Patent application number | Description | Published |
20090029133 | COATING OF A COSMETIC FINISH APPLIED TO A METALLIC SURFACE - Coating of a cosmetic finish applied to a metallic surface is provided to prevent the cosmetic finish from oxidizing and tarnishing. A clear adhesion promoting layer with a thickness of 5 to 10 microns is applied to the cosmetically finished metallic surface. A clear wear resistant layer with a thickness of 25 to 35 microns is subsequently applied over the clear adhesion promoting layer. In one variation, the metallic surface is first painted after which a portion of the painted surface is removed to expose the cosmetic finish. In another variation, the metallic surface has a raised portion representing e.g. a logo, emblem or other feature. In this case, the paint and a small amount of the metal substrate from the raised portion are removed to expose the cosmetic finish. | 01-29-2009 |
20090174994 | KEYBOARD FOR HAND HELD COMPUTING DEVICE - The keyboard assembly is suitable for use as a keyboard of a hand held computing device. The assembly has a base layer of a printed circuit board and includes a carrier layer having snap domes set out in an array aligned with keys of a keypad layer. An electroluminescent layer generates light in areas aligned with the keys to backlight the keys. An actuator layer having projections is aligned with the keys and snap domes. Pressing a key causes a snap dome to be deformed, closing a switch for the key and providing a snap action press and release feedback for the user. | 07-09-2009 |
20110241442 | CAPACITIVE DOME SWITCH - This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect. To protect the dome switch from damage due to contaminants, the terminal can be integrated within a volume of the circuit board such that it is not exposed to the environment of the dome switch. In one implementation, the terminal may not be exposed to air. | 10-06-2011 |
20120175165 | SYSTEMS AND METHODS FOR COUPLING SECTIONS OF AN ELECTRONIC DEVICE - This is directed to systems and methods for coupling sections of an electronic device together. Sections of an electronic device can be coupled together via “knuckles.” The particular shape and structure of the knuckles can be based on various design considerations. For example, in some embodiments each section can function as an individual antenna. In this case, the knuckles can be designed in order to provide electrical isolation between the sections, thus allowing proper operation of the antennas. For example, the knuckles can be formed from a dielectric material, etc. As another design example, the knuckles can be designed in order to provide increased strength in areas of high strain, and/or to counteract torsional twisting in areas of high impact. As yet another design example, the knuckle can be designed in a manner that is aesthetically pleasing or which otherwise meets cosmetic requirements. | 07-12-2012 |
20120212895 | LOW Z LINEAR VIBRATOR - A low Z linear vibrator is described well suited for use in small form factor portable devices such as a smartphone. The low Z vibrator can be configured to include a beam structure that can be attached to a vibratory mass and a low profile actuator. The low profile actuator can cause the vibratory mass to oscillate in a well-defined and predictable manner. | 08-23-2012 |
20130170109 | Mesh Structure Providing Enhanced Acoustic Coupling - A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). According to one aspect, mesh structures, such as mesh barriers, are formed to facilitate improved acoustic sealing in a space efficient manner. In one embodiment, a mesh barrier for an audio port can be reliably acoustically sealed (or coupled) with an audio chamber and/or outer device housing in a space efficient manner. A mesh barrier can serve to block undesired foreign substances from entry or further entry into an audio port and/or serve as a cosmetic barrier which obscures vision into an audio port. In one embodiment, a portion of a mesh structure can be provided with a substantially planar surface that facilitates improved acoustic sealing. | 07-04-2013 |
20130286609 | SYSTEMS AND METHODS FOR SHIELDING CIRCUITRY FROM INTERFERENCE WITH CONFORMAL COATING - Systems and methods for shielding circuitry from interference with conformal coating are disclosed. Systems having conformal EMI shields according to embodiments are provided by applying insulating and conductive layers to areas of a printed circuit board (PCB). This produces systems that may be thinner and also smaller in surface area, and that may be suitable as part of electronic devices. | 10-31-2013 |
20130342592 | INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELATED APPARATUS AND METHOD - An inkjet printer configured to print on a three-dimensional object is provided. The inkjet printer may include a print head that ejects a conductive ink. The inkjet printer may also include an assembly configured for adjusting a position of an object relative to the print head. The adjustment assembly may include a fixture configured to hold an object, such as a circuit board, that is to be printed on. The fixture may be configured to hold the object such that multiple surfaces thereof, which may be nonplanar, are exposed. A tilt adjustment mechanism may be coupled to the fixture and configured to adjust a tilt angle of the object. Further, a rotational adjustment mechanism may be coupled to the fixture and configured to adjust an angular position of the circuit board. Accordingly, the surfaces of the object may each be upwardly oriented such that the print head may print thereon. | 12-26-2013 |
