronic Devices With Printed Circuit Boards Having Padded Openings - An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes. | 12-26-2013 |
20130344712 | INTERCONNECTIONS BETWEEN FLEXIBLE AND RIGID COMPONENTS - A low-height connectorless interconnection system includes a first substrate, the first substrate having a first plurality of exposed portions of underlying circuit traces and a second substrate, the second substrate having a second plurality of exposed portions of underlying circuit traces. The system further includes a plurality of conductive formations formed on at least one of the first and second pluralities of exposed portions of underlying circuit traces and a clamping member arranged to join the first and second substrate such that the first and second pluralities of exposed portions of circuit traces are in severable electrical communication. | 12-26-2013 |
20140001022 | BUTTON STRUCTURES FOR ELECTRONIC DEVICES | 01-02-2014 |
20140002996 | Thermally Conductive Printed Circuit Board Bumpers | 01-02-2014 |
20140004294 | COMPONENTS WITH MATING SURFACES | 01-02-2014 |
20140029206 | EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES - Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device. | 01-30-2014 |
20140055915 | COMPLEMENTARY GROUND AND SUPPORT MEMBERS - A ground member of a personal electronic device includes a base and a first deflection arm formed of a portion of the base. The first deflection arm exposes a cutout portion of the base and is bent along a first bend line. The cutout portion is dimensioned to engage with a complementary dimensioned support member and the first deflection arm is configured to deflect and engage with the support member in response to insertion of the support member in the cutout portion. The ground member further includes a second deflection arm extending from the base and bent along a second bend line. | 02-27-2014 |
20140055961 | Printed Circuit Boards with Recesses - Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations. | 02-27-2014 |
20140063769 | Component Mounting Structures with Breakaway Support Tabs - Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations. | 03-06-2014 |
20140069789 | CYLINDRICAL ACTIVATION OF MENU BUTTONS - Cylindrical switch assemblies and methods of making the same are provided. Cylindrical switch assemblies can mitigate false presses by using switch assembly designs with vertically or near vertically mounted activation elements positioned around a perimeter of a button. The activation elements (e.g., switches) of the switch assemblies may be fixed to a vertical sidewall of a bracket and positioned such that a portion of the activation elements extend beneath the button. When the button is actuated by a user, the button activates the activation elements. Positioning multiple activation elements around the perimeter of the button ensures that the user can press anywhere on the button and still activate the activation elements. | 03-13-2014 |
20140070081 | Electronic Device With Light Sensor Alignment Structures - Electronic devices may include light sensors. The light sensors may include alignment features. The light sensors may be optically aligned with an aperture in an opaque structure. The opaque structure may be formed from an opaque material or a transparent material with an opaque coating. The light sensor may be mounted in a support structure that has been optically aligned with the aperture. The light sensor or the support structure may include extended portions that are transparent to ultraviolet light. Ultraviolet light may be transmitted through the extended portions to cure adhesive that attaches the light sensor or the support structure to the opaque structure. The light sensor may be optically aligned with the aperture by viewing the aperture through an opening in the support structure, by viewing the alignment features on the light sensor through the aperture or by gathering alignment data using the light sensor during alignment operations. | 03-13-2014 |
20140071594 | Components Having Breakaway Installation Handles - A component may be molded with an integral breakaway installation handle. The breakaway installation handle may be used to manipulate and maneuver the component during assembly operations and during component mounting operations. A technician may use the breakaway installation handle to mount the component to a fixture while applying adhesive, attaching a mesh, or performing other assembly operations on the component. Following assembly operations, the technician may use the breakaway installation handle to install the component in an electronic device. After installing the component in the electronic device, the technician may bend the breakaway installation handle with respect to the component until the breakaway installation handle breaks off from the component. Components having breakaway installation handles may be formed form an injection molding system in which mold cavities each receive molten plastic from a runner. Plastic that solidifies in each runner may form the breakaway installation handle for each component. | 03-13-2014 |
20140071597 | AFFINITY BOND LAYER - A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used. | 03-13-2014 |
20140071651 | Insert Molded Cowling Structures - Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion. | 03-13-2014 |
20140072759 | SYSTEMS AND METHODS FOR PROTECTION OF COSMETIC SURFACES AND OVERFLOW PREVENTION ON ELECTRONIC DEVICES - Systems and methods for protection of cosmetic surfaces on electronic devices and adhesive overflow prevention are provided. In particular, an assembly for protecting a cosmetic surface can include a heat activated adhesive, such as a heat active film adhesive (“HAF”), which can be used to secure a mesh to the cosmetic surface. In some embodiments, a protective layer having a center layer laminated between two layers of heat activated adhesive can be used to protect the cosmetic surface from scratches caused by the mesh. In some embodiments, one or more hot shoes can be used to cross-link the heat activated adhesives to the mesh and the cosmetic surface. Because the shape of a shoe can influence the flow of heat activated adhesives during cross-linking, different shoes can be selected in order to minimize overflow in certain locations in the assembly. | 03-13-2014 |
