Patent application number | Description | Published |
20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
20120105534 | INKJET PRINTING OF MICROFLUIDIC CHANNELS - A mechanism for fabricating microfluidic channels uses a three-dimensional inkjet printing unit to print the channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a hydrophobic material on a surface the substrate in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic material which hydrolyzes to form a hydrophilic material) and a photoacid generator (PAG) on the surface of the substrate in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMMA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. | 05-03-2012 |
20120179388 | SYSTEM, METHOD AND PROGRAM FOR EARLY DETECTION OF FAN FAILURE BY MONITORING GREASE DEGRADATION - A system for predicting a fan failure has a sensor to detect a gas emitted from grease in the fan. A concentration level of the emitted gas is indicative of grease degradation. The system also has circuitry coupled to the sensor to compare the level of the detected gas to a predetermined level. The system also has an alert apparatus coupled to the circuitry to generate an alert after the circuitry determines that the level of the detected gas exceeds the predetermined level. | 07-12-2012 |
20120182693 | REVERSIBLY ADHESIVE THERMAL INTERFACE MATERIAL - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 07-19-2012 |
20120187046 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 07-26-2012 |
20120261064 | THERMALLY REVERSIBLE CROSSLINKED POLYMER MODIFIED PARTICLES AND METHODS FOR MAKING THE SAME - Thermal insulating materials and methods of making the thermal insulating material generally include a plurality of thermally reversible crosslinked polymer modified particles. The thermally reversible crosslinked polymer modified particles include a polymer containing a plurality of a first functional group; and a modified particle having a plurality of pendent cross-linking agents containing a second functional group, wherein the first functional group and the second functional group are complementary reactants to a reversible cross-linking reaction. | 10-18-2012 |
20120279768 | Flame Retardant Filler - A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles. | 11-08-2012 |
20120327612 | CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads. | 12-27-2012 |
20130003295 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130003296 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130008183 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130010422 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130016472 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-17-2013 |
20130034739 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD TO ENABLE EASY REMOVAL OF ONE SUBSTRATE FROM ANOTHER FOR ENHANCED REWORKABILITY - An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and/or swells the TIM gap filler, thereby reducing the bond strength between the substrates. | 02-07-2013 |
20130045612 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 02-21-2013 |
20130089602 | ENCAPSULATED CHELATOR - An enhanced chelator includes a chelating agent and a volatile material encapsulated in a biologically benign microcapsule. The enhanced chelator possesses significantly improved shelf-life in aqueous biological buffer solutions because the chelating agent is encapsulated in the microcapsule and, therefore, separated from solution components with which the chelating agent would react. The enhanced chelator is activated at a predetermined elevated temperature defined by the boiling point of the volatile material. At this predetermined elevated temperature, the volatile material exerts a vapor pressure sufficient to rupture the microcapsule and thereby release the chelating agent from the microcapsule. In one embodiment, a manganese chelator such as ethylene glycol tetraacetic acid (EGTA) is solubilized in ethanol and encapsulated in a poly(lactic-co-glycolide) (PLGA) microsphere. Upon heating to 80° C., ethanol boils within the PLGA microsphere and undergoes several orders of magnitude volume change, thereby rupturing the PLGA microsphere and releasing EGTA. | 04-11-2013 |
20130109565 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD | 05-02-2013 |
20130127069 | MATRICES FOR RAPID ALIGNMENT OF GRAPHITIC STRUCTURES FOR STACKED CHIP COOLING APPLICATIONS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip and a second chip electrically and mechanically coupled by a grid of connectors. The chip stack includes a thermal interface material (TIM) between the first chip and the second chip. The TIM includes nanofibers aligned parallel to mating surfaces of the first and second chips, and a thermosetting polymer that when heated, will reduce the viscosity of the TIM to allow for optimal alignment of the carbon nanofibers. The method includes adding at least one thermosetting polymer to the TIM, dispersing nanofibers into the TIM, and heating the TIM until the thermosetting polymer un-crosslinks. The method further includes applying a magnetic field to align the graphite nanofibers and cooling the TIM until the thermosetting polymer re-crosslinks. | 05-23-2013 |
20130130515 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 05-23-2013 |
20130187706 | TAMPER RESISTANT ELECTRONIC SYSTEM UTILIZING ACCEPTABLE TAMPER THRESHOLD COUNT - A tamper resistant electronic device includes multiple eFuses that are individually blown in each instance the electronic device is tampered with. For example an eFuse is blown when the electronic device is subjected to a temperature that causes solder reflow. Since it is anticipated that the electronic device may be tampered with in an acceptable way and/or an acceptable number of instances, functionality of the electronic device is altered or disabled only after a threshold number of eFuses are blown. In certain implementations, the threshold number is the number of anticipated acceptable tamper events. Upon a tamper event an individual eFuse is blown. If the total number of blown eFuses is less than the threshold, a next eFuse is enabled so that it may be blown upon a next tamper event. | 07-25-2013 |