Patent application number | Description | Published |
20130114228 | ELECTROMAGNETIC INTERFERENCE SHIELDING TECHNIQUES - Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed. | 05-09-2013 |
20130299331 | CAPACITIVE DOME SWITCH - This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect. To protect the dome switch from damage due to contaminants, the terminal can be integrated within a volume of the circuit board such that it is not exposed to the environment of the dome switch. In one implementation, the terminal may not be exposed to air. | 11-14-2013 |
20140043751 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-13-2014 |
20140160684 | COOLING FOR ELECTRONIC COMPONENTS - Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board). | 06-12-2014 |
20150050893 | Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly - Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria. | 02-19-2015 |
20150060110 | METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE - Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal. | 03-05-2015 |
20150062419 | CAMERA RELATED FEATURES OF A MOBILE PHONE OR COMPUTING DEVICE - This application relates primarily to various apparatus and method for securing and protecting a camera module within a device housing. The securing and protecting elements are configured to take up minimal space within the device housing so that available space for the camera module is maximized. In some embodiments the securing elements can also include grounding features. | 03-05-2015 |
20150062839 | METHOD AND SYSTEM FOR ATTACHING FLEXIBLE CIRCUITS TO A MOUNTING SURFACE - A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device. | 03-05-2015 |
20150135108 | DEVICE, METHOD, AND GRAPHICAL USER INTERFACE FOR MANIPULATING USER INTERFACES BASED ON FINGERPRINT SENSOR INPUTS - Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. While a display of an electronic device with a fingerprint sensor displays a first user interface, the device may detect movement of a fingerprint on the fingerprint sensor. In accordance with a determination that the movement of the fingerprint is in a first direction, the device allows navigating through the first user interface, and in accordance with a determination that the movement of the fingerprint is in a second direction different from the first direction, the device allows displaying a second user interface different from the first user interface on the display. | 05-14-2015 |
20150323966 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 11-12-2015 |
Patent application number | Description | Published |
20120177237 | AUDIO PORT CONFIGURATION FOR COMPACT ELECTRONIC DEVICES - A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). In one embodiment, a molded acoustic chamber can be formed to assist in directing audio sound between an opening an outer housing and an internal flexible electronic substrate. The audio element can be mounted on or coupled to the flexible electrical substrate over an opening therein that allows allow audio sound to pass there through. The molded acoustic chamber can also be formed such that it includes a barrier, such as a mesh barrier, so that undesired foreign substances can be blocked from entry or further entry into the audio chamber. The molded acoustic chamber can also be formed such that it includes one or more acoustic seals that can be used to provide an acoustic seal between the molded acoustic chamber and the opening in the outer housing. | 07-12-2012 |
20120198688 | APPARATUS AND METHOD FOR COVER GLASS REMOVAL - Improved techniques are disclosed for disassembly of portable electronic devices. A portable electronic device can have a portable device housing having a cover piece. The techniques can apply controlled forces to remove the cover piece from the portable device housing. The controlled forces can include rotational and/or translational forces. The techniques allow for removal of the cover piece with little or no damage to the portable electronic device. For example, the cover piece can pertain to a glass cover member (e.g., cover glass) that forms an outer part of a portable device housing. | 08-09-2012 |
20140071634 | Electronic Device Subassemblies - An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve. | 03-13-2014 |
20140308465 | Liquid-Based Pressure Sensitive Adhesive for Grounding Applications - An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths. | 10-16-2014 |
Patent application number | Description | Published |
20120176278 | ANTENNA STRUCTURES WITH ELECTRICAL CONNECTIONS TO DEVICE HOUSING MEMBERS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss. | 07-12-2012 |
20120176279 | STRUCTURES FOR FORMING CONDUCTIVE PATHS IN ANTENNAS AND OTHER ELECTRONIC DEVICE STRUCTURES - Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member. | 07-12-2012 |
20120176754 | ANTENNA STRUCTURES WITH ELECTRICAL CONNECTIONS TO DEVICE HOUSING MEMBERS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. The flex circuit can include a solder flow barrier to constrain flow of solder. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss. | 07-12-2012 |