20140113475 | RETENTION KEY LOCK FOR BOARD-TO-BOARD CONNECTORS - Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled. | 04-24-2014 |
20140140018 | Flexible Printed Circuit Connector Protection Structures - Protection structures may be provided to protect connectors, printed circuits, and other internal device components from damage. Components may shift within a device if the device is unexpectedly dropped. Protection structures can shield printed circuit connectors and other structures so that component movement during a drop event does not dislodge a printed circuit connector or otherwise damage a device. A cowling can be used to hold a board-to-board connector or other connector together. The cowling may have a protruding portion that is bent to form a protective wall. Plastic structures may be molded onto the cowling to form protective walls. Protection structures for printed circuit connectors and other internal device components may be formed from spring-based structures that clip onto the edge of a printed circuit board. | 05-22-2014 |
20140140021 | Component Mounting Structure With Flexible Jumper - An electronic device contains electrical components. An electrical component is mounted to an electronic device housing using mounting structures. The mounting structures include a flexible printed circuit jumper having opposing ends with metal contact pads. Metal traces in the flexible printed circuit jumper form contact traces within openings in a solder mask layer. Solder in the openings may be used to connect the metal contact pads to the contact traces. A metal bracket may be screwed into the electronic device housing to mount the electrical component to the electronic device housing. The metal bracket may press the metal contact pads on one end of the jumper against mating contact terminals on the electrical component and may press the metal contacts on the other end of the jumper against mating contact pads on an additional printed circuit. | 05-22-2014 |
20140140533 | Electronic Device Having Components With Elastomeric Sealing Structures - An electronic device has a housing in which components are installed. The components contain audio components having audio ports and terminals. Elastomeric material is molded over the surface of an audio component so that the leads attached to the terminals protrude through the elastomeric material. The protruding portions of the leads are bent back to lie flush with the surface of the elastomeric material. The elastomeric material are configured to form elastomeric structures with an opening that is aligned with the audio port in a component. The housing of an electronic device has one or more openings that form an audio port. The opening in the elastomeric structures that are molded onto the audio component is aligned with the audio port in the housing and the audio port in the audio component. Mesh structures cover the audio port in the housing. | 05-22-2014 |
20140153211 | Electronic Device With Antenna Cable Bracket - An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure. | 06-05-2014 |
20140159989 | Adjustable Antenna Structures for Adjusting Antenna Performance in Electronic Devices - Adjustable antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member and other conductive antenna structures. The adjustable antenna structures may have a movable dielectric support. Multiple conductive paths may be formed on the dielectric support. The movable dielectric support may be installed within an electronic device housing so that a selected one of the multiple conductive paths is coupled into use to convey antenna signals. Coupling the selected path into use adjusts the position of an antenna feed terminal for the antenna feed and compensates for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance. | 06-12-2014 |
20140160684 | COOLING FOR ELECTRONIC COMPONENTS - Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board). | 06-12-2014 |
20140177180 | Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits - Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities. | 06-26-2014 |
20140177181 | Electromagnetic Interference Shielding Structures - Electrical components are mounted on a printed circuit in an electronic device housing. Shielding can structures may include a sheet metal shield can layer with a conductive gasket. The printed circuit may have an opening. A screw passes through the opening in the printed circuit and openings in the conductive gasket and sheet metal shield can layer to secure the shielding can structures to the housing. When secured, a lip in the gasket lies between the printed circuit substrate and the housing. The gasket may be formed from conductive elastomeric material. A shield can lid and a flexible printed circuit may be embedded within conductive elastomeric material that provides a thermal conduction path to dissipate heat from electrical components under the lid. Shield can members that are located on opposing sides of a bend in a flexible printed circuit substrate may be coupled by a conductive elastomeric bridging structure. | 06-26-2014 |
20140216903 | Switches and Switch Mounting Structures - An electronic device has circuitry mounted within an electronic device housing. The electronic device housing may have housing walls such as metal sidewalls. Openings are formed in an electronic device housing wall to accommodate buttons. A button may have a switch with a switch housing mounted to the housing wall. A movable button member that extends from the switch housing may protrude through a housing opening. Switch terminals are coupled to signal lines on structures such as flexible printed circuits. The switch terminals may be formed from portions of elongated switch leads supported by support structure that are mounted to the housing wall or may be formed on an inner surface of the switch housing. Support structures may be molded into engagement with features on a housing wall or may be mounted to a housing wall using a fastener such as a screw. | 08-07-2014 |
20140220320 | MOLDED PARTS - A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold. | 08-07-2014 |
20140339736 | TOOLING CONCEPTS FOR REDUCING SINK AND IMPROVING AS-MOLDED COSMETICS AND DRAWINGS - The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure. | 11-20-2014 |