20130192739 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 08-01-2013 |
20130206463 | NON-HALOGENATED FLAME RETARDANT FILLER - A non-halogenated flame retardant filler having phosphorous-modified inorganic particles imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. Phosphorous-modified silica particles, for example, may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a non-halogenated flame retardant filler comprised of phosphorous-modified silica particles. In an exemplary method of synthesizing phosphorous-modified silica particles, a vinyl-terminated phosphorous-based monomer (e.g., a phosphorous based flame retardant functionalized to contain a vinyl functional group) is reacted with vinyl functionalized silica particles (i.e., the silica particle surface is functionalized to contain a vinyl functional group). Alternatively, hydrosilated terminated silica particles may be reacted with a vinyl-terminated phosphorous-based monomer to produce phosphorous-modified silica particles. | 08-15-2013 |
20130252456 | Securing a Field Replaceable Unit - An assembly may have first and second components. The first component may include a first electrical connector and a guide member. The second component may include a second electrical connector to couple with the first electrical connector, and a receptacle to receive the guide member in a mated position. An adhesive may be provided between the guide member and the receptacle to form a bond between the guide member and the receptacle. The bond may be reversed when the adhesive is heated above a threshold temperature. A heating element to heat the adhesive may be provided. | 09-26-2013 |
20130263736 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 10-10-2013 |
20130291369 | FLEXIBLE-TO-RIGID TUBING - A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIL) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat. | 11-07-2013 |
20140041908 | FLAME RETARDANT FILLERS PREPARED FROM BRIDGED POLYSILSESQUIOXANES - A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler. | 02-13-2014 |
20140072777 | THERMALLY CROSS-LINKABLE PHOTO-HYDROLYZABLE INKJET PRINTABLE POLYMERS FOR MICROFLUIDIC CHANNELS - Thermally cross-linkable photo-hydrolyzable inkjet printable polymers are used to print microfluidic channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a mixture of hydrophobic polymer and cross-linking agent in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic polymer which hydrolyzes to form a hydrophilic material), cross-linking agent, and a photoacid generator (PAG) in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMAA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. The cross-linking agent (e.g., triallyl isocyanurate TAIC) forms covalent cross-links between the two polymer phases. | 03-13-2014 |
20140210136 | BINDING BISPHENOL A IN A POLYCARBONATE CONTAINER - Embodiments of the disclosure provide a method for removing residual BPA from a residual BPA-containing substance and a method for making a container with residual BPA removed. The method may consist of preparing a stabilization reagent, wherein water is removed from the stabilization reagent. The method may also include preparing the residual BPA-containing substance. The method may also include reacting the residual BPA-containing substance in a melt condensation process with the stabilization reagent, wherein the stabilization reagent is non-toxic. | 07-31-2014 |
20140215905 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD - Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the fertilizer. | 08-07-2014 |
20140221202 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD - Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl)trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the fertilizer. | 08-07-2014 |
20140221212 | MICROCAPSULES ADAPTED TO RUPTURE IN A MAGNETIC FIELD - Controlled release of one or more agricultural chemicals is provided by microcapsules adapted to rupture in a magnetic field. The microcapsules, which may be applied to soil, seeds and/or plants, each have a shell that encapsulates an agricultural chemical, such as a fertilizer, herbicide or insecticide. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. For example, (3-aminopropyl)trimethylsilane-coated magnetite nanoparticles may be incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. In one embodiment, microcapsules encapsulating a fertilizer are applied during seed planting. Controlled release is subsequently triggered after an appropriate period of dormancy by positioning a magnetic field generating device proximate the microcapsules to generate a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the fertilizer. | 08-07-2014 |
20140262192 | THERMALLY REVERSIBLE THERMAL INTERFACE MATERIALS WITH IMPROVED MOISTURE RESISTANCE - The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10 | 09-18-2014 |
20140273614 | ELECTRICAL CONNECTORS WITH ENCAPSULATED CORROSION INHIBITOR - According to embodiments of the invention, an electrical connector structure with an encapsulated corrosion inhibitor may be provided. The structure may include a first electrical connector having a first contact surface. The structure may also include an encapsulated corrosion inhibitor applied to at least a portion of the first contact surface. | 09-18-2014 |
20150031906 | FLAME RETARDANT FILLER - A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles. | 01-29-2015 |