20120178382 | ENGAGEMENT FEATURES AND ADJUSTMENT STRUCTURES FOR ELECTRONIC DEVICES WITH INTEGRAL ANTENNAS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness may be adjusted to adjust antenna performance. | 07-12-2012 |
20120178503 | RESONATING ELEMENT FOR REDUCING RADIO-FREQUENCY INTERFERENCE IN AN ELECTRONIC DEVICE - An electronic device may be provided with a display and wireless circuits. The wireless circuits may include antenna structures and radio-frequency transceiver circuitry that transmits and receives radio-frequency signals using the antenna structures. A ground plane for the antenna structures may be located in the center of the electronic device under the display. A resonating element may be used to reduce signal interference that otherwise arises when simultaneously operating the display and the antenna structures. The resonating element may be implemented using an L-shaped structure have an arm that extends parallel to one of the edges of the display. | 07-12-2012 |
20130231046 | Electronic Device With Shared Near Field Communications and Sensor Structures - An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment. | 09-05-2013 |
20140055961 | Printed Circuit Boards with Recesses - Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations. | 02-27-2014 |
20140078389 | Camera Accessory for Angled Camera Viewing - An electronic device may have front and rear surfaces. A front-facing camera may be formed on the front surface and a rear-facing camera may be formed on the rear surface. A display may be mounted on the front face of the electronic device. The cameras may nominally point along axes that run parallel to surface normals for the front and rear surfaces. A removable camera accessory with reflector structures may be mounted over a camera to deflect light and thereby point the camera in an off-axis direction. The removable camera accessory may be supported in a stand or other support structure. Magnetic structures and other structures may be used in coupling the electronic device to the support structures and may be used in coupling the camera accessory to the electronic device. | 03-20-2014 |
20140266926 | Engagement Features and Adjustment Structures for Electronic Devices with Integral Antennas - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance. | 09-18-2014 |
20140285386 | Structures for Forming Conductive Paths in Antennas and Other Electronic Device Structures - Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member. | 09-25-2014 |
Patent application number | Description | Published |
20080288701 | Method for protecting a connection interface in a computer-docking assembly - A method for protecting a connection interface in a computer-docking assembly comprising rotating at least partially a computer-support assembly about an arm assembly while moving the computer-support assembly toward a connection interface of the base station and while the arm assembly is at least partially rotating about the base station. The method for protecting additionally comprises aligning generally the computer-support assembly with the connection interface of the base station to posture the computer-support assembly in proximity to the interface connection of the base station for protecting the interface connection. A method for engaging a portable computer including moving away from a base station at least one engager member bound to a computer-support assembly. The base station and the computer-support assembly are rotatably connected to an arm assembly. The method for engaging additionally includes moving the computer-support assembly away from the base station while rotating about the arm assembly, and positioning the computer-support assembly in a posture for receiving a portable computer. The method for engaging further additionally includes disposing a portable computer in the computer-support assembly, and contacting at least one surface of the portable computer. | 11-20-2008 |
20100309134 | COMPUTER HAVING INTERLOCKING L-SHAPE COMPONENTS - A computer has a display, keyboard and two main component parts. The components each have an L-shape and are linked together to enable sliding movement in substantially one plane in a first direction. The linkage also enables movement orthogonally with respect to the first direction in another plane, such that the components transition from a closed position of the computer in which the components interfit together to form a first right rectangular prism and in which the display is exposed, to an open position having a second right rectangular prism shape in which the keyboard is exposed adjacent to and in the same plane as the display. | 12-09-2010 |
20110000071 | METHOD FOR PROTECTING A CONNECTION INTERFACE IN A COMPUTER-DOCKING ASSEMBLY - A method for protecting a connection interface in a computer-docking assembly in which a computer-support assembly is partially rotated about an arm assembly while moving the computer-support assembly toward a connection interface of the base station. The computer-support assembly is generally aligned with the connection interface of the base station to posture the computer-support assembly in proximity to the interface connection of the base station for protecting the interface connection. | 01-06-2011 |
20110038120 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-17-2011 |
20120057297 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 03-08-2012